# US 8,772,124 B2 · Full wafer processing by multiple passes through a combinatorial reactor

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- Number: US 8,772,124 B2
- Document ID: US8772124B2
- Status: Granted
- Kind: B2
- Application number: 13/738,826
- Filed: 2013-01-10
- Published: 2013-07-04
- Granted: 2014-07-08
- Earliest claimed: 2011-12-27
- Assignees: Intermolecular, Inc.
- Applicants: Intermolecular Inc.
- Inventors: Rajesh Kelekar; Aaron T Francis; Gregory P Lim
- Web page: https://patentgrep.com/patent/US8772124B2

## CPC

- H10W 10/00: Isolation regions in semiconductor bodies between components of integrated devices
- H10P 50/00: Etching of wafers, substrates or parts of devices
- H10P 72/0402: {Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence)}
- H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10W 10/01: {Manufacture or treatment}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

Overlapping combinatorial processing can offer more processed regions, better particle performance and simpler process equipment. In overlapping combinatorial processing, one or more regions are processed in series with some degrees of overlapping between regions. In some embodiments, overlapping combinatorial processing can be used in conjunction with non-overlapping combinatorial processing and non-combinatorial processing to develop and investigate materials and processes for device processing and manufacturing.

## Claims

### Claim 1

A method comprising:
processing a substrate through multiple processing steps in sequential manner;
wherein each processing step processes a plurality of site isolated regions on a surface of the substrate in a combinatorial manner; and
wherein there is no overlap between the site isolated regions processed in a first processing step and there is significant overlap between the site isolated regions processed in a second processing step and the site isolated regions processed in the first processing step.

### Claim 2 (depends on 1)

The method of claim 1 further comprising
rotating the substrate between at least two processing steps of the multiple processing steps.

### Claim 3 (depends on 1)

The method of claim 1 further comprising
translating the substrate between at least two processing steps of the multiple processing steps.

### Claim 4 (depends on 1)

The method of claim 1 wherein the substrate is disposed under a reactor assembly, the method further comprising
rotating the reactor assembly between at least two processing steps of the multiple processing steps.

### Claim 5 (depends on 1)

The method of claim 1 wherein the substrate is disposed under a reactor assembly, the method further comprising
translating the reactor assembly between at least two processing steps of the multiple processing steps.

### Claim 6 (depends on 1)

The method of claim 1 wherein the plurality of site isolated regions each comprise a circular shape.