# US 8,772,182 B2 · Semiconductor device having reinforced low-k insulating film and its manufacture method

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- Number: US 8,772,182 B2
- Document ID: US8772182B2
- Status: Granted
- Kind: B2
- Application number: 12/774,302
- Filed: 2010-05-05
- Published: 2010-08-26
- Granted: 2014-07-08
- Earliest claimed: 2006-02-24
- Assignees: Fujitsu Semiconductor Limited
- Applicants: Yoshiyuki Ohkura
- Inventors: Yoshiyuki Ohkura
- Web page: https://patentgrep.com/patent/US8772182B2

## CPC

- H10W 20/47: comprising two or more dielectric layers having different properties, e.g. different dielectric constants
- H10P 14/6506: {Formation of intermediate materials}
- H10P 14/6532: {by exposure to a plasma}
- H10P 14/6538: {by exposure to UV light}
- H10P 14/6548: {by forming intermediate materials, e.g. capping layers or diffusion barriers}
- H10W 20/071: {of dielectric parts thereof}
- H10W 20/095: {by irradiating with electromagnetic or particle radiation (plasma treatment H10W20/096)}
- H10W 20/096: {by contacting with gases, liquids or plasmas}
- H10W 20/425: {Barrier, adhesion or liner layers}
- H10W 20/48: Insulating materials thereof
- H10P 14/6342: {Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating}
- H10P 14/665: {Porous materials}
- H10P 14/6922: {the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC}
- H10W 20/084: {for dual-damascene structures}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor device manufacture method has the steps of: (a) coating a low dielectric constant low-level insulating film above a semiconductor substrate formed with a plurality of semiconductor elements; (b) processing the low-level insulating film to increase a mechanical strength of the low-level insulating film; (c) coating a low dielectric constant high-level insulating film above the low-level insulating film; and (d) forming a buried wiring including a wiring pattern in the high-level insulating film and a via conductor in the low-level insulating film. The low-level insulating film and high-level insulating film are made from the same material. The process of increasing the mechanical strength includes an ultraviolet ray irradiation process or a hydrogen plasma applying process.

## Claims

### Claim 1

A semiconductor device manufacture method comprising the steps of:
(a) forming a first insulating film of first porous silicon oxide, having a mechanical strength of a first value above a semiconductor substrate using spin-coating;
(b) processing said first insulating film to increase the mechanical strength of the first insulating film from the first value to a second value;
(c) after the step (b), forming a second insulating film of second porous silicon oxide, having a mechanical strength of a third value lower than the second value above said first insulating film using spin-coating; and
(d) forming a buried wiring including a wiring pattern in said second insulating film and a via conductor in said first insulating film.

### Claim 2 (depends on 1)

The method of manufacturing a semiconductor device according to claim 1, wherein said step (b) induces cross-linking reactions in said first insulating film.

### Claim 3 (depends on 1)

The method of manufacturing a semiconductor device according to claim 1, wherein said step (b) includes irradiating ultraviolet rays.

### Claim 4 (depends on 3)

The method of manufacturing a semiconductor device according to claim 3, wherein said ultraviolet rays contain a component having a wavelength in a range of 200 nm to 300 nm.

### Claim 5 (depends on 1)

The method of manufacturing a semiconductor device according to claim 1, wherein said step (b) includes processing by hydrogen plasma.

### Claim 6 (depends on 1)

The method of manufacturing a semiconductor device according to claim 1, wherein said steps (a) and (c) coat a same starting material for a porous insulating material.

### Claim 7 (depends on 1)

The method of manufacturing a semiconductor device according to claim 1, wherein said steps (a) and (c) include a step of baking the coated film at a plurality of gradually rising baking temperatures.

### Claim 8 (depends on 7)

The method of manufacturing a semiconductor device according to claim 7, wherein said step (b) is performed by heating the semiconductor substrate at a temperature equal to or higher than a highest one of said plurality of baking temperatures.

### Claim 9 (depends on 1)

The method of manufacturing a semiconductor device according to claim 1, further comprising the step of:
(e) forming a third insulating film formed of a material different from the first and second insulating films and functioning as an etch stopper on said first insulating film, between said steps (b) and (c),
wherein said step (d) includes the step of forming a via hole through said second insulating film to said first insulating film and the step of forming a wiring pattern trench at least in said second insulating film by using said third insulating film as the etch stopper.

### Claim 10 (depends on 1)

The method of manufacturing a semiconductor device according to claim 1, further comprising the step of:
(f) after said step (d), forming an insulating copper diffusion preventive film on said high-level insulating film, said insulating copper diffusion preventive film covering said buried wiring.