# US 8,771,458 B2 · Method of making wiring boards covered by thermotropic liquid crystal polymer film

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- Number: US 8,771,458 B2
- Document ID: US8771458B2
- Status: Granted
- Kind: B2
- Application number: 11/996,874
- Filed: 2006-07-19
- Published: 2009-03-12
- Granted: 2014-07-08
- Earliest claimed: 2005-07-27
- Assignees: Kuraray Co., Ltd.
- Applicants: Minoru Onodera; Tadao Yoshikawa
- Inventors: Minoru Onodera; Tadao Yoshikawa
- Web page: https://patentgrep.com/patent/US8771458B2

## CPC

- H05K 3/281: {by means of a preformed insulating foil (H05K3/284 takes precedence)}
- B32B 27/36: comprising polyesters
- B32B 2307/54: Yield strength; Tensile strength
- H05K 2201/0141: Liquid crystal polymer [LCP]
- H05K 2203/068: Features of the lamination press or of the lamination process, e.g. using special separator sheets
- H05K 2203/163: Monitoring a manufacturing process
- Y10T 428/15: Sheet, web, or layer weakened to permit separation through thickness
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The object of the invention is to provide a wiring board having the uniform quality at a high yield which is produced by hot-pressing and laminating on a wiring board base material a thermotropic liquid crystal polymer which is excellent as a wiring board covering material. The present invention provides a method of making a wiring board comprising: hot-pressing and laminating a thermotropic liquid crystal polymer film on a wiring board base material on the surface of which at least one layer containing a electro-conductive circuit is exposed, characterized by that a viscoelastic characteristic of the thermotropic liquid crystal polymer film is measured at a low frequency within a laminating temperature region and the hot-pressing is carried out at a temperature selected so that the viscoelastic characteristic falls within a predetermined range.

## Claims

### Claim 1

A method of making a wiring board, comprising:
measuring an apparent melt viscosity of a thermotropic liquid crystal polymer of a thermotropic liquid crystal polymer film on a lot to lot basis; and
if the measured apparent melt viscosity of a lot is not in the range of from 1×104 to 2×105 Pa-s at a temperature from 240 to 350° C., heat treating the thermotropic liquid crystal polymer film of the lot not in the range to adjust the apparent melt viscosity of the thermotropic liquid crystal polymer of the heat treated lot to a value in the range of from 1×104 to 2×105 Pa-s, at a temperature from 240 to 350° C.;
then laminating the thermotropic liquid crystal polymer film on a wiring board material having one layer, containing an exposed electroconductive circuit; and
hot pressing the thermotropic liquid crystal polymer film and the wiring board material having one layer together to provide the wiring board;
wherein
a temperature of the hot pressing is a temperature in the range from 240 to 350° C., and
the apparent melt viscosity is measured at a frequency of 1 Hz.

### Claim 2 (depends on 1)

The method as claimed in claim 1, wherein a temperature of the heat treatment is equal to or higher than a melting point of the thermotropic liquid crystal polymer or at a temperature within a range of a value lower by 20° C. than the melting point to a value equal to the melting point of the thermotropic liquid crystal polymer.

### Claim 3 (depends on 1)

The method as claimed in claim 1, wherein the wiring board material comprises a base material polymer, which is a thermotropic liquid crystal polymer, and
the apparent melt viscosity of the thermotropic liquid crystal polymer of the thermotropic liquid crystal polymer film is lower than the apparent melt viscosity of the thermotropic liquid crystal polymer of the wiring board material at the hot pressing temperature.

### Claim 4 (depends on 1)

The method as claimed in claim 1, wherein
the thermotropic liquid crystal polymer film hot pressed to the wiring board is a laminated film having at least two layers,
an apparent melt viscosity of the thermotropic liquid crystal polymer forming a film adjoining the wiring board material, is lower than an apparent melt viscosity of the thermotropic liquid crystal polymer film of the other of the at least two layers, and
the apparent melt viscosity of the thermotropic liquid crystal polymer film adjoining the wiring board material is within the range of 1×104 to 2×105 Pa-s.

### Claim 5 (depends on 1)

The wiring board making process as claimed in claim 1, wherein the apparent melt viscosity of the thermotropic liquid crystal polymer and/or film is measured on a lot-by-lot basis, wherein the thermotropic liquid crystal polymer and/or film has no substantial difference in melting point on a lot-by-lot basis.