# US 8,772,058 B2 · Method for making a redistributed wafer using transferrable redistribution layers > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,772,058 B2 - Document ID: US8772058B2 - Status: Granted - Kind: B2 - Application number: 13/364,858 - Filed: 2012-02-02 - Published: 2013-08-08 - Granted: 2014-07-08 - Earliest claimed: 2012-02-02 - Assignees: Harris Corporation - Applicants: Thomas Reed; David Herndon; Suzanne Dunphy - Inventors: Thomas Reed; David Herndon; Suzanne Dunphy - Web page: https://patentgrep.com/patent/US8772058B2 ## CPC - H10P 72/74: {using temporarily an auxiliary support} - H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes} - H10W 20/031: {of conductive parts of the interconnections} - H10P 72/743: {used as a support during manufacture of interconnect decals or build up layers} - H10P 74/207: {Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics} - H10W 20/49: Adaptable interconnections, e.g. fuses or antifuses - H10W 72/0198: {batch processes} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of making redistributed electronic devices that includes providing a wafer having a plurality of electronic devices, each electronic device having a pattern of contact areas forming die pads. The method also includes forming redistribution layers on a temporary substrate having a pattern of contact areas forming wafer bonding pads matching the die pads and a pattern of contact areas forming redistributed pads different than the wafer bonding pads, the wafer bonding pads are coupled to the redistributed pads through a plurality of stacked conductive and insulating layers. The die pads are coupled to the wafer bonding pads, and the temporary substrate is removed. The wafer and redistribution layers are then divided into a plurality of redistributed electronic devices. ## Claims ### Claim 1 A method of making electronic devices with redistribution layers comprising: providing a wafer comprising a plurality of electronic devices, each electronic device having a pattern of contact areas forming die pads; forming redistribution layers on a temporary substrate and comprising a first layer having a pattern of contact areas forming wafer bonding pads matching the die pads, a third layer having a pattern of contact areas forming redistributed pads different than the wafer bonding pads, and a second layer having a pattern of interconnecting portions coupling the wafer bonding pads to the redistributed pads, with each interconnecting portion having a first contact area pattern and a second contact area pattern coupled thereto so that the first and second contact area patterns are laterally offset from one another; coupling the die pads of the wafer to the wafer bonding pads of the redistribution layers; removing the temporary substrate from the redistribution layers; and dividing the coupled wafer and redistribution layers into a plurality of redistributed electronic devices. ### Claim 2 (depends on 1) The method of claim 1, wherein the dividing is performed before removing the temporary substrate. ### Claim 3 (depends on 1) The method of claim 1, wherein a size of the temporary substrate corresponds to a size of the wafer comprising the plurality of electronic devices. ### Claim 4 (depends on 1) The method of claim 1, wherein forming the redistribution layers comprises forming a plurality of stacked conductive layers. ### Claim 5 (depends on 4) The method of claim 4, wherein the method further comprises forming a passivation layer between adjacent conductive layers. ### Claim 6 (depends on 1) The method of claim 1, further comprising, prior to dividing the coupled wafer and redistribution layers, forming interconnect structures on the redistributed pads. ### Claim 7 (depends on 1) The method of claim 1, further comprising, prior to dividing the coupled wafer and redistribution layers: forming additional redistribution layers on an additional temporary substrate having a first pattern of contact areas matching the redistributed pads and a second pattern of contact areas different than the first pattern of contact areas, the first pattern of contact areas being coupled to the second pattern of contact areas; coupling the redistributed pads of the redistribution layers to the first pattern of contact areas of the additional redistribution layers; removing the additional temporary substrate from the additional redistribution layers. ### Claim 8 (depends on 1) The method of claim 1, wherein the method further comprises testing the provided wafer comprising a plurality of electronic devices prior to coupling the die pads to the wafer bonding pads. ### Claim 9 (depends on 1) The method of claim 1, wherein the method further comprises testing the redistribution layers prior to coupling the die pads to the wafer bonding pads. ### Claim 10 (depends on 1) The method of claim 1, wherein the temporary substrate comprises glass. ### Claim 11 A method of making electronic devices with redistribution layers comprising: providing a wafer comprising a plurality of electronic devices, each electronic device having a pattern of contact areas forming die pads; forming redistribution layers on a temporary substrate and comprising a first layer having a pattern of contact areas forming wafer bonding pads matching the die pads, a third layer having a pattern of contact areas forming redistributed pads different than the wafer bonding pads, and a second layer having a pattern of interconnecting portions coupling the wafer bonding pads to the redistributed pads, with each interconnecting portion having a first contact area pattern and a second contact area pattern coupled thereto so that the first and second contact area patterns are laterally offset from one another; testing the provided wafer comprising a plurality of electronic devices; coupling the die pads of the wafer to the wafer bonding pads on the redistribution layers; removing the temporary substrate from the redistribution layers; forming interconnect structures on the redistributed pads on the redistribution layers; and dividing the coupled wafer and redistribution layers into a plurality of redistributed electronic devices. ### Claim 12 (depends on 11) The method of claim 11, wherein the dividing is performed before removing the temporary substrate. ### Claim 13 (depends on 11) The method of claim 11, wherein a size of the temporary substrate corresponds to a size of the wafer comprising the plurality of electronic devices. ### Claim 14 (depends on 11) The method of claim 11, wherein forming the redistribution layers comprises forming a plurality of stacked conductive layers. ### Claim 15 (depends on 14) The method of claim 14, further comprising forming a passivation layer between adjacent conductive layers. ### Claim 16 (depends on 11) The method of claim 11, further comprising, prior to dividing the coupled wafer and redistribution layers: forming additional redistribution layers on an additional temporary substrate having a first pattern of contact areas matching the redistributed pads and a second pattern of contact areas different than the first pattern of contact areas, the first pattern of contact areas being coupled to the second pattern of contact areas; coupling the redistributed pads of the redistribution layers to the first pattern of contact areas of the additional redistribution layers; removing the additional temporary substrate from the additional redistribution layers. ### Claim 17 (depends on 11) The method of claim 11, wherein the temporary substrate comprises glass. ### Claim 18 A method of making electronic devices with redistribution layers comprising: providing a wafer comprising a plurality of electronic devices, each electronic device having a pattern of contact areas forming die pads; forming redistribution layers on a temporary substrate and comprising a first layer having a pattern of contact areas forming wafer bonding pads matching the die pads, a third layer having a pattern of contact areas forming redistributed pads different than the wafer bonding pads, and a second layer having a pattern of interconnecting portions coupling the wafer bonding pads to the redistributed pads, with each interconnecting portion having a first contact area pattern and a second contact area pattern coupled thereto so that the first and second contact area patterns are laterally offset from one another; testing the redistribution layers; coupling the die pads to the wafer bonding pads; removing the temporary substrate; forming interconnect structures on the redistributed pads of the redistribution layers, and dividing the coupled wafer and redistribution layers into a plurality of redistributed electronic. ### Claim 19 (depends on 18) The method of claim 18, wherein the dividing is performed before removing the temporary substrate. ### Claim 20 (depends on 18) The method of claim 18, wherein a size of the temporary substrate corresponds to a size of the wafer comprising the plurality of electronic devices. ### Claim 21 (depends on 18) The method of claim 18, wherein forming the redistribution layers comprises forming a plurality of stacked conductive layers. ### Claim 22 (depends on 21) The method of claim 21, further comprising forming a passivation layer between adjacent conductive layers. ### Claim 23 (depends on 18) The method of claim 18, further comprising, prior to dividing the coupled wafer and redistribution layers: forming additional redistribution layers on an additional temporary substrate having a first pattern of contact areas matching the redistributed pads and a second pattern contact areas different than the first pattern of contact areas, the first pattern of contact areas being coupled to the second pattern of contact areas; coupling the redistributed pads of the redistribution layers to the first pattern of contact areas of the additional redistribution layers; removing the additional temporary substrate from the additional redistribution layers. ### Claim 24 (depends on 18) The method of claim 18, wherein the temporary substrate comprises glass.