# US 8,771,442 B2 · Cyclic olefin compositions for temporary wafer bonding

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,771,442 B2
- Document ID: US8771442B2
- Status: Granted
- Kind: B2
- Application number: 13/548,674
- Filed: 2012-07-13
- Published: 2012-11-22
- Granted: 2014-07-08
- Earliest claimed: 2008-10-31
- Assignees: Brewer Science Inc.
- Applicants: Wenbin Hong; Dongshun Bai; Tony D. Flaim; Rama Puligadda
- Inventors: Wenbin Hong; Dongshun Bai; Tony D. Flaim; Rama Puligadda
- Web page: https://patentgrep.com/patent/US8771442B2

## CPC

- H10P 10/128: {by direct semiconductor to semiconductor bonding}
- C08L 65/00: Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain (C08L7/00 - C08L57/00, C08L61/00 take precedence); Compositions of derivatives of such polymers
- C09J 123/0823: {Copolymers of ethene with aliphatic cyclic olefins}
- H10P 72/74: {using temporarily an auxiliary support}
- C08G 2261/332: containing only carbon atoms
- C08G 2261/418: Ring opening metathesis polymerisation [ROMP]
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/7422: {used to protect an active side of a device or wafer}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- Y10T 156/10: Methods of surface bonding and/or assembly therefor
- Y10T 156/1153: Temperature change for delamination [e.g., heating during delaminating, etc.]
- Y10T 428/24355: Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
- Y10T 428/24802: Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

## Claims

### Claim 1

A wafer bonding method comprising:
applying a bonding composition to at least one of a first substrate and a second substrate by spin-coating, said layer being a void-free and uniform material across its thickness formed of the same composition; and
bonding the first and second substrates together via the bonding layer,
wherein the bonding layer is applied in that the thickness T of the bonding layer varies by less than 20% and more than 9% across the length of the second substrate.

### Claim 2 (depends on 1)

The method of claim 1, wherein the first substrate is an active wafer with an active surface comprising topographical features, on which the layer is applied.

### Claim 3 (depends on 2)

The method of claim 2, wherein the bonding composition flows into and over the topographical features.

### Claim 4 (depends on 2)

The method of claim 2, wherein the bonding layer forms a uniform layer over the topography of the active surface.

### Claim 5 (depends on 1)

The method of claim 1, wherein said composition comprises a first cycloolefin copolymer dispersed or dissolved in a solvent system and a second cycloolefin copolymer, wherein a tackifier is not present in said composition.

### Claim 6

A wafer bonding method comprising:
applying a bonding composition to at least one of a first substrate and a second substrate by spin-coating, said layer being a uniform material across its thickness formed of the same composition, wherein the bonding layer is applied in that the thickness T of the bonding layer varies by less than 20% and more than 9% across the length of the coated substrate, and
bonding the first and second substrate together via the bonding layer.