# US 8,771,592 B2 · Lead-free solder composition

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- Number: US 8,771,592 B2
- Document ID: US8771592B2
- Status: Granted
- Kind: B2
- Application number: 13/363,618
- Filed: 2012-02-01
- Published: 2012-09-06
- Granted: 2014-07-08
- Earliest claimed: 2011-02-04
- Assignees: Antaya Technologies Corporation
- Applicants: Jennie S. Hwang; John Pereira; Alexandra Mary Mackin; Joseph C. Gonsalves
- Inventors: Jennie S. Hwang; John Pereira; Alexandra Mary Mackin; Joseph C. Gonsalves
- Web page: https://patentgrep.com/patent/US8771592B2

## CPC

- B23K 35/26: with the principal constituent melting at less than 400°C
- B23K 35/24: Selection of soldering or welding materials proper (B23K35/34 takes precedence)
- B60R 16/02: electric {constitutive elements}
- C03C 27/046: {of metals, metal oxides or metal salts only}
- C22C 1/02: by melting {(C22C1/1036 takes precedence)}
- C22C 28/00: Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 3/3465: Application of solder
- B60Y 2410/115: Electric wiring; Electric connectors
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B60R: VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B60Y: INDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY

## Abstract

A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

## Claims

### Claim 1

A solder composition having a mixture of elements consisting of:
about 4% to about 25% by weight tin;
about 0.1% to about 8% by weight antimony;
about 0.03% to about 4% by weight copper;
about 0.03% to about 4% by weight nickel;
about 66% to about 90% by weight indium;
about 0.5% to about 9% by weight silver; and
about 0.2% to about 6% by weight zinc.

### Claim 2 (depends on 1)

The solder composition of claim 1, wherein the solder composition has a solidus temperature in a range of between about 120° C. and about 145° C.

### Claim 3 (depends on 1)

The solder composition of claim 1, wherein the solder composition has a liquidus temperature in a range of between 130° C. and about 155° C.

### Claim 4 (depends on 1)

The solder composition of claim 1, wherein the mixture of elements consists of:
about 7% to about 19% by weight tin;
about 0.2% to about 8% by weight antimony;
about 0.1% to about 1.5% by weight copper;
about 0.1% to about 4% by weight nickel;
about 70% to about 80% by weight indium;
about 4% to about 8% by weight silver; and
about 0.2% to about 6% by weight zinc.

### Claim 5 (depends on 1)

The solder composition of claim 1, wherein the mixture of elements consists of:
about 4% to about 20% by weight tin;
about 0.1% to about 8% by weight antimony;
about 0.1% to about 4% by weight copper;
about 0.1% to about 3% by weight nickel;
about 71% to about 86% by weight indium;
about 1% to about 6% by weight silver; and
about 0.2% to about 6% by weight zinc.

### Claim 6

A solder composition having a mixture of elements consisting of:
about 11% to about 17% by weight tin;
about 0.5% to about 3% by weight antimony;
about 0.5% to about 1.5% by weight copper;
about 0.5% to about 5% by weight nickel;
about 72% to about 77% by weight indium;
about 4% to about 8.5% by weight silver; and
about 0.3% to about 1.5% by weight zinc.

### Claim 7 (depends on 6)

The solder composition of claim 6, wherein the solder composition has a solidus temperature in a range of between about 120° C. and about 145° C.

### Claim 8 (depends on 7)

The solder composition of claim 7, wherein the solder composition has a solidus temperature in a range of between about 120° C. and about 135° C.

### Claim 9 (depends on 6)

The solder composition of claim 6, wherein the solder composition has a liquidus temperature in a range of between 130° C. and about 155° C.

### Claim 10 (depends on 8)

The solder composition of claim 8, wherein the solder composition has a liquidus temperature in a range of between 130° C. and about 145° C.

### Claim 11 (depends on 6)

The solder composition of claim 6, wherein the mixture of elements consists of:
about 13% to about 15% by weight tin;
about 0.5% to about 2.5% by weight antimony;
about 0.5% to about 1.5% by weight copper;
about 1% to about 4% by weight nickel;
about 74% to about 75% by weight indium;
about 5% to about 8.5% by weight silver; and
about 0.3% to about 1.5% by weight zinc.

### Claim 12 (depends on 11)

The solder composition of claim 11, wherein the mixture of elements consists of:
about 15% by weight tin;
about 0.5% to about 1.5% by weight antimony;
about 0.5% to about 1.5% by weight copper;
about 1% by weight nickel;
about 75% by weight indium;
about 6% by weight silver; and
about 0.5% to about 1.5% by weight zinc.

### Claim 13 (depends on 12)

The solder composition of claim 12, wherein the mixture of elements consists of:
about 15% by weight tin;
about 1% by weight antimony;
about 1% by weight copper;
about 1% by weight nickel;
about 75% by weight indium;
about 6% by weight silver; and
about 1% by weight zinc.

### Claim 14 (depends on 11)

The solder composition of claim 11, wherein the mixture of elements consists of:
about 14% by weight tin;
about 0.5% to about 1.5% by weight antimony;
about 0.5% to about 1.5% by weight copper;
about 3% by weight nickel;
about 75% by weight indium;
about 5% by weight silver; and
about 0.5% to about 1.5% by weight zinc.

### Claim 15 (depends on 14)

The solder composition of claim 14, wherein the mixture of elements consists of:
about 14% by weight tin;
about 1% by weight antimony;
about 1% by weight copper;
about 3% by weight nickel;
about 75% by weight indium;
about 5% by weight silver; and
about 1% by weight zinc.

### Claim 16 (depends on 11)

The solder composition of claim 11, wherein the mixture of elements consists of:
about 13% by weight tin;
about 1.5% to about 2.5% by weight antimony;
about 0.5% to about 1.5% by weight copper;
about 4% by weight nickel;
about 74% by weight indium;
about 5% by weight silver; and
about 0.5% to about 1.5% by weight zinc.

### Claim 17 (depends on 16)

The solder composition of claim 16, wherein the mixture of elements consists of:
about 13% by weight tin;
about 2% by weight antimony;
about 1% by weight copper;
about 4% by weight nickel;
about 74% by weight indium;
about 5% by weight silver; and
about 1% by weight zinc.

### Claim 18

A solder composition having a mixture of elements consisting of:
about 4% to about 25% by weight tin;
about 0.1% to about 8% by weight antimony;
about 0.03% to about 4% by weight copper;
about 0.03% to about 4% by weight nickel;
about 66% to about 90% by weight indium;
about 0.5% to about 9% by weight silver;
about 0.2% to about 6% by weight zinc; and
about 0.01% to about 0.3% by weight germanium.