# US 8,772,646 B2 · Printed wiring board and method for manufacturing printed wiring board

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- Number: US 8,772,646 B2
- Document ID: US8772646B2
- Status: Granted
- Kind: B2
- Application number: 13/427,983
- Filed: 2012-03-23
- Published: 2012-10-04
- Granted: 2014-07-08
- Earliest claimed: 2011-03-29
- Assignees: Ibiden Co., Ltd.
- Applicants: Kazuyuki Ueda; Takema Adachi; Kazuhiro Yoshikawa
- Inventors: Kazuyuki Ueda; Takema Adachi; Kazuhiro Yoshikawa
- Web page: https://patentgrep.com/patent/US8772646B2

## CPC

- H05K 3/4608: {comprising an electrically conductive base or core}
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/685: comprising multiple insulating layers
- H10W 70/6875: {being on a metallic substrate, e.g. insulated metal substrates [IMS]}
- H10W 70/69: Insulating materials thereof
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H05K 3/0097: {Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence)}
- H05K 2201/09854: Hole or via having special cross-section, e.g. elliptical
- H05K 2203/0323: Working metal substrate or core, e.g. by etching, deforming
- H10W 70/635: {Through-vias}
- H10W 72/90: Bond pads, in general
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/49156: with selective destruction of conductive paths
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method for manufacturing a printed wiring board includes preparing a metal sheet having metal members and connectors joining the metal members, forming a structure having core substrates which are connected through the connectors and which have insulation structure portions covering the metal members, respectively, cutting the connectors in the structure such that an independent core substrate having a recessed portion is formed and a respective one of the connectors is removed from the independent core substrate, and covering the recess portion of the independent core substrate with a resin. The covering of the recess portion includes either forming an interlayer insulation layer on a surface of the independent core substrate or forming interlayer insulation layers on opposing surfaces of the independent core substrate.

## Claims

### Claim 1

A printed wiring board, comprising:
a core substrate having a first surface and a second surface on an opposite side of the first surface of the core substrate;
a first conductive circuit formed on the first surface of the core substrate;
a second conductive circuit formed on the second surface of the core substrate;
a through-hole conductor formed through the core substrate and connecting the first conductive circuit and the second conductive circuit;
a first interlayer insulation layer formed on the first conductive circuit; and
a second interlayer insulation layer formed on the second conductive circuit,
wherein the core substrate comprises an insulation structure and a metal member positioned inside the insulation structure, the metal member has a penetrating hole through which the through-hole conductor is passing through, the metal member has a recessed portion on a peripheral portion of the metal member, and the recessed portion is covered with a resin derived from at least one of the first interlayer insulation layer and the second interlayer insulation layer.

### Claim 2 (depends on 1)

The printed wiring board according to claim 1, wherein the insulation structure has a first insulation layer portion formed on one side of the metal member, a second insulation layer portion formed on an opposite side of the metal member, and a filling portion filling the penetrating hole, and the through-hole conductor is formed through a first opening portion formed in the first insulation layer portion, a second opening portion formed in the second insulation layer portion and a third opening portion formed in the filling portion.

### Claim 3 (depends on 2)

The multilayer printed wiring board according to claim 2, wherein the filling portion comprises a resin derived from at least one of the first insulation layer portion and the second insulation layer portion.

### Claim 4 (depends on 1)

The multilayer printed wiring board according to claim 1, wherein the metal member has a thickness of 20 μm to 100 μm.

### Claim 5 (depends on 1)

The multilayer printed wiring board according to claim 1, wherein the recessed portion of the metal member has an arc shape.

### Claim 6 (depends on 1)

The multilayer printed wiring board according to claim 1, wherein the metal member has at least one roughened surface which has Rz=2.0˜6.0 μm.

### Claim 7 (depends on 1)

The multilayer printed wiring board according to claim 1, wherein the metal member has a first roughened surface and a second roughed surface on an opposite side of the first roughened surface, and the first roughened surface has a roughness which is different for a roughness of the second roughened surface.

### Claim 8 (depends on 1)

The multilayer printed wiring board according to claim 1, wherein the metal member has a first roughened surface and a second roughed surface on an opposite side of the first roughened surface, the first roughened surface has Rz=3.5˜6.0 μm, and the second roughened surface has Rz=2.0˜3.0 μm.

### Claim 9 (depends on 1)

The multilayer printed wiring board according to claim 1, wherein the metal member forms one of a power source conductor layer and a ground conductor layer.

### Claim 10 (depends on 1)

The multilayer printed wiring board according to claim 1, wherein the through-hole conductor forms a signal line.

### Claim 11 (depends on 1)

The multilayer printed wiring board according to claim 1, wherein the metal member is made of one of copper and an Fe—Ni alloy.

### Claim 12 (depends on 1)

The multilayer printed wiring board according to claim 1, further comprising a plated film formed on a first surface of the metal member and a second surface of the metal member on an opposite side of the first surface of the metal member.

### Claim 13 (depends on 11)

The multilayer printed wiring board according to claim 11, wherein the plated film has a concavo-convex pattern on at least one of the first surface and second surface of the metal member.

### Claim 14 (depends on 2)

The multilayer printed wiring board according to claim 2, wherein the first opening portion tapers from a first surface of the core substrate toward a second surface of the core substrate on an opposite side of first surface of the core substrate, and the second opening portion tapers from the second surface of the core substrate toward the first surface of the core substrate.

### Claim 15 (depends on 2)

The multilayer printed wiring board according to claim 2, wherein the through-hole conductor comprises a plated film filling the first opening portion, the second opening portion and the third opening portion.