# US 8,771,031 B2 · Method of manufacturing organic light-emitting display apparatus and encapsulation sheet used in the method

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- Number: US 8,771,031 B2
- Document ID: US8771031B2
- Status: Granted
- Kind: B2
- Application number: 13/312,063
- Filed: 2011-12-06
- Published: 2012-10-18
- Granted: 2014-07-08
- Earliest claimed: 2011-04-12
- Assignees: Samsung Display Co., Ltd.
- Applicants: Seung-Kyu Park
- Inventors: Seung-Kyu Park
- Web page: https://patentgrep.com/patent/US8771031B2

## CPC

- H10K 59/131: Interconnections, e.g. wiring lines or terminals
- H10K 59/871: {Self-supporting sealing arrangements}
- H10K 71/851: {Division of substrate}
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES

## Abstract

A method of manufacturing an organic light-emitting display apparatus includes: preparing a substrate including a display unit and peripheral parts; forming a cutting line on an encapsulation sheet to correspond to a boundary line between the display unit and the peripheral parts, wherein a size of the encapsulation sheet corresponds to that of the substrate; adhering the substrate and the encapsulation sheet together; removing the peripheral parts of the substrate; and cutting the encapsulation sheet along the cutting line. According to the method, a step height is not generated between the substrate and the encapsulation sheet when cutting the substrate and thus cracks may be avoided. Accordingly, products may be stably produced.

## Claims

### Claim 1

A method of manufacturing an organic light-emitting display apparatus,
the method comprising:
preparing a substrate comprising a display unit and peripheral parts surrounding the display unit;
forming a cutting line on an encapsulation sheet to correspond to a boundary line between the display unit and the peripheral parts, wherein a size of the encapsulation sheet corresponds to that of the substrate;
adhering the substrate and the encapsulation sheet together;
removing the peripheral parts of the substrate; and
cutting the encapsulation sheet along the cutting line.

### Claim 2 (depends on 1)

The method of claim 1, wherein the encapsulation sheet comprises an insulating base film and metal wirings on at least one surface of the base film so as to form a conductive path connecting the display unit and a power source.

### Claim 3 (depends on 2)

The method of claim 2, wherein the metal wirings are completely removed at the cutting line and the base film is partially punched.

### Claim 4 (depends on 2)

The method of claim 2, wherein the metal wirings are completely removed at the cutting line and the base film is not punched.

### Claim 5 (depends on 2)

The method of claim 2, wherein the metal wirings and the base film are all partially punched at the cutting line.

### Claim 6 (depends on 2)

The method of claim 2, wherein the substrate comprises a plurality of cells, each of the cells comprising the display unit and the cutting line surrounding the display unit.

### Claim 7 (depends on 1)

The method of claim 1, wherein the substrate comprising the peripheral parts has the same size as that of the encapsulation sheet comprising the cutting line.