# US 8,772,134 B2 · Method for manufacturing semiconductor chips from a semiconductor wafer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,134 B2 - Document ID: US8772134B2 - Status: Granted - Kind: B2 - Application number: 13/783,529 - Filed: 2013-03-04 - Published: 2013-07-11 - Granted: 2014-07-08 - Earliest claimed: 2010-06-08 - Assignees: STMicroelectronics (Tours) SAS - Applicants: STMicroelectronics (Tours) SAS - Inventors: Vincent Jarry; Patrick Hougron; Dominique Touzet; José Mendez - Web page: https://patentgrep.com/patent/US8772134B2 ## CPC - H10P 72/70: for supporting or gripping - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape} - Y10T 83/02: Other than completely through work thickness - Y10T 225/393: Web restrainer - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method for manufacturing semiconductor chips from a semiconductor wafer, including the steps of: fastening, on a first support frame, a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame; arranging the wafer on a surface of a film stretched on the second frame; carrying out wafer processing operations by using equipment capable of receiving the first frame; separating the second frame from the first frame and removing the first frame; and carrying out wafer processing operations by using equipment capable of receiving the second frame. ## Claims ### Claim 1 A method for processing a semiconductor wafer, comprising: fastening a first frame to a second frame; disposing a wafer on a film affixed to the second frame; processing the wafer in first processing equipment configured to receive the first frame; removing the first frame from the second frame; and processing the wafer in second processing equipment configured to receive the second frame. ### Claim 2 (depends on 1) A method for processing a semiconductor wafer as defined in claim 1, wherein the second frame has outer dimensions less than outer dimensions of the first frame and greater than inner dimensions of the first frame. ### Claim 3 (depends on 1) A method for processing a semiconductor wafer as defined in claim 1, wherein the film is stretched on the second frame. ### Claim 4 (depends on 1) A method for processing a semiconductor wafer as defined in claim 1, wherein the first frame includes at least one fastener element configured to fasten the second frame to the first frame. ### Claim 5 (depends on 4) A method for processing a semiconductor wafer as defined in claim 4, wherein the at least one fastener element comprises fastener elements on four sides of the first frame. ### Claim 6 (depends on 4) A method for processing a semiconductor wafer as defined in claim 4, wherein the at least one fastener element comprises guide rails on three sides of the first frame and a removable lug on a fourth side of the first frame. ### Claim 7 (depends on 6) A method for processing a semiconductor wafer as defined in claim 6, wherein fastening the first frame to the second frame comprises removing the removable lug from the first frame, inserting the second frame between the guide rails of the first frame and fastening the removable lug to the first frame. ### Claim 8 (depends on 7) A method for processing a semiconductor wafer as defined in claim 7, wherein removing the first frame from the second frame comprises removing the removable lug from the first frame and removing the second frame from the guide rails of the first frame. ### Claim 9 (depends on 1) A method for processing a semiconductor wafer as defined in claim 1, wherein processing a wafer in first processing equipment comprises cutting the wafer into semiconductor chips. ### Claim 10 (depends on 9) A method for processing a semiconductor wafer as defined in claim 9, wherein processing the wafer in second processing equipment comprises mounting the semiconductor chips in electronic devices. ### Claim 11 A support frame comprising: a frame body having an outer contour and an inner contour; guide rails secured to the frame body on three sides of the inner contour and defining a space for insertion of a single piece second frame; and a removable lug secured to the frame body on a fourth side of the inner contour so as to retain the second frame between the guide rails and the removable lug. ### Claim 12 (depends on 11) A support frame as defined in claim 11, wherein the guide rails and the removable lug are configured to fasten a second frame having outer dimensions less than outer dimensions of the frame body and greater than inner dimensions of the frame body. ### Claim 13 (depends on 11) A support frame as defined in claim 11, wherein the guide rails and the removable lug are mounted to the frame body to receive a second frame having outer dimensions smaller than outer dimensions of the frame body. ### Claim 14 (depends on 11) A support frame as defined in claim 11, wherein the guide rails and the removable lug are configured to position the second frame so that a center of the second frame coincides with a center of the frame body. ### Claim 15 (depends on 11) A support frame as defined in claim 11, wherein the guide rails are secured to the frame body between the inner contour and the outer contour of the frame body. ### Claim 16 (depends on 11) A support frame as defined in claim 11, wherein the frame body is configured for use in first processing equipment and the second frame is configured for use in second processing equipment. ### Claim 17 (depends on 11) A support frame as defined in claim 11, wherein the frame body has a circular inner contour. ### Claim 18 (depends on 17) A support frame as defined in claim 17, wherein the frame body has a square outer contour with rounded corners.