# US 8,770,805 B2 · Backlight module for liquid crystal display and liquid crystal display

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- Number: US 8,770,805 B2
- Document ID: US8770805B2
- Status: Granted
- Kind: B2
- Application number: 13/380,871
- Filed: 2011-12-03
- Published: 2013-11-07
- Granted: 2014-07-08
- Earliest claimed: 2011-07-18
- Assignees: Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Applicants: Kuang-yao Chang; Jianfa Huang; Chechang Hu
- Inventors: Kuang-yao Chang; Jianfa Huang; Chechang Hu
- Web page: https://patentgrep.com/patent/US8770805B2

## CPC

- G02F 1/133603: {with LEDs}
- G02B 6/0085: {Means for removing heat created by the light source from the package}
- G02F 1/133615: {Edge-illuminating devices, i.e. illuminating from the side}
- G02B 6/0073: {Light emitting diode [LED]}
- G02F 1/133628: {with cooling means}
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

The utility model discloses a backlight module for a liquid crystal display device and a liquid crystal display device. The backlight module comprises an LED and a backplane, wherein the backlight module also comprises a heatsink plate arranged on the outer of the backplane; and the LED is linked with the heatsink plate in the mode of heat conduction. The utility model, by arranging the LED on an extra heatsink plate which is arranged on the outer of the backplane, dissipates outward the heat emitted by the LED through the heatsink plate, lowers the temperature of the backlight cavity, and protects the optical components. At the same time, because the backplane is not directly used to dissipate heat, the gradient of temperature distribution on the backplane is reduced, thus, the gradient of temperature distribution in the backlight cavity is reduced and stress of the backlight cavity induced by the temperature gradient is also reduced.

## Claims

### Claim 1

A backlight module for a liquid crystal display device, comprising: an LED, a light guide plate, and a backplane directly contacts with the light guide plate; said backlight module also comprises a heatsink plate arranged on the outside of the backplane; and said LED is linked with the heatsink plate in a mode of heat conduction; wherein an isolating layer is arranged between said heatsink plate and said backplane, and said isolating layer is an air layer, wherein the thickness range of said air layer is from 0.5 mm to 4 mm.

### Claim 2 (depends on 1)

The backlight module for the liquid crystal display device of claim 1, wherein said isolating layer is of a heat-insulating material arranged between said heatsink plate and said backplane.

### Claim 3 (depends on 2)

The backlight module for the liquid crystal display device of claim 2, wherein said heat-insulating material is of the material that the coefficient of thermal conductivity is less than 1 W/mK.

### Claim 4 (depends on 2)

The backlight module for the liquid crystal display device of claim 2, wherein said heat-insulating material is of a foamed plastic.

### Claim 5 (depends on 1)

The backlight module for the liquid crystal display device of claim 1, wherein said backlight module also comprises a conduction plate for fixing the LED; said LED is linked with the heatsink plate in the mode of heat conduction through the conduction plate; said conduction plate and said heatsink plate are formed by bending one plate; said conduction plate is perpendicular to the backplane; and said heatsink plate is parallel to the backplane.

### Claim 6 (depends on 1)

The backlight module for the liquid crystal display device of claim 1, wherein said backlight module comprises a PCB circuit board; said LED is directly arranged on the PCB circuit board; and said LED is arranged on the heatsink plate through the PCB circuit board.

### Claim 7

A liquid crystal display device, comprising: a backlight module, the backlight module comprises an LED, a light guide plate, and a backplane directly contacts with the light guide plate; said backlight module also comprises a heatsink plate arranged on the outside of the backplane; and said LED is linked with said heatsink plate in the mode of heat conduction; wherein an isolating layer is arranged between said heatsink plate and said backplane, and said isolating layer is an air layer, wherein the thickness range of said air layer is from 0.5 mm to 4 mm.

### Claim 8 (depends on 7)

The liquid crystal display device of claim 7, wherein said isolating layer is of a heat-insulating material arranged between said heatsink plate and said backplane.

### Claim 9 (depends on 8)

The liquid crystal display device of claim 8, wherein said heat-insulating material is of the material that the coefficient of thermal conductivity is less than 1 W/mK.

### Claim 10 (depends on 8)

The liquid crystal display device of claim 8, wherein said heat-insulating material is of a foamed plastic.

### Claim 11 (depends on 7)

The liquid crystal display device of claim 7, wherein said backlight module also comprises a conduction plate for fixing the LED; said LED is linked with the heatsink plate in the mode of heat conduction through the conduction plate; said conduction plate and said heatsink plate are formed by bending one plate; said conduction plate is perpendicular to the backplane; and said heatsink plate is parallel to the backplane.

### Claim 12 (depends on 7)

The liquid crystal display device of claim 7, wherein said backlight module comprises a PCB circuit board; said LED is directly arranged on the PCB circuit board; and said LED is arranged on the heatsink plate through the PCB circuit board.