# US 8,772,062 B2 · Method for manufacturing light emitting diode package having LED die fixed by anisotropic conductive paste > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,062 B2 - Document ID: US8772062B2 - Status: Granted - Kind: B2 - Application number: 13/786,354 - Filed: 2013-03-05 - Published: 2013-10-31 - Granted: 2014-07-08 - Earliest claimed: 2012-04-27 - Assignees: Advanced Optoelectronic Technology, Inc. - Applicants: Advanced Optoelectronic Technology, Inc. - Inventors: Lung-Hsin Chen; Wen-Liang Tseng - Web page: https://patentgrep.com/patent/US8772062B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/01: Manufacture or treatment - H10W 72/0198: {batch processes} - H10W 72/30: Die-attach connectors - H10H 20/0364: {of interconnections} - H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting} - H10W 72/073: {of die-attach connectors} - H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps - H10W 74/00: Encapsulations, e.g. protective coatings - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method for packaging an LED, includes steps: providing a substrate and forming a plurality of pairs of electrodes on the substrate; positioning anisotropic conductive pastes on the substrate and attaching each anisotropic conductive paste to each pair of the electrodes; positioning an LED die on each anisotropic conductive paste and electrically connecting each LED die to each corresponding pair of the electrodes with the anisotropic conductive paste by hot compressing; forming an encapsulation on the substrate to cover the LED dies; and cutting the substrate to obtain individual LED packages. ## Claims ### Claim 1 A method for manufacturing LED packages, comprising steps: providing a substrate and forming a plurality of pairs of electrodes on the substrate; forming a plurality of reflective cups on the substrate, each reflective cup surrounding a corresponding pair of the electrodes; positioning anisotropic conductive pastes on the substrate and attaching each anisotropic conductive paste to a corresponding pair of the electrodes; positioning an LED die on the each anisotropic conductive paste and electrically connecting the LED die to the corresponding pair of the electrodes with the each anisotropic conductive paste by compressing; forming an encapsulation on the substrate to cover the LED dies; and cutting the substrate to obtain individual LED packages each including a corresponding LED die; wherein the compressing process is operated by steps: arranging a buffer layer on the reflective cups; pressing the buffer layer with a mold and under a predetermined temperature into the reflective cuts to press the anisotropic conductive pastes to deform and electrically interconnect the LED dies and the electrodes; and removing the mold and the buffer layer. ### Claim 2 (depends on 1) The method of claim 1, wherein each two adjacent reflective cups are spaced from each other with a cutting passage defined therebetween. ### Claim 3 (depends on 1) The method of claim 1, wherein the each anisotropic conductive paste is a mixture of conductive particles and adhering glue, and the conductive particles are spaced from each other before the step of pressing the anisotropic conductive paste to deform and electrically interconnect the LED dies and the electrodes. ### Claim 4 (depends on 3) The method of claim 3, wherein the conductive particles contact each other in a vertical direction after the step of pressing the anisotropic conductive pastes to deform and electrically interconnect the LED dies and the electrodes. ### Claim 5 (depends on 1) The method of claim 1, wherein the buffer layer is made of polytetrafluoroethylene (PTFE). ### Claim 6 (depends on 1) The method of claim 1, wherein the mold comprises a plurality of blocks corresponding to the reflective cups, and each block presses into a corresponding reflective cup and presses the buffer layer into the corresponding reflective cup. ### Claim 7 (depends on 1) The method of claim 1, wherein the predetermined temperature is between 200 and 250 centigrade degrees. ### Claim 8 (depends on 1) The method of claim 1, wherein each two electrodes are spaced from each other in each pair of the electrodes, and an electrically insulated area is defined between the two electrodes. ### Claim 9 (depends on 8) The method of claim 8, wherein the each anisotropic conductive paste covers the insulated area with two lateral sides of the each anisotropic conductive paste attaching to each pair of the electrodes. ### Claim 10 (depends on 9) The method of claim 9, wherein each LED die comprises two electrodes facing the substrate, and the two electrodes of each LED die are attached to the each anisotropic conductive paste. ### Claim 11 A method for manufacturing LED packages, comprising steps: providing a substrate and forming a plurality of pairs of electrodes on the substrate; forming a plurality of reflective cups on the substrate, each reflective cup surrounding a corresponding pair of the electrodes; positioning anisotropic conductive pastes on the substrate and attaching each anisotropic conductive paste to a corresponding pair of the electrodes; positioning an LED die on the each anisotropic conductive paste and electrically connecting the LED die to the corresponding pair of the electrodes with the each anisotropic conductive paste by compressing; forming an encapsulation on the substrate to cover the LED dies; and cutting the substrate to obtain individual LED packages each including a corresponding LED die; wherein the step of forming an encapsulation on the substrate to cover the LED dies comprises steps: positioning the encapsulation on top surfaces of the reflective cups; and pressing the encapsulation into the reflective cups. ### Claim 12 (depends on 11) The method of claim 11, wherein a second mold is positioned above the encapsulation and provides a downward pressure to the encapsulation until the encapsulation fills up the reflective cups and covers the LED dies on the substrate. ### Claim 13 (depends on 12) The method of claim 12, wherein the encapsulation is pressed downward to fill up both the reflective cups and the cutting passages. ### Claim 14 (depends on 13) The method of claim 13, wherein the encapsulation covers the top surfaces and lateral sides of the reflective cups.