# US 8,771,436 B2 · Electronic device and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,771,436 B2 - Document ID: US8771436B2 - Status: Granted - Kind: B2 - Application number: 13/561,266 - Filed: 2012-07-30 - Published: 2012-11-29 - Granted: 2014-07-08 - Earliest claimed: 2009-05-15 - Assignees: Cyntec Co., Ltd. - Applicants: Wen-Hsiung Liao; Roger Hsieh; Hideo Ikuta; Yueh-Lang Chen - Inventors: Wen-Hsiung Liao; Roger Hsieh; Hideo Ikuta; Yueh-Lang Chen - Web page: https://patentgrep.com/patent/US8771436B2 ## CPC - H01F 27/255: made from particles (H01F27/26 takes precedence) - B22F 3/12: Both compacting and sintering (by forging B22F3/17) - B22F 3/16: in successive or repeated steps - B22F 5/00: Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product - B22F 7/08: with one or more parts not made from powder {(B22F7/062 takes precedence)} - H01F 1/22: pressed, sintered, or bound together - H01F 3/08: made from powder (powder coatings on sheets H01F3/02; on strips or ribbons H01F3/04; on wires H01F3/06) - H01F 5/00: Coils (superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00) - H01F 17/04: with magnetic core - H01F 27/24: Magnetic cores - H01F 27/2823: {Wires (H01F27/2866 takes precedence)} - H01F 27/32: Insulating of coils, windings, or parts thereof - H01F 41/0246: {Manufacturing of magnetic circuits by moulding or by pressing powder (magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36)} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H01F 27/292: {Surface mounted devices} - H01F 2017/048: {with encapsulating core, e.g. made of resin and magnetic powder} - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - B22F: WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy C22C); APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic device including a magnetic body and a wire is provided. The magnetic body has a first magnetic powder and a second magnetic powder mixed with the first magnetic powder. The Vicker's Hardness of the first magnetic powder is greater than that of the second magnetic powder and the mean particle diameter of the first magnetic powder is greater than that of the second magnetic powder. ## Claims ### Claim 1 An electronic device, comprising: a magnetic body made of a heated mixture of an adhesive, a first magnetic powder, and a second magnetic powder that is heated at a temperature lower than 300° C. such that the adhesive is solidified and joins the heated first magnetic powder and the heated second magnetic powder; and a wire, wherein the Vicker's Hardness of the first magnetic powder is greater than the Vicker's Hardness of the second magnetic powder, the mean particle diameter of the first magnetic powder is larger than the mean particle diameter of the second magnetic powder, and the first magnetic powder mixes with the second magnetic powder, wherein a material of the first magnetic powder comprises amorphous alloy, and a material of the second magnetic powder comprises iron. ### Claim 2 (depends on 1) The electronic device according to claim 1, wherein the Vicker's Hardness of the first magnetic powder is greater than or equal to 150 and the Vicker's Hardness of the second magnetic powder is smaller than or equal to 100. ### Claim 3 (depends on 1) The electronic device according to claim 1, wherein the Vicker's Hardness of the first magnetic powder is greater than or equal to 250 and the Vicker's Hardness of the second magnetic powder is smaller than or equal to 80. ### Claim 4 (depends on 1) The electronic device according to claim 1, wherein the mean particle diameter of the first magnetic powder is substantially 10 μm to 40 μm. ### Claim 5 (depends on 1) The electronic device according to claim 1, wherein the mean particle diameter of the second magnetic powder is smaller than or equal to 10 μm. ### Claim 6 (depends on 5) The electronic device according to claim 5, wherein the mean particle diameter of the second magnetic powder is smaller than or equal to 4 μm. ### Claim 7 (depends on 1) The electronic device according to claim 1, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is larger than 2. ### Claim 8 (depends on 1) The electronic device according to claim 1, wherein the ratio of the mean particle diameter of the first magnetic powder to the mean particle diameter of the second magnetic powder is 2.5-10. ### Claim 9 (depends on 1) The electronic device according to claim 1, wherein the ratio of the weight of the first magnetic powder to the weight of the second magnetic powder is 0.25-4. ### Claim 10 (depends on 1) The electronic device according to claim 1, wherein the ratio of the weight of the first magnetic powder to the weight of the second magnetic powder is 0.67-1.5. ### Claim 11 (depends on 1) The electronic device according to claim 1, wherein the wire comprises a buried part buried in the magnetic body or a winding part winding on the magnetic body. ### Claim 12 (depends on 1) The electronic device according to claim 1, wherein the magnetic body is manufactured by a molding process, and the molding pressure of the molding process is 6 t/cm2-11 t/cm2. ### Claim 13 (depends on 1) The electronic device according to claim 1, wherein the content of the adhesive is 2 wt %-3 wt % of the total weight of the magnetic body.