# US 8,772,704 B2 · Method and system for a light source assembly supporting direct coupling to an integrated circuit > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,704 B2 - Document ID: US8772704B2 - Status: Granted - Kind: B2 - Application number: 13/894,052 - Filed: 2013-05-14 - Published: 2013-12-19 - Granted: 2014-07-08 - Earliest claimed: 2008-07-09 - Assignees: Luxtera, Inc. - Applicants: Luxtera, Inc. - Inventors: Michael Mack; Mark Peterson; Steffen Gloeckner; Adithyaram Narasimha; Roger Koumans; Peter De Dobbelaere - Web page: https://patentgrep.com/patent/US8772704B2 ## CPC - G02B 6/43: Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections - G02B 6/34: utilising prism or grating {(G02B6/293 takes precedence)} - G02B 6/4208: {using non-reciprocal elements or birefringent plates, i.e. quasi-isolators (optical isolators per se G02F1/093, G02F1/0955)} - G02B 6/4214: {the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device (G02B6/4246 takes precedence)} - G02B 26/105: {with one or more pivoting mirrors or galvano-mirrors (G02B26/101 takes precedence)} - H04B 10/503: {Laser transmitters} - G02B 6/305: {and having an integrated mode-size expanding section, e.g. tapered waveguide} - G02B 6/32: having lens focusing means {positioned between opposed fibre ends (with lens being an integral part of the single fibre end G02B6/262)} - H01S 5/005: {Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping (H01S5/026, H01S5/18388 take precedence)} - H01S 5/0064: {Anti-reflection components, e.g. optical isolators} - H01S 5/187: using Bragg reflection - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H04B: TRANSMISSION - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL ## Abstract Methods and systems for a photonically enabled complementary metal-oxide semiconductor (CMOS) chip are disclosed. The CMOS chip may comprise a laser, a microlens, a turning mirror, and an optical bench, and may generate an optical signal utilizing the laser, focus the optical signal utilizing the microlens, and reflect the optical signal at an angle defined by the turning mirror. The reflected optical signal may be transmitted into the photonically enabled CMOS chip, which may comprise a non-reciprocal polarization rotator, comprising a latching faraday rotator. The CMOS chip may comprise a reciprocal polarization rotator, which may comprise a half-wave plate comprising birefringent materials operably coupled to the optical bench. The turning mirror may be integrated in the optical bench and may reflect the optical signal to transmit through a lid operably coupled to the optical bench. ## Claims ### Claim 1 A system for processing signals, the system comprising: a photonically enabled complementary metal-oxide semiconductor (CMOS) chip comprising a laser, microlens, turning mirror, and an optical bench, said photonically enabled CMOS chip being operable to: generate an optical signal utilizing said laser; focus said optical signal utilizing said microlens; reflect said optical signal at an angle defined by said turning mirror; and transmit said reflected optical signal to one or more grating couplers in said photonically enabled CMOS chip. ### Claim 2 (depends on 1) The system according to claim 1, wherein said photonically enabled CMOS chip further comprises a non-reciprocal polarization rotator. ### Claim 3 (depends on 2) The system according to claim 2, wherein said non-reciprocal polarization rotator comprises a latching faraday rotator. ### Claim 4 (depends on 1) The system according to claim 1, wherein said photonically enabled CMOS chip further comprises a reciprocal polarization rotator. ### Claim 5 (depends on 4) The system according to claim 4, wherein said reciprocal polarization rotator comprises a half-wave plate. ### Claim 6 (depends on 5) The system according to claim 5, wherein said half-wave plate comprises a dielectric stack comprising one or more birefringent materials operably coupled to said optical bench. ### Claim 7 (depends on 1) The system according to claim 1, wherein said turning mirror is integrated in said optical bench. ### Claim 8 (depends on 7) The system according to claim 7, wherein said turning mirror reflects said optical signal to transmit through a lid operably coupled to said optical bench. ### Claim 9 (depends on 1) The system according to claim 1, wherein said turning mirror is integrated in a lid operably coupled to said optical bench. ### Claim 10 (depends on 1) The system according to claim 1, wherein said photonically enabled CMOS chip comprises two electro-thermal interfaces between said optical bench, said laser, and a lid operably coupled to said optical bench. ### Claim 11 (depends on 1) The system according to claim 1, wherein said microlens comprises a ball lens. ### Claim 12 (depends on 1) The system according to claim 1, wherein said laser comprises a semiconductor laser diode. ### Claim 13 (depends on 1) The system according to claim 1, wherein said laser comprises an edge emitting laser diode. ### Claim 14 (depends on 1) The system according to claim 1, wherein said optical bench functions as a mechanical support structure for one or more optical components of said photonically enabled CMOS chip and said reflected optical signal passes through said optical bench. ### Claim 15 (depends on 1) The system according to claim 1, wherein said optical bench comprises silicon. ### Claim 16 (depends on 1) The system according to claim 1, wherein one or more interposers are integrated in said photonically enabled CMOS chip. ### Claim 17 (depends on 16) The system according to claim 16, wherein said one or more interposers comprise metal pads integrated into said photonically enabled CMOS chip. ### Claim 18 (depends on 16) The system according to claim 16, wherein said one or more interposers comprise one or more polymer pads deposited on said photonically enabled CMOS chip. ### Claim 19 A system for processing signals, the system comprising: a photonically enabled complementary metal-oxide semiconductor (CMOS) chip comprising a laser, a microlens, a turning mirror, and an optical bench, said photonically enabled CMOS chip being operable to: generate an optical signal utilizing said laser; focus said generated optical signal utilizing said microlens; reflect said optical signal at an angle defined by said turning mirror; and transmit said reflected optical signal into said photonically enabled CMOS chip. ### Claim 20 (depends on 19) The system according to claim 19, wherein said photonically enabled CMOS chip further comprises a non-reciprocal polarization rotator. ### Claim 21 (depends on 20) The system according to claim 20, wherein said non-reciprocal polarization rotator comprises a faraday rotator. ### Claim 22 (depends on 20) The system according to claim 20, wherein said non-reciprocal polarization rotator comprises a latching faraday rotator. ### Claim 23 (depends on 19) The system according to claim 19, wherein said photonically enabled CMOS chip comprises two electro-thermal interfaces between said optical bench, said laser, and a lid operably coupled to said optical bench. ### Claim 24 (depends on 19) The system according to claim 19, wherein said turning mirror is integrated in said optical bench. ### Claim 25 (depends on 24) The system according to claim 24, wherein said turning mirror reflects said optical signal to transmit through a lid operably coupled to said optical bench. ### Claim 26 (depends on 19) The system according to claim 19, wherein said turning mirror is integrated in a lid operably coupled to said optical bench. ### Claim 27 (depends on 19) The system according to claim 19, wherein said microlens comprises a ball lens. ### Claim 28 (depends on 19) The system according to claim 19, wherein said laser comprises a semiconductor laser diode. ### Claim 29 (depends on 19) The system according to claim 19, wherein said laser comprises an edge emitting laser diode. ### Claim 30 (depends on 19) The system according to claim 19, wherein said optical bench functions as a mechanical support structure for one or more optical components of said photonically enabled CMOS chip and said reflected optical signal passes through said optical bench. ### Claim 31 (depends on 19) The system according to claim 19, wherein said optical bench comprises silicon. ### Claim 32 (depends on 19) The system according to claim 19, wherein one or more interposers are integrated in said photonically enabled CMOS chip. ### Claim 33 (depends on 32) The system according to claim 32, wherein said one or more interposers comprise metal pads integrated into said photonically enabled CMOS chip. ### Claim 34 (depends on 32) The system according to claim 32, wherein said one or more interposers comprise one or more polymer pads deposited on said photonically enabled CMOS chip. ### Claim 35 A system for processing signals, the system comprising: a photonically enabled complementary metal-oxide semiconductor (CMOS) chip comprising a laser, a microlens, a turning mirror, and an optical bench, said photonically enabled CMOS chip being operable to: generate an optical signal utilizing said laser; focus said generated optical signal utilizing said microlens; reflect said optical signal at an angle defined by said turning mirror; and transmit said reflected optical signal to one or more optical couplers in said photonically enabled CMOS chip. ### Claim 36 (depends on 35) The system according to claim 35, wherein said laser comprises a semiconductor laser diode. ### Claim 37 (depends on 35) The system according to claim 35, wherein said laser comprises an edge-emitting laser diode. ### Claim 38 (depends on 35) The system according to claim 35, wherein said photonically enabled CMOS chip further comprises a reciprocal polarization rotator. ### Claim 39 (depends on 38) The system according to claim 38, wherein said reciprocal polarization rotator comprises a half-wave plate. ### Claim 40 (depends on 39) The system according to claim 39, wherein said half-wave plate comprises a dielectric stack comprising one or more birefringent materials operably coupled to said optical bench. ### Claim 41 (depends on 35) The system according to claim 35, wherein said photonically enabled CMOS chip comprises two electro-thermal interfaces between said optical bench, said laser, and a lid operably coupled to said optical bench. ### Claim 42 (depends on 35) The system according to claim 35, wherein said turning mirror is integrated in a lid operably coupled to said optical bench. ### Claim 43 (depends on 35) The system according to claim 35, wherein said turning mirror is integrated in said optical bench. ### Claim 44 (depends on 43) The method according to claim 43, wherein said turning mirror reflects said optical signal to transmit through a lid operably coupled to said optical bench. ### Claim 45 (depends on 35) The system according to claim 35, wherein said microlens comprises a ball lens. ### Claim 46 (depends on 35) The system according to claim 35, wherein said one or more optical couplers comprise grating couplers. ### Claim 47 (depends on 35) The system according to claim 35, wherein said optical bench functions as a mechanical support structure for one or more optical components of said photonically enabled CMOS chip and said reflected optical signal passes through said optical bench. ### Claim 48 (depends on 35) The system according to claim 35, wherein said optical bench comprises silicon. ### Claim 49 (depends on 35) The system according to claim 35, wherein one or more interposers are integrated in said photonically enabled CMOS chip. ### Claim 50 (depends on 49) The system according to claim 49, wherein said one or more interposers comprise metal pads integrated into said photonically enabled CMOS chip. ### Claim 51 (depends on 49) The system according to claim 49, wherein said one or more interposers comprise one or more polymer pads deposited on said photonically enabled CMOS chip. ### Claim 52 A system for processing signals, the system comprising: a photonically enabled complementary metal-oxide semiconductor (CMOS) chip comprising a laser, a turning mirror, and an optical bench, said photonically enabled CMOS chip being operable to: generate an optical signal utilizing said laser; reflect said optical signal at an angle defined by said turning mirror; and transmit said reflected optical signal to one or more optical couplers in said photonically enabled CMOS chip. ### Claim 53 (depends on 52) The system according to claim 52, wherein said laser comprises a semiconductor laser diode. ### Claim 54 (depends on 52) The system according to claim 52, wherein said laser comprises an edge-emitting laser diode. ### Claim 55 (depends on 52) The system according to claim 52, wherein said laser comprises a feedback insensitive laser diode. ### Claim 56 (depends on 52) The system according to claim 52, wherein said photonically enabled CMOS chip comprises two electro-thermal interfaces between said optical bench, said laser, and a lid operably coupled to said optical bench. ### Claim 57 (depends on 52) The system according to claim 52, wherein said turning mirror is integrated in a lid operably coupled to said optical bench. ### Claim 58 (depends on 52) The system according to claim 52, wherein said turning mirror is integrated in said optical bench. ### Claim 59 (depends on 58) The system according to claim 58, wherein said turning mirror reflects said optical signal to transmit through a lid operably coupled to said optical bench. ### Claim 60 (depends on 52) The system according to claim 52, wherein said photonically enabled CMOS chip further comprises a microlens. ### Claim 61 (depends on 60) The system according to claim 60, wherein said microlens is operable to focus said generated optical signal. ### Claim 62 (depends on 52) The system according to claim 52, wherein said optical bench functions as a mechanical support structure for one or more optical components of said photonically enabled CMOS chip and said reflected optical signal passes through said optical bench. ### Claim 63 (depends on 52) The system according to claim 52, wherein said optical bench comprises silicon. ### Claim 64 (depends on 52) The system according to claim 52, wherein one or more interposers are integrated in said photonically enabled CMOS chip. ### Claim 65 (depends on 64) The system according to claim 64, wherein said one or more interposers comprise metal pads integrated into said photonically enabled CMOS chip. ### Claim 66 (depends on 64) The system according to claim 64, wherein said one or more interposers comprise one or more polymer pads deposited on said photonically enabled CMOS chip.