# US 8,772,644 B2 · Carrier with three-dimensional capacitor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,644 B2 - Document ID: US8772644B2 - Status: Granted - Kind: B2 - Application number: 13/644,709 - Filed: 2012-10-04 - Published: 2014-01-09 - Granted: 2014-07-08 - Earliest claimed: 2012-07-09 - Assignees: Chipbond Technology Corporation - Applicants: Chipbond Technology Corporation - Inventors: Chih-Ming Kuo; Lung-Hua Ho; You-Ming Hsu - Web page: https://patentgrep.com/patent/US8772644B2 ## CPC - H10W 20/496: {Capacitor integral with wiring layers} - H01G 4/01: Form of self-supporting electrodes - H05K 1/162: {incorporating printed capacitors} - H10D 1/714: {having horizontal extensions} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract A carrier with three-dimensional capacitor includes a substrate and a three-dimensional capacitor, wherein the substrate comprises a trace layer having a first terminal and a second terminal. The three-dimensional capacitor is integrally formed as one piece with the trace layer. The three-dimensional capacitor and the trace layer are made of same material. The three-dimensional capacitor comprises a first capacitance portion and a second capacitance portion, the first capacitance portion comprises a first section, a second section and a first passage, the second capacitance portion is formed at the first passage. The second capacitance portion comprises a third section, a fourth section and a second passage communicated with the first passage. The first capacitance portion is located at the second passage, a first end of the first capacitance portion connects to the first terminal, and a third end of the second capacitance portion connects to the second terminal. ## Claims ### Claim 1 A carrier with three-dimensional capacitor at least includes: a substrate having a surface and at least one trace layer formed on the surface, the at least one trace layer comprises at least one first terminal and at least one second terminal; and at least one three-dimensional capacitor integrally formed as one piece with the at least one trace layer, wherein the at least one three-dimensional capacitor and the at least one trace layer are made of a same material, the at least one three-dimensional capacitor comprises a first capacitance portion and a second capacitance portion having a polarity opposite to a polarity of the first capacitance portion, the first capacitance portion comprises a first end, a second end, at least one first section, at least one second section connected to the at least one first section and at least one first passage located between the at least one first section and the at least one second section, the second capacitance portion is formed at the at least one first passage and comprises a third end, a fourth end, at least one third section, at least one fourth section connected to the at least one third section and at least one second passage located between the at least one third section and the at least one fourth section, the at least one second passage is in communication with the at least one first passage, the first capacitance portion is located at the second passage, the first end corresponds to the third end and connects to the at least one first terminal, the third end connects to the at least one second terminal, wherein the at least one first section and the at least one third section are spaced apart from each other to define a first spacing, the at least one third section and the at least one second section are spaced apart from each other to define a second spacing, the at least one fourth section and the at least one second section are spaced apart from each other to define a third spacing. ### Claim 2 (depends on 1) The carrier with three-dimensional capacitor in accordance with claim 1, wherein the first spacing is equal to the second spacing. ### Claim 3 (depends on 1) The carrier with three-dimensional capacitor in accordance with claim 1 further includes an insulating layer formed at the at least one first passage and the at least one second passage, wherein the insulating layer is spiral-shaped. ### Claim 4 (depends on 1) The carrier with three-dimensional capacitor in accordance with claim 1 further includes an insulating layer formed at the at least one first passage and the at least one second passage, wherein the insulating layer is S-shaped. ### Claim 5 (depends on 1) The carrier with three-dimensional capacitor in accordance with claim 1, wherein the at least one trace layer comprises a first thickness, the first capacitance portion comprises a second thickness, the second capacitance portion comprises a third thickness, the second thickness and the third thickness are not smaller than the first thickness. ### Claim 6 (depends on 1) The carrier with three-dimensional capacitor in accordance with claim 1, wherein the at least one three-dimensional capacitor is comb-shaped. ### Claim 7 (depends on 1) The carrier with three-dimensional capacitor in accordance with claim 1, wherein the at least one three-dimensional capacitor is spiral-shaped. ### Claim 8 (depends on 5) The carrier with three-dimensional capacitor in accordance with claim 5, wherein the second thickness is the same as the third thickness. ### Claim 9 (depends on 1) The carrier with three-dimensional capacitor in accordance with claim 1, wherein the at least one first section and the at least one fourth section are spaced apart from each other to define a fourth spacing equal to the third spacing. ### Claim 10 (depends on 1) The carrier with three-dimensional capacitor in accordance with claim 1, wherein the third spacing is equal to the first spacing. ### Claim 11 (depends on 1) The carrier with three-dimensional capacitor in accordance with claim 1, wherein the material of the at least one trace layer is copper. ### Claim 12 (depends on 3) The carrier with three-dimensional capacitor in accordance with claim 3, wherein the material of the insulating layer is selected from one of Polyimide, Benzocyclobutene, ink, molding compound and underfill. ### Claim 13 (depends on 4) The carrier with three-dimensional capacitor in accordance with claim 4, wherein the material of the insulating layer is selected from one of Polyimide, Benzocyclobutene, ink, molding compound and underfill.