# US 8,770,988 B2 · Connector

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- Number: US 8,770,988 B2
- Document ID: US8770988B2
- Status: Granted
- Kind: B2
- Application number: 13/498,236
- Filed: 2010-10-05
- Published: 2012-07-19
- Granted: 2014-07-08
- Earliest claimed: 2009-10-05
- Assignees: Yazaki Corporation
- Applicants: Koji Furukawa
- Inventors: Koji Furukawa
- Web page: https://patentgrep.com/patent/US8770988B2

## CPC

- H01R 43/24: Assembling by moulding on contact members
- H01R 13/6658: {on printed circuit board (H01R13/6666 - H01R13/6691 take precedence)}
- H01R 13/5216: {characterised by the sealing material, e.g. gels or resins}
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

To provide a connector embedded with a substrate which can be fabricated with fewer working process at a lower cost. A connector 10 includes a substrate 1 with an electronic component 3 mounted thereon, a terminal 4 which is electrically connected to the substrate 1, and a housing 5 comprised of synthetic resin and attached with the substrate 1 and the terminal 4. In addition, the electronic component 3 and the terminal 4 are electrically connected to the substrate 1 by reflow soldering using a lead-free solder 2. The connector 10 is fabricated by insert-molding the substrate 1 and the terminal 4 in the housing 5. Furthermore, the substrate 1 and the electronic component 3 are embedded in the synthetic resin of the housing 5.

## Claims

### Claim 1

A connector comprising:
a substrate on which an electronic component is mounted;
a terminal which is electrically connected to the substrate; and
a housing comprised of a synthetic resin, to which the substrate and the terminal are attached;
wherein the electronic component mounted on the substrate and a solder junction portion between the electronic component and the terminal are coated by a liquid curable resin, and the substrate and the terminal are insert-molded in the housing,
wherein a linear coefficient expansion of the liquid curable resin is intermediate between a linear coefficient expansion of a material constituting the substrate and a linear coefficient expansion of the synthetic material constituting the housing.