# US 8,771,610 B2 · Method of reducing temperature difference between a pair of substrates and fluid reaction device using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,771,610 B2 - Document ID: US8771610B2 - Status: Granted - Kind: B2 - Application number: 12/904,557 - Filed: 2010-10-14 - Published: 2011-02-10 - Granted: 2014-07-08 - Earliest claimed: 2006-09-04 - Assignees: Samsung Electronics Co., Ltd. - Applicants: Kak Namkoong; Su-hyeon Kim; Jin-tae Kim; Chin-sung Park; Young-sun Lee - Inventors: Kak Namkoong; Su-hyeon Kim; Jin-tae Kim; Chin-sung Park; Young-sun Lee - Web page: https://patentgrep.com/patent/US8771610B2 ## CPC - B81B 3/0081: {Thermal properties} - B01J 19/0093: {Microreactors, e.g. miniaturised or microfabricated reactors (laboratory containers with capillary fluid transport in microfabricated channels or chambers B01L3/5027)} - B01L 7/5255: {by moving sample containers} - F28F 21/02: of carbon, e.g. graphite - B01J 2219/00783: Laminate assemblies, i.e. the reactor comprising a stack of plates - B01J 2219/00822: Metal - B01J 2219/00873: Heat exchange - B01L 3/5027: {by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip} - B01L 2200/14: Process control and prevention of errors - B01L 2200/147: Employing temperature sensors - B01L 2300/1805: Conductive heating, heat from thermostatted solids is conducted to receptacles, e.g. heating plates, blocks - B01L 2300/1827: using resistive heater - B81B 2201/051: Micromixers, microreactors - F28F 2013/006: {Heat conductive materials} - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - B01J: CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS - B01L: CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE - F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16) ## Abstract A fluid reaction device includes a microfluidic reaction chip which accommodates a fluid, a heater, and a heat transfer facilitating layer which is interposed between the microfluidic reaction chip and the heater, the heat transfer facilitating layer has a higher thermal conductivity than air and can hold particles, wherein formation of an air layer can be prevented. ## Claims ### Claim 1 A fluid reaction device comprising: a microfluidic reaction chip which accommodates a fluid; a heater which heats said microfluidic reaction chip; and a heat transfer facilitating layer which is interposed between said microfluidic reaction chip and said heater, said heat transfer facilitating layer has a higher thermal conductivity than air and can hold particles, wherein said heater, said heat transfer facilitating layer, and said microfluidic reaction chip are separable from each other and held together preventing formation of an air layer between substantially planar surfaces defining said heater and said heat transfer facilitating layer, and preventing formation of an air layer between substantially planar surfaces defining said microfluidic reaction chip and said heat transfer facilitating layer. ### Claim 2 (depends on 1) The fluid reaction device of claim 1, wherein said heat transfer facilitating layer is formed of a graphite sheet. ### Claim 3 (depends on 2) The fluid reaction device of claim 2, wherein said graphite sheet is a pyrolytic graphite sheet formed by pyrolysis. ### Claim 4 (depends on 1) The fluid reaction device of claim 1, wherein said heat transfer facilitating layer has a thermal conductivity of about 100 W/(m·K) to about 10,000 W/(m·K) in a direction parallel to the heat transfer facilitating layer. ### Claim 5 (depends on 1) The fluid reaction device of claim 1, wherein said heat transfer facilitating layer has a thickness of about 10 μm to about 1,000 μm. ### Claim 6 (depends on 1) The fluid reaction device of claim 1, wherein a part of said heater which is held to the heat transfer facilitating layer comprises a high-temperature substrate, and a part of said microfluidic reaction chip which is held to said heat transfer facilitating layer comprises a low-temperature substrate. ### Claim 7 (depends on 6) The fluid reaction device of claim 6, wherein at least one of said high-temperature substrate and said low-temperature substrate includes silicon. ### Claim 8 (depends on 1) The fluid reaction device of claim 1, wherein said heat transfer facilitating layer includes a metal or a carbon-nano-tube. ### Claim 9 (depends on 8) The fluid reaction device of claim 8, wherein said heat transfer facilitating layer includes a metal, and the metal is one of gold, silver, copper, aluminum, lead free solder, and a combination including at least one of the foregoing metals. ### Claim 10 (depends on 1) The fluid reaction device of claim 1, wherein said heat transfer facilitating layer is a thin film formed on a surface of said heater. ### Claim 11 (depends on 1) The fluid reaction device of claim 1, wherein said heat transfer facilitating layer is directly fixed to at least one of said microfluidic reaction chip and said heater without interposing an adhesive there between. ### Claim 12 (depends on 1) The fluid reaction device of claim 1, wherein said microfluidic reaction chip is separably fixed to said heat transfer facilitating layer, and said heat transfer facilitating layer remains held to said heater even when said microfluidic reaction chip is separated from the heat transfer facilitating layer. ### Claim 13 (depends on 1) The fluid reaction device of claim 1, wherein said heat transfer facilitating layer contacts at least substantially an entire facing surface of at least one of said heater and said microfluidic reaction chip. ### Claim 14 A fluid reaction device comprising: a microfluidic reaction chip which accommodates a fluid; a heater which heats said microfluidic reaction chip; and a heat transfer facilitating layer which is interposed between said microfluidic reaction chip and said heater, said heat transfer facilitating layer has a higher thermal conductivity than air and which is deformable to hold particles entrained between said microfluidic reaction chip and said heater, wherein said heater, said heat transfer facilitating layer, and said microfluidic reaction chip are separable from each other and held together preventing formation of an air layer between substantially planar contacting surfaces defining said heater and said heat transfer facilitating layer, and preventing formation of an air layer between substantially planar contacting surfaces defining said microfluidic reaction chip and said heat transfer facilitating layer. ### Claim 15 (depends on 14) The fluid reaction device of claim 14, wherein said heat transfer facilitating layer contacts at least substantially an entire portion of the substantially planar contacting surfaces of at least one of said heater and said microfluidic reaction chip.