# US 8,771,928 B2 · Method for manufacturing stamper for injection molding > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,771,928 B2 - Document ID: US8771928B2 - Status: Granted - Kind: B2 - Application number: 13/394,447 - Filed: 2010-09-06 - Published: 2012-07-26 - Granted: 2014-07-08 - Earliest claimed: 2009-09-09 - Assignees: LG Electronics Inc. - Applicants: Young Kyu Kim; Seok Jae Jeong - Inventors: Young Kyu Kim; Seok Jae Jeong - Web page: https://patentgrep.com/patent/US8771928B2 ## CPC - G03F 7/0017: {for the production of embossing, cutting or similar devices; for the production of casting means} - B29C 45/2632: {Stampers; Mountings thereof} - B29C 33/56: Coatings {, e.g. enameled or galvanised}; Releasing, lubricating or separating agents {(in-mould coating B29C37/0028; using or applying separating agents B29C37/0067)} - B29K 2905/00: Use of metals, their alloys or their compounds, as mould material - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - B29K: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR {MOULDS, } REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS ## Abstract The present invention relates to a method for manufacturing a stamper for injection molding, and more particularly, to a method for manufacturing a stamper for injection molding which can prevent a scratch from forming thereon and has an excellent durability owing to high hardness even after manufacturing of the metal stamper with micro patterns formed thereon is finished. The method for manufacturing a stamper for injection molding includes a pattern forming step for forming a predetermined micro pattern on a substrate, a metal plating step for making metal plating on the substrate to form a stamper having the micro pattern transcribed thereto, a stamper separating step for separating the stamper of the metal plating from the substrate, and a protective layer coating step for coating a protective layer on the stamper for maintaining a mirror surface. ## Claims ### Claim 1 A method for manufacturing a stamper for injection molding, comprising: a pattern forming step for forming a predetermined micro pattern on a substrate; a metal plating step for making metal plating on the substrate to form a stamper having the micro pattern transcribed thereto, wherein the metal plating is nickel or copper; a stamper separating step for separating the stamper of the metal plating from the substrate; and a protective layer coating step for coating a protective layer that includes a titanium nitride coating on the stamper by electron-beam evaporation for maintaining a mirror surface. ### Claim 2 (depends on 1) The method as claimed in claim 1, wherein the protective layer coating step includes the step of directing an electron beam to titanium in a vacuum chamber of a nitrogen atmosphere, or a nitrogen and argon atmosphere to deposit titanium ions and nitrogen ions on the stamper. ### Claim 3 (depends on 1) The method as claimed in claim 1, further comprising an ultrasonic wave washing step for dipping the stamper in a solution and applying an ultrasonic wave thereto for washing the stamper before the protective layer coating step. ### Claim 4 (depends on 3) The method as claimed in claim 3, wherein the solution is acetone solution. ### Claim 5 (depends on 1) The method as claimed in claim 1, wherein the titanium nitride coating has a thickness of 0.2˜0.6 μm. ### Claim 6 (depends on 1) The method as claimed in claim 1, wherein the pattern forming step includes the steps of; coating photoresist on the substrate, subjecting the photoresist coated thus to soft baking, placing a pattern mask of a predetermined shape on the substrate having the photoresist coated thereon and subjecting the substrate to exposure, subjecting the photoresist exposed thus to development, and hard baking portions of the photoresist having the photoresist removed therefrom partially. ### Claim 7 (depends on 1) The method as claimed in claim 1, further comprising the step of depositing a seed layer on the pattern formed thus after the pattern forming step. ### Claim 8 (depends on 1) The method as claimed in claim 1, wherein the pattern forming step includes the steps of: depositing metal on the substrate, electropolishing the metal deposited thus, subjecting the metal to first time anodic oxidation, etching and removing metal oxide formed thus, subjecting the metal not oxidized yet to second time anodic oxidation, and removing a barrier layer formed between the micro pattern and the substrate by the second time anodic oxidation.