# US 8,771,459 B2 · Method of encapsulating an electronic arrangement > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,771,459 B2 - Document ID: US8771459B2 - Status: Granted - Kind: B2 - Application number: 12/774,788 - Filed: 2010-05-06 - Published: 2011-02-17 - Granted: 2014-07-08 - Earliest claimed: 2009-08-12 - Assignees: Tesa SE - Applicants: Klaus Keite-Telgenbüscher; Jan Ellinger; Thortsten Krawinkel; Alexander Steen - Inventors: Klaus Keite-Telgenbüscher; Jan Ellinger; Thortsten Krawinkel; Alexander Steen - Web page: https://patentgrep.com/patent/US8771459B2 ## CPC - C09J 153/025: {modified} - H10K 71/00: Manufacture or treatment specially adapted for the organic devices covered by this subclass - H10K 50/8426: {Peripheral sealing arrangements, e.g. adhesives, sealants} - H10K 2102/311: {Flexible OLED} - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract The present invention relates to as method of encapsulating an electronic arrangement with respect to permeants, in which an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride-modified vinylaromatic block copolymers is provided and in which the pressure-sensitive adhesive is applied to and/or around the regions of the electronic arrangement that are to be encapsulated. ## Claims ### Claim 1 A method of encapsulating an electronic arrangement with respect to permeants, comprising encapsulating an electronic arrangement by completely enclosing the arrangement with an at least partly crosslinked hotmelt adhesive based on acid-modified or acid-anhydride modified vinylaromatic block copolymers. ### Claim 2 (depends on 1) The method according to claim 1, wherein the hotmelt adhesive is in the form of an adhesive tape. ### Claim 3 (depends on 2) The method according to claim 2, wherein the layer thickness of the hotmelt adhesive in the adhesive tape is between 1 μm to 150 μm. ### Claim 4 (depends on 1) The method according to claim 1, wherein the hotmelt adhesive is crosslinked using amines or epoxy resins. ### Claim 5 (depends on 4) The method according to claim 4, wherein the modified vinylaromatic block copolymers are crosslinked by amines. ### Claim 6 (depends on 4) The method according to claim 4, wherein the modified vinylaromatic block copolymers are crosslinked by epoxy resins. ### Claim 7 (depends on 1) The method according to claim 1, wherein the hotmelt adhesive is crosslinked using metal chelates. ### Claim 8 (depends on 7) The method according to claim 7, wherein the metal chelates may be represented by the following formula: (R1O)nM(XR2Y)m, where M is a metal from main group 2, 3, 4 or 5 or a transition metal; R1 is an alkyl or aryl group such as methyl, ethyl, butyl, isopropyl or benzyl; n is zero or a larger integer, X and Y are oxygen or nitrogen, and may each also be joined to R2 by a double bond; R2 is an alkylene group which joins X and Y and which may be branched, or else may comprise oxygen or other heteroatoms in the chain; m is an integer, but is at least 1. ### Claim 9 (depends on 8) The method according to claim 8, wherein the chelate is an acetylacetonate. ### Claim 10 (depends on 9) The method according to claim 9, wherein the chelate is aluminium acetylacetonate. ### Claim 11 (depends on 1) The method according to claim 1, wherein the hotmelt adhesive comprises polymer blocks formed from vinylaromatics and in that the hotmelt adhesive comprises polymer blocks formed by polymerization of 1,3 dienes. ### Claim 12 (depends on 11) The method according to claim 11, wherein the block copolymers have a polyvinylaromatic fraction of 10% to 35% by weight. ### Claim 13 (depends on 11) The method according to claim 11, wherein the hotmelt adhesive has a vinylaromatic block copolymer fraction of at least 50% by weight. ### Claim 14 (depends on 1) The method according to claim 1, wherein the hotmelt adhesive comprises a resin or a resin mixture. ### Claim 15 (depends on 1) The method according to claim 1, wherein the hotmelt adhesive comprises one or more additives selected from the group consisting of: plasticizers, primary antioxidants, secondary antioxidants, in-process stabilizers, light stabilizers, processing assistants, endblock reinforcer resins, and polymers. ### Claim 16 (depends on 1) The method according to claim 1, wherein the hotmelt adhesive comprises one or more fillers. ### Claim 17 (depends on 16) The method according to claim 16, wherein the fillers are of nanoscale form in at least one dimension. ### Claim 18 (depends on 1) The method according to claim 1, wherein the hotmelt adhesive is transparent in form, wherein the hotmelt adhesive has an average transmittance of at least 75% in the wavelength range from 400 nm to 800 nm. ### Claim 19 (depends on 1) The method according to claim 1, wherein the hotmelt adhesive is of UV-blocking design in the wavelength range from 320 nm to 400 nm and UV-blocking denoting an average transmittance of not more than 20%. ### Claim 20 (depends on 1) The method according to claim 1, wherein the hotmelt adhesive has a water vapor transmission rate of less than 80 g/m2·d and/or in that the hotmelt adhesive has an oxygen transmission rate of less than 8000 g/m2·d·bar. ### Claim 21 (depends on 20) The method according to claim 20, wherein the hotmelt adhesive is designed as an adhesive tape having a carrier having a water vapor transmission rate of not more than 10−2 g/m2 d.