# US 8,772,176 B2 · Method for forming an adhesive layer and adhesive composition > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,176 B2 - Document ID: US8772176B2 - Status: Granted - Kind: B2 - Application number: 13/048,397 - Filed: 2011-03-15 - Published: 2011-10-27 - Granted: 2014-07-08 - Earliest claimed: 2010-04-23 - Assignees: Kyocera Chemical Corporation; Kabushiki Kaisha Toshiba - Applicants: Kazuyoshi Sakurai; Yuichi Noguchi; Norio Kurokawa; Yasuo Tane - Inventors: Kazuyoshi Sakurai; Yuichi Noguchi; Norio Kurokawa; Yasuo Tane - Web page: https://patentgrep.com/patent/US8772176B2 ## CPC - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - H10W 72/013: {of die-attach connectors} - H10W 72/073: {of die-attach connectors} - H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting} - H10W 72/354: {comprising polymers} - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract In a forming method of an adhesive layer including the steps of selectively coating, on a surface to be bonded, an adhesive composition containing a thermosetting composition and an organic solvent using a noncontact coating device; and removing the organic solvent from the adhesive composition coated on the surface to be bonded and in a forming method of an adhesive layer characterized in the thermosetting composition has a hardening property so as to exhibit two kinds of reaction temperatures, the adhesive composition comprising an epoxy resin and an epoxy curing agent which are reacted through a first hardening reaction exhibiting a first DSC peak within a temperature range of 100 to 160° C. and a second hardening reaction relating to a self-polymerization of the epoxy resin and exhibiting a second DSC peak within a temperature range of 140 to 200° C. ## Claims ### Claim 1 A method of forming an adhesive layer on a wafer, comprising: selectively coating, on a surface of the wafer to be bonded, an adhesive composition containing a thermosetting composition, first and second kinds of hardening reactive compositions with respective first and second kinds of curing accelerators which are different from each other, the first hardening reactive composition having reactive property at a first temperature and the second hardening reactive composition having reactive property at a second temperature higher than the first temperature, and an organic solvent using a noncontact coating device; and removing the organic solvent from the adhesive composition coated on the surface to be bonded, wherein the thermosetting composition has a hardening property so as to exhibit two kinds of reaction temperatures. ### Claim 2 (depends on 1) The forming method according to claim 1, wherein the thermosetting composition has a lower temperature reaction peak and a higher temperature reaction peak in differential scanning calorimetry (DSC) which are related to the two kinds of reaction temperatures, and wherein the lower temperature reaction peak is separated from the higher temperature reaction peak by 10° C. or more. ### Claim 3 (depends on 2) The forming method as according to claim 2, wherein the thermosetting composition contains an epoxy resin, an epoxy curing agent, and the first and second kinds of curing accelerators. ### Claim 4 (depends on 1) The forming method according to claim 1, wherein the thermosetting composition contains an epoxy resin, an epoxy curing agent, and the first and second kinds of curing accelerators. ### Claim 5 An adhesive composition to be employed in a forming method of an adhesive layer on a wafer comprising selectively coating, on a surface of the wafer to be bonded, an adhesive composition containing a thermosetting composition, first and second kinds of hardening reactive compositions, the first hardening reactive composition having reactive property at a first temperature and the second hardening reactive composition having reactive property at a second temperature higher than the first temperature, and an organic solvent using a noncontact coating device; and removing the organic solvent from the adhesive composition coated on the surface to be bonded, the adhesive composition comprising an epoxy resin, an epoxy curing agent, and a first curing accelerator which are reacted through a first hardening reaction exhibiting a first DSC peak within a first temperature range of 100 to 160° C., and a second hardening reaction relating to a self-polymerization of the epoxy resin and a second curing accelerator and exhibiting a second DSC peak within a second temperature range of 140 to 200° C., wherein the first curing accelerator is different from the second curing accelerator. ### Claim 6 (depends on 5) The adhesive composition according to claim 5, wherein the adhesive composition is rendered in a state of B stage in the removing the solvent. ### Claim 7 (depends on 6) The adhesive composition according to claim 6, having a viscosity of 100 mPa·s or less and a content of the thermosetting composition within a range of 5 to 50 mass %. ### Claim 8 (depends on 5) The adhesive composition according to claim 5, having a viscosity of 100 mPa·s or less and a content of the thermosetting composition within a range of 5 to 50 mass %. ### Claim 9 An adhesive composition to be employed in a forming method of an adhesive layer on a wafer, the adhesive composition containing a thermosetting composition, first and second kinds of hardening reactive compositions with respective first and second kinds of curing accelerators, the first hardening reactive composition having reactive property at a first temperature and the second hardening reactive composition having reactive property at a second temperature higher than the first temperature, and an organic solvent, wherein the thermosetting composition has a hardening property so as to exhibit two kinds of reaction temperatures wherein the first kind of curing accelerator is different from the second kind of curing accelerator. ### Claim 10 (depends on 9) The adhesive composition according to claim 9, wherein the thermosetting composition has a lower temperature reaction peak and a higher temperature reaction peak in differential scanning calorimetry (DSC) which are related to the two kinds of reaction temperatures, and wherein the lower temperature reaction peak is separated from the higher temperature reaction peak by 10° C. or more. ### Claim 11 (depends on 10) The adhesive composition according to claim 10, wherein the thermosetting composition contains an epoxy resin, an epoxy curing agent, and the first and second kinds of curing accelerators, which are different from each other. ### Claim 12 (depends on 9) The adhesive composition according to claim 9, wherein the thermosetting composition contains an epoxy resin, an epoxy curing agent, and the first and second kinds of curing accelerators, which are different from each other.