# US 8,772,065 B2 · Housing body and method for production thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,065 B2 - Document ID: US8772065B2 - Status: Granted - Kind: B2 - Application number: 13/611,890 - Filed: 2012-09-12 - Published: 2013-01-03 - Granted: 2014-07-08 - Earliest claimed: 2005-05-30 - Assignees: OSRAM Opto Semiconductors GmbH - Applicants: Georg Bogner; Karlheinz Arndt - Inventors: Georg Bogner; Karlheinz Arndt - Web page: https://patentgrep.com/patent/US8772065B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 29/857: {Interconnections (of active-matrix LED displays H10H29/49)} - H10H 29/8506: {Containers} - H10H 29/8508: {Package substrates, e.g. submounts} - H10W 70/657: {on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers} - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H10H 20/8506: {Containers} - H10W 74/00: Encapsulations, e.g. protective coatings - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) running obliquely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided. ## Claims ### Claim 1 A method for producing a package body with an upper side, with an underside, opposite from the upper side, and with a side surface, which connects the upper side and the underside and is provided as a mounting surface, which package body has a plurality of layers which contain a ceramic material, and a main direction of extent of the layers running at right angles to the mounting surface, the method of comprising: providing a sheet having a stack of ceramic layers and, on an upper side, which corresponds to the upper side of the package body, a plurality of regularly arranged recesses; arranging via holes, which run from the upper side to the underside, between two adjacent ones of said recesses, and producing the package body by dividing the sheet into a plurality of package bodies, wherein the sheet is divided into the plurality of package bodies such that the via holes are asymmetrically separated in such a way that a first package body has on the mounting surface via holes that are well formed for electrical conduction, and wherein a second package body, adjacent to the first package body, has no via holes or remains of the separated via holes, on a side surface that is opposite from the mounting surface. ### Claim 2 (depends on 1) The method according to claim 1, wherein the via holes are sawn through. ### Claim 3 (depends on 1) The method according to claim 1, wherein at least one radiation-generating semiconductor chip is arranged in the recess before the separating. ### Claim 4 (depends on 1) The method according to claim 1, wherein the package body is arranged on a printed circuit board in such a way that the via holes are contacted by interconnects of the printed circuit board. ### Claim 5 (depends on 1) The method according to claim 1, wherein the sheet is provided with tube-like via holes before the sheet is divided into a plurality of package bodies. ### Claim 6 (depends on 1) The method according to claim 1, wherein producing the via holes comprises introducing tube-like depressions into green sheets before sintering. ### Claim 7 (depends on 1) The method according to claim 1, wherein producing the via holes comprises lining depressions in the sheet with an electrically conducting layer or filled with an electrically conducting material by means of electroplating. ### Claim 8 (depends on 1) The method according to claim 1, wherein the separating of the via holes is carried out in such a way that a first package body has on the mounting surface via holes that are well formed for the electrical conduction, while a second package body, adjacent to the first package body, has no via holes, or remains of the separated via holes, on the side surface that is opposite from the mounting surface. ### Claim 9 (depends on 1) The method according to claim 1, wherein before the separating of the via holes, the later mounting surface of a first package body is adjacent to the later side surface of a second package body that is opposite from the mounting surface. ### Claim 10 (depends on 1) The method according to claim 1, wherein the separating of the via holes is achieved by asymmetrically sawing through the sheet in such a way that an upper half of the via holes is preserved on the later mounting surface of a first package body, while a lower half of the via holes is removed by a sawing track, thereby producing a smooth, planar surface on the later side surface of a second package body that is opposite from the mounting surface. ### Claim 11 (depends on 1) The method according to claim 1, wherein the sheet is divided along a straight line. ### Claim 12 A method for producing a package body with an upper side, with an underside, opposite from the upper side, and with a side surface, which connects the upper side and the underside and is provided as a mounting surface, which package body has a via hole which extends from the upper side to the underside, and wherein the via hole extends along the mounting surface, the method comprising: arranging a plurality of regularly arranged recesses on an upper side of a sheet, wherein the upper side of the sheet corresponds to the upper side of the package body, arranging via holes, which run from the upper side to the underside, between two adjacent ones of said recesses; and producing the package body by dividing the sheet into a plurality of package bodies, wherein the sheet is divided into the plurality of package bodies such that the via holes are asymmetrically separated in such a way that a first package body has on the mounting surface via holes that are well formed for electrical conduction, and wherein a second package body, adjacent to the first package body, has no via holes, or remains of the separated via holes on a side surface that is opposite from the mounting surface. ### Claim 13 A method for producing a package body with an upper side, with an underside, opposite from the upper side, and with a side surface, which connects the upper side and the underside and is provided as a mounting surface, which package body has a plurality of layers that contain a ceramic material, and a main direction of extent of the layers running at right angles to the mounting surface, the method comprising: providing a sheet having a stack of ceramic layers and, on an upper side, which corresponds to the upper side of the package body, a plurality of preferably regularly arranged recesses; arranging via holes, which run from the upper side to the underside, between two adjacent ones of said recesses; and producing the package body by dividing the sheet into a plurality of package bodies, wherein the sheet is divided into the plurality of package bodies such that the via holes are asymmetrically separated and wherein the separating of the via holes is achieved by asymmetrically sawing through the sheet such that an upper half of the via holes is preserved on the later mounting surface of a first package body, while a lower half of the via holes is removed by a sawing track thereby producing a smooth, planar surface on the later side surface of a second package body that is opposite from the mounting surface.