# US 8,772,090 B2 · Method of manufacturing semiconductor device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,772,090 B2
- Document ID: US8772090B2
- Status: Granted
- Kind: B2
- Application number: 13/898,834
- Filed: 2013-05-21
- Published: 2013-11-28
- Granted: 2014-07-08
- Earliest claimed: 2012-05-23
- Assignees: Renesas Electronics Corporation
- Applicants: Renesas Electronics Corporation
- Inventors: Yusuke Ota; Fukumi Shimizu
- Web page: https://patentgrep.com/patent/US8772090B2

## CPC

- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 70/048: {Mechanical treatments, e.g. punching, cutting, deforming or cold welding}
- H10W 70/417: {Bonding materials between chips and die pads}
- H10W 70/421: {Shapes or dispositions}
- H10W 70/424: {Cross-sectional shapes (H10W70/481 takes precedence)}
- H10W 70/427: {Bent parts}
- H10W 72/50: Bond wires
- H10W 74/016: {using moulds}
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W 74/129: {forming a chip-scale package [CSP]}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10W 72/073: {of die-attach connectors}
- H10W 72/07352: {changes in structures or sizes}
- H10W 72/075: {of bond wires}
- H10W 72/321: {Structures or relative sizes of die-attach connectors}
- H10W 72/5366: {the bond wires having kinks}
- H10W 72/5449: {not being orthogonal to a side surface of the chip, e.g. fan-out arrangements}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/932: {Plan-view shape, i.e. in top view}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The method includes the steps of: providing a lead frame, including providing a concaved part in an upper face of a joint part of a die-pad-support lead of a lead frame for setting down a die pad and a tie-bar; bonding a semiconductor chip to a first principal face of the die pad via an adhesive-member layer; then, setting the lead frame between first and second molding dies having first and second cavities respectively so that the first and second cavities are opposed to each other, and the second principal face of the die pad faces toward the second cavity; and forming first and second resin sealed bodies on the sides of the first and second principal faces of the die pad respectively by resin sealing with the first and second molding dies clamping the tie-bar and a part of the lead frame surrounding the tie-bar.

## Claims

### Claim 1

A method of manufacturing a semiconductor device, comprising the steps of:
(a) providing a lead frame having
(x1) a frame part having a substantially rectangular frame-like portion,
(x2) a tie-bar having a substantially rectangular frame-like portion, wherein the tie-bar is supported by the frame part, and formed inside therefrom,
(x3) a plurality of leads extending inward and outward from each of four sides of the tie-bar,
(x4) a die pad formed inside the tie-bar, and having first and second principal faces,
(x5) a die-pad-support lead extending inward from each corner part of the tie-bar or a joint part near the corner part, and joined to the die pad,
(x6) a concaved part formed on the side of the first or second principal face of the joint part, and
(x7) a down-set part formed in each die-pad-support lead so as to set the die pad on the side of the second principal face;
(b) bonding a semiconductor chip to the first principal face of the die pad via an adhesive-member layer;
(c) after the step (b), setting the lead frame between a first molding die having a first cavity and a second molding die having a second cavity such that the first and second cavities are opposed to each other, and such that the second principal face of the die pad faces toward the second cavity; and
(d) forming first and second resin sealed bodies on the sides of the first and second principal faces of the die pad respectively by performing resin sealing while the first and second molding dies clamping the tie-bar and a part of the lead frame located around the tie-bar.

### Claim 2 (depends on 1)

The method of manufacturing a semiconductor device according to claim 1, wherein the concaved part is formed on the side of the first principal face of the joint part.

### Claim 3 (depends on 2)

The method of manufacturing a semiconductor device according to claim 2, wherein the adhesive-member layer is a silver paste layer.

### Claim 4 (depends on 3)

The method of manufacturing a semiconductor device according to claim 3, wherein the concaved part is formed by etching.

### Claim 5 (depends on 4)

The method of manufacturing a semiconductor device according to claim 4, wherein the die pad is included in the semiconductor chip in plane view.

### Claim 6 (depends on 5)

The method of manufacturing a semiconductor device according to claim 5, wherein in the step (d), the first cavity is included in the second cavity in plane view.

### Claim 7 (depends on 6)

The method of manufacturing a semiconductor device according to claim 6, wherein the first resin-sealed body is thicker than the second resin-sealed body in thickness in a place where the semiconductor chip and the die pad are located.

### Claim 8 (depends on 7)

The method of manufacturing a semiconductor device according to claim 7, wherein each die-pad-support lead has first and second branches on the tie-bar side;
the first branch is joined to the tie-bar through a first joint part near one side of corresponding one corner part of the tie-bar; and
the second branch is joined to the tie-bar through a second joint part near the other side of the corner part.

### Claim 9 (depends on 8)

The method of manufacturing a semiconductor device according to claim 8, wherein the concaved part is formed to extend outward from a branch part of the first and second branches to a depth of one half of the width of the tie-bar inside the tie-bar belonging to the joint part along a direction of the width of the tie-bar.

### Claim 10 (depends on 7)

The method of manufacturing a semiconductor device according to claim 7, wherein each die-pad-support lead has substantially no branch on its tie-bar side.

### Claim 11 (depends on 10)

The method of manufacturing a semiconductor device according to claim 10, wherein of the plurality of leads extending inward and outward from each side of the tie-bar, the leads at least adjacent to each die-pad-support lead each have a bent part inward from the tie-bar in the plane which the lead frame substantially belongs to.

### Claim 12 (depends on 11)

The method of manufacturing a semiconductor device according to claim 11, wherein the concaved part is formed to extend outward from an intersection point of a straight line running through the bent part in parallel with one side of the tie-bar closest to the concaved part, and the die-pad-support lead closest to the concaved part to a depth of one half of a width of the tie-bar inside the tie-bar belonging to the joint part.

### Claim 13

A method of manufacturing a semiconductor device comprising the steps of:
(a) providing a lead frame having
(x1) a frame part having a substantially rectangular frame-like portion,
(x2) a tie-bar having a substantially rectangular frame-like portion, wherein the tie-bar is supported by the frame part, and formed inside therefrom,
(x3) a plurality of leads extending inward and outward from each of four sides of the tie-bar,
(x4) a die pad formed inside from the tie-bar, and having first and second principal faces,
(x5) a die-pad-support lead extending inward from each corner part of the tie-bar or a joint part near the corner part, and joined to the die pad, and
(x6) a down-set part formed in each die-pad-support lead so as to set down the die pad on the side of the second principal face;
(b) bonding a semiconductor chip to the first principal face of the die pad via an adhesive-member layer;
(c) after the step (b), setting the lead frame between a first molding die having a first cavity and a second molding die having a second cavity such that the first and second cavities are opposed to each other, and such that the second principal face of the die pad faces toward the second cavity; and
(d) forming first and second resin sealed bodies on the sides of the first and second principal faces of the die pad respectively by performing resin sealing while the first and second molding dies clamping the tie-bar and a part of the lead frame located around the tie-bar,
wherein a clamp-face concaved part is formed in a part of the first or second molding die corresponding to the joint part.

### Claim 14 (depends on 13)

The method of manufacturing a semiconductor device according to claim 13, wherein the clamp-face concaved part is formed in the first molding die.