# US 8,772,069 B2 · Method and apparatus providing combined spacer and optical lens element

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- Number: US 8,772,069 B2
- Document ID: US8772069B2
- Status: Granted
- Kind: B2
- Application number: 13/869,538
- Filed: 2013-04-24
- Published: 2013-09-12
- Granted: 2014-07-08
- Earliest claimed: 2009-03-26
- Assignees: Micron Technology, Inc.
- Applicants: Micron Technology, Inc.
- Inventors: Rick Lake; Jacques Duparre
- Web page: https://patentgrep.com/patent/US8772069B2

## CPC

- G02B 3/0056: {arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses (G02B3/0043 takes precedence; miniaturised objectives for electronic devices employing wafer level optics G02B13/0085)}
- G02B 3/0075: {characterized by non-optical structures, e.g. having integrated holding or alignment means}
- G02B 13/0085: {employing wafer level optics}
- H10F 39/024: {of coatings or optical elements}
- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

A method and apparatus used for forming a lens and spacer combination, and imager module employing the spacer and lens combination. The apparatus includes a mold having a base, spacer section, and mold feature. The method includes using the mold with a blank to create a spacer that includes an integral lens. The spacer and lens combination and imager modules can be formed on a wafer level.

## Claims

### Claim 1

A method of forming an imager module, the method comprising:
forming a first combination spacer lens wafer by pressing a wafer blank onto a form mold; and
affixing an imager wafer comprising a die containing a pixel array to the first combination spacer lens wafer,
the first combination spacer lens wafer comprising:
a combination lens portion, and a combination spacer portion formed as a single unitary piece,
wherein the combination spacer portion is sized to place the combination lens portion an appropriate distance from the pixel array, the combination spacer portion being affixed to the die.

### Claim 2 (depends on 1)

The method of claim 1 wherein the imager wafer comprises a plurality of pixel arrays and the first combination spacer wafer comprises a plurality of combination spacer lenses such that the method comprises forming a plurality of imager modules as part of a wafer assembly.

### Claim 3 (depends on 1)

The method of claim 1 further comprising covering the sidewalls of the first combination spacer portion that are closest to the imager array with a black coating.

### Claim 4 (depends on 1)

The method of claim 1 further comprising covering the sidewalls of the first combination spacer portion that are closest to the imager array with an anti-reflective coating, and covering the first combination lens portion closest to the imager array with an anti-reflective coating.

### Claim 5 (depends on 1)

The method of claim 1 further comprising forming the combination lens portion to be convex.

### Claim 6 (depends on 1)

The method of claim 1 further comprising forming the combination lens portion to be concave.

### Claim 7 (depends on 1)

The method of claim 1 further comprising forming a polymer lens mounted on the top-surface of the first combination spacer lens wafer.

### Claim 8 (depends on 7)

The method of claim 7 wherein the polymer lens is convex.

### Claim 9 (depends on 7)

The method of claim 7 wherein the polymer lens is concave.

### Claim 10 (depends on 1)

The method of claim 1 further comprising affixing a second combination spacer lens wafer to the top-surface of the first combination spacer lens wafer.

### Claim 11 (depends on 10)

The method of claim 10 further comprising forming a polymer lens mounted on the top-surface of the first or second combination spacer lens wafer.