# US 8,771,563 B2 · Manufacturing method of optical electronic components and optical electronic components manufactured using the same

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- Number: US 8,771,563 B2
- Document ID: US8771563B2
- Status: Granted
- Kind: B2
- Application number: 11/702,636
- Filed: 2007-02-06
- Published: 2007-06-21
- Granted: 2014-07-08
- Earliest claimed: 2005-07-12
- Assignees: Towa Corporation
- Applicants: Shinji Takase; Kazuki Kawakubo; Yohei Onishi
- Inventors: Shinji Takase; Kazuki Kawakubo; Yohei Onishi
- Web page: https://patentgrep.com/patent/US8771563B2

## CPC

- B29D 11/0074: {Production of other optical elements not provided for in B29D11/00009- B29D11/0073}
- B29C 31/008: {Handling preformed parts, e.g. inserts (B29C37/001 takes precedence; for injection moulding B29C45/14008; for blow moulding B29C49/2408; for thermoforming B29C51/165)}
- B29C 31/08: of preforms {to be moulded, e.g. tablets, fibre reinforced preforms, extruded ribbons, tubes or profiles; Manipulating means specially adapted for feeding preforms, e.g. supports conveyors (B29C31/066, B29C37/001, B29C43/085 take precedence)}
- B29C 33/68: Release sheets
- B29C 37/0075: {using release sheets}
- B29C 39/10: incorporating preformed parts or layers, e.g. casting around inserts or for coating articles {(coating a surface by casting in general B05D1/30, B29C39/126 takes precedence)}
- B29C 41/20: incorporating preformed parts or layers, e.g. moulding inserts or for coating articles
- B29C 41/36: Feeding the material on to the mould, core or other substrate
- B29C 41/42: Removing articles from moulds, cores or other substrates {(B29C33/444 and B29C37/0017 take precedence)}
- B29C 70/70: Completely encapsulating inserts {(B29C70/86 takes precedence)}
- B29L 2031/747: {Lightning equipment}
- H10W 74/00: Encapsulations, e.g. protective coatings
- B29D: PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE (making granules B29B9/00; making preforms B29B11/00)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces. Thus, tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

## Claims

### Claim 1

A resin-sealing and molding method of optical devices employing a resin-sealing and molding die comprising a lower molding die provided with a cavity, an upper molding die opposing said lower molding die, and a release film covering a cavity surface of said cavity, and resin-sealing and molding a plurality of optical devices in said cavity, wherein
said method comprises:
attaching, to said upper molding die, a substrate before sealing to which said plurality of optical devices are attached so that said plurality of optical devices overlap with a plurality of concave portions provided in said cavity in plan view respectively;
bringing said mold release film into contact with all surfaces of an entire cavity corresponding to a geometry of said cavity;
inserting said plurality of optical devices into melted resin or resin in liquid form in said cavity by closing said resin-sealing and molding die;
setting said melted resin or said resin in liquid form to provide transparent set resin;
opening said resin-sealing and molding die; and
removing said substrate sealed by said transparent set resin from said resin-sealing and molding die, wherein
said lower molding die defines a communicating path communicating said plurality of concave portions with each other at an entire periphery of each of said plurality of concave portions,
in said inserting step, said melted resin or said resin in liquid form moves between said plurality of concave portions through said communicating path so that a space inside said cavity is filled with said melted resin or said resin in liquid form when said resin-sealing and molding die is closed.

### Claim 2 (depends on 1)

The resin-sealing and molding method of optical devices according to claim 1, further comprising:
isolating said cavity from external atmosphere using a sealing member; and
vacuuming said cavity that is isolated from external atmosphere.

### Claim 3 (depends on 1)

The resin sealing and molding method of optical devices according to claim 1, wherein:
in said step of bringing, said molding release film is brought into contact with said cavity's entire surface by suction.

### Claim 4 (depends on 1)

The resin-sealing and molding method of optical devices according to claim 1, wherein:
in said step of bringing, said mold release film is brought into contact with said cavity's entire surface by a blow of air.

### Claim 5 (depends on 1)

The resin sealing and molding method of optical devices according to claim 1, wherein:
in said step of bringing, said mold release film is brought into contact with said cavity's entire surface by heating said lower molding die.

### Claim 6

A resin-sealing and molding method of optical devices employing a resin-sealing and molding die including a lower molding die provided with a cavity and a release film covering a cavity surface of said cavity, and resin-sealing and molding a plurality of optical devices in said cavity, wherein said method comprises:
arranging a substrate, before sealing to which said plurality of optical devices are attached, so that said plurality of optical devices overlap with a plurality of concave portions provided in said cavity in plan view, respectively;
bringing said mold release film into contact with all surfaces of an entire cavity corresponding to a geometry of said cavity;
filling said cavity with melted resin or resin in liquid form by moving said melted resin or resin in liquid form through a communicating path by which said plurality of concave portions are communicated with each other at an entire periphery of each of said plurality of concave portions;
inserting said plurality of optical devices into said melted resin or said resin in liquid form in said cavity by closing said resin-sealing and molding die, and thereby, said melted resin and said resin in liquid form moves between said plurality of concave portions through said communicating path so that a space inside said cavity is filled with said melted resin or said resin in liquid form;
sandwiching said mold release film between a cavity member, provided outside said cavity, and a periphery of the substrate;
setting said melted resin or said resin in liquid form to provide transparent set resin;
opening said resin-sealing and molding die; and
removing said substrate sealed by said transparent set resin from said resin-sealing and molding die.

### Claim 7 (depends on 6)

The resin-sealing and molding method of optical devices according to claim 6, further comprising:
isolating said cavity from external atmosphere using a sealing member; and
vacuuming said cavity that is isolated from external atmosphere.

### Claim 8 (depends on 6)

The resin-sealing and molding method of optical devices according to claim 6, wherein
in said bringing step, said molding release film is brought into contact with said cavity's entire surface by suction.

### Claim 9 (depends on 6)

The resin-sealing and molding method of optical devices according to claim 6, wherein
in said bringing step, said mold release film is brought into contact with said cavity's entire surface by a blow of air.

### Claim 10 (depends on 6)

The resin-sealing and molding method of optical devices according to claim 6, wherein
in said bringing step, said mold release film is brought into contact with said cavity's entire surface by heating said lower molding die.