High bandwidth connector
AssigneeAmphenol Corporation
InventorsPrescott B. Atkinson, Mark W. Gailus, Mark G. Hanrahan
Life of this patent
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AssigneeAmphenol Corporation
InventorsPrescott B. Atkinson, Mark W. Gailus, Mark G. Hanrahan
Estimating the term…
An improved open pin field connector is provided for enhanced performance when carrying high speed signals by selective application of one or more techniques for controlling electrical performance parameters. Lossy material may be positioned adjacent to conductive elements of the connector so as to reduce resonance in pairs of conductive elements and/or to provide a desired characteristic impedance for pairs of differential signal conductors. The lossy material may be shaped and positioned to avoid capacitive coupling that might otherwise increase cross talk. In a right angle connector, the lossy material may have a step-wise increase in thickness to provide comparable loss along longer and shorter conductive elements. Conductive elements may be shaped to balance performance characteristics of pairs selected to carry differential signals regardless of orientation along a row or column. Alternatively, conductive elements may have narrowed regions, covered with lossy portions, for reducing resonance while supporting DC signal propagation.
An electrical connector, comprising:
An electrical connector comprising:
An electrical connector, comprising:
An electrical connector, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Impedance matching: by variation of conductive properties, e.g. by dimension variations
High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]: shield material
Coupling devices mounted on the edge of the printed circuits: containing contact members forming a right angle
Printed circuits including an angle between each other: printed circuits being substantially perpendicular to each other
About 5 years 2 months of term left · ends 16 Dec 2031 (estimated)
1. Field
Aspects described relate generally to electrical interconnection systems and more specifically to improved signal integrity in interconnection systems.
2. Discussion of Related Art
The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures is represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing. In the drawings:
FIG. 1 is a perspective view of an electrical interconnection system in accordance with some embodiments;
FIG. 2 is another perspective, partially exploded view of a connector within an electrical interconnection system in accordance with some embodiments;
The inventors have recognized and appreciated that an open pin field connector with desirable electrical and mechanical properties may be achieved through the use of one or more construction techniques.
These techniques may be used in a suitable combination that may simultaneously provide desired impedance, cross talk, insertion loss or other electrical properties for signal paths through a connector. In some embodiments, these techniques may be applied to an open pin field connector such that one or more of these electrical properties may be uniform, to within some tolerance, for any signal conductors within the connector. As a specific example, techniques as described herein may be used to provide an open pin field connector, constructed in accordance with the HM standard, that provides a characteristic impedance with acceptable cross talk and insertion loss over a frequency range that is sufficient to support data rates at 10 Gbps or greater, regardless of which pair of adjacent conductors are selected to carry such a signal.
These construction techniques may include the selective placement of lossy materials. The inventors have recognized that, in some cases, for connectors that are used for signals having frequency components that are over approximately 1 GHz, undesirable resonances may be present. Such resonances may involve standing wave patterns of voltages and currents, particularly in conductors that are assigned as ground return conductors. Resonances present in such conductors may produce effects such as dips in signal magnitude versus frequency transmission response, peaks in signal reflection and crosstalk responses, and peaks in radiated electromagnetic emissions from the equipment incorporating the connector.