# US 8,772,431 B2 · Silanol condensation catalyst, heat-curable silicone resin composition for sealing photosemiconductors and sealed photosemiconductor using same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,431 B2 - Document ID: US8772431B2 - Status: Granted - Kind: B2 - Application number: 13/139,934 - Filed: 2009-12-08 - Published: 2011-10-13 - Granted: 2014-07-08 - Earliest claimed: 2008-12-16 - Assignees: The Yokohama Rubber Co., Ltd. - Applicants: Yoshihito Takei; Kazunori Ishikawa; Takeaki Saiki - Inventors: Yoshihito Takei; Kazunori Ishikawa; Takeaki Saiki - Web page: https://patentgrep.com/patent/US8772431B2 ## CPC - H10W 74/476: {Organic materials comprising silicon} - C08L 83/04: Polysiloxanes - H10K 30/88: Passivation; Containers; Encapsulations - C08G 77/16: to hydroxy groups - C08K 5/0091: {Complexes with metal-heteroatom-bonds} - C08K 5/098: Metal salts of carboxylic acids - C08K 5/5419: containing at least one Si—C bond - C08K 5/5425: containing at least one C=C bond - C08K 5/57: Organo-tin compounds - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10W 72/01515: {Forming coatings} - H10W 72/075: {of bond wires} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - Y02E 10/549: Organic PV cells - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION ## Abstract A silanol condensation catalyst including at least the zirconium metal salt expressed by Formula (I) below (wherein n is an integer from 1 to 3; each R1 is a hydrocarbon group having from 1 to 16 carbons; and each R2 is a hydrocarbon group having from 1 to 18 carbons.) A heat-curable silicone resin composition for sealing optical semiconductors includes 100 parts by mass of a polysiloxane containing two or more silanol groups in the molecule; from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy groups that are bonded to a silicon atom in the molecule; and a zirconium metal salt expressed by Formula (I). A sealed optical semiconductor is formed by sealing a LED chip by applying the heat-curable silicone resin composition to the LED chip, heating the LED chip, and curing the heat-curable silicone resin composition. ## Claims ### Claim 1 A heat-curable silicone resin composition for sealing optical semiconductors comprising: (A) 100 parts by mass of a polysiloxane containing two or more silanol groups in the molecule; (B) from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy groups that are bonded to a silicon atom in the molecule; and (C) a zirconium metal salt expressed by Formula (I): (wherein n is an integer from 1 to 3; each R1 is a hydrocarbon group having from 1 to 16 carbons; and each R2 is a hydrocarbon group having from 1 to 18 carbons); and the R 1 of Formula (I) is at least one selected from the group consisting of a cyclopropyl group, a cyclopentyl group, a cyclohexyl group, an adamanthyl group, and a naphthene ring. ### Claim 2 (depends on 1) The heat-curable silicone resin composition for sealing optical semiconductors according to claim 1, further comprising from 0.001 to 5 parts by mass of a quaternary tin compound containing an alkyl group and an acyl group per a total 100 parts by mass of the polysiloxane and the silane compound. ### Claim 3 (depends on 2) The heat-curable silicone resin composition for sealing optical semiconductors according to claim 2, wherein a content of the zirconium metal salt is from 0.001 to 5 parts by mass per the total 100 parts by mass of the polysiloxane and the silane compound. ### Claim 4 (depends on 1) The heat-curable silicone resin composition for sealing optical semiconductors according to claim 1, wherein a content of the zirconium metal salt is from 0.001 to 5 parts by mass per the total 100 parts by mass of the polysiloxane and the silane compound. ### Claim 5 (depends on 4) The heat-curable silicone resin composition for sealing optical semiconductors according to claim 4, further comprising from 0.001 to 5 parts by mass of a quaternary tin compound containing an alkyl group and an acyl group per a total 100 parts by mass of the polysiloxane and the silane compound. ### Claim 6 (depends on 1) The heat-curable silicone resin composition for sealing optical semiconductors according to claim 1, comprising a straight chain organopolydimethylsiloxane having a weight-average molecular weight of from 1,000 to 1,000,000, expressed by Formula (1) below, as the polysiloxane: where m is an integer from 10 to 15,000. ### Claim 7 (depends on 6) The heat-curable silicone resin composition for sealing optical semiconductors according to claim 6, wherein a content of the zirconium metal salt is from 0.001 to 5 parts by mass per the total 100 parts by mass of the polysiloxane and the silane compound. ### Claim 8 (depends on 1) The heat-curable silicone resin composition for sealing optical semiconductors according to claim 1, further comprising from 0.1 to 5 parts by mass of bis(alkoxysilyl)alkane per the total 100 parts by mass of the polysiloxane and the silane compound. ### Claim 9 (depends on 8) The heat-curable silicone resin composition for sealing optical semiconductors according to claim 8, comprising a straight chain organopolydimethylsiloxane having a weight-average molecular weight of from 1,000 to 1,000,000, expressed by Formula (1) below, as the polysiloxane: wherein m is an integer from 10 to 15,000. ### Claim 10 (depends on 1) A sealed optical semiconductor formed by sealing a LED chip by: applying a heat-curable silicone resin composition for sealing optical semiconductors described in claim 1 to the LED chip, heating the LED chip, and curing the heat-curable silicone resin composition for sealing optical semiconductors. ### Claim 11 A heat-curable silicone resin composition for sealing optical semiconductors comprising: (A) 100 parts by mass of a polysiloxane containing two or more silanol group in the molecule; (B) from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy group that are bonded to a silicon atom in the molecule; (C) a zirconium metal salt expressed by Formula (I): (wherein n is an integer from 1 to 3; each R1 is a hydrocarbon group having from 1 to 16 carbons; and each R2 is a hydrocarbon group having from 1 to 18 carbons); and from 0.1 to 5 parts by mass of bis(alkoxysilyl)alkane per the total 100 parts by mass of the polysiloxane and the silane compound. ### Claim 12 A sealed optical semiconductor formed by sealing a LED chip by: applying a heat-curable silicone resin composition for sealing optical semiconductors to the LED chip, the heat-curable silicone rein composition for sealing optical semiconductors comprising: (A) 100 parts by mass of a polysiloxane containing two or more silanol group in the molecule; (B) from 0.1 to 2,000 parts by mass of a silane compound containing two or more alkoxy group that are bonded to a silicon atom in the molecule; and (C) a zirconium metal salt expressed by Formula (I): (wherein n is an integer from 1 to 3; each R1 is a hydrocarbon group having from 1 to 16 carbons; and each R 2 is a hydrocarbon group having from 1 to 18 carbons), heating the LED chip, and curing the heat-curable silicone resin composition for sealing optical semiconductors.