# US 8,770,802 B2 · LED lighting assemblies with thermal overmolding > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,770,802 B2 - Document ID: US8770802B2 - Status: Granted - Kind: B2 - Application number: 13/764,264 - Filed: 2013-02-11 - Published: 2013-06-20 - Granted: 2014-07-08 - Earliest claimed: 2005-11-29 - Assignees: GE Lighting Solutions, LLC - Applicants: GE Lighting Solutions LLC - Inventors: Jeffrey Nall; Matthew Mrakovich - Web page: https://patentgrep.com/patent/US8770802B2 ## CPC - H05K 1/0203: {Cooling of mounted components (H05K1/0272 takes precedence)} - F21K 9/90: Methods of manufacture - F21S 4/10: with light sources attached to loose electric cables, e.g. Christmas tree lights - F21S 4/20: with light sources held by or within elongate supports - F21V 3/02: characterised by the shape - F21V 3/10: characterised by coatings - F21V 3/12: the coatings comprising photoluminescent substances - F21V 9/06: for filtering out ultraviolet radiation - F21V 23/001: {the elements being electrical wires or cables} - F21V 23/005: {the substrate is supporting also the light source} - F21V 23/007: {enclosed in a casing} - F21V 23/023: {Power supplies in a casing (F21V23/003 takes precedence)} - F21V 29/70: characterised by passive heat-dissipating elements, e.g. heat-sinks - F21V 29/85: characterised by the material (liquid coolants F21V29/56) - G09F 9/33: being semiconductor devices, e.g. diodes - H05K 1/0209: {External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings} - H05K 1/181: associated with surface mounted components - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 3/32: electrically connecting electric components or wires to printed circuits - F21V 31/04: Provision of filling media - F21Y 2101/00: Point-like light sources - F21Y 2115/10: Light-emitting diodes [LED] - H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer - H05K 2201/0209: Inorganic, non-metallic particles - H05K 2201/10106: Light emitting diode [LED] - H05K 2203/1316: Moulded encapsulation of mounted components - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - Y10T 29/49146: with encapsulating, e.g., potting, etc. - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS - F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR - G09F: DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS - F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material. ## Claims ### Claim 1 A lighting assembly comprising: a printed circuit board; one or more light emitting diodes (LEDs) disposed on the printed circuit board and connectable with a power source via circuitry of the printed circuit board; the LEDs comprising a semiconductor chip disposed on a base; an overmolded housing material molded over the printed circuit board such that the printed circuit board is embedded in the housing material, the material having a melting temperature greater than about 100° C.; and said overmolded housing material terminating at a height between said printed circuit board and said LED such that said base and said semiconductor chip protrude from the overmolded housing. ### Claim 2 (depends on 1) The lighting assembly as set forth in claim 1, wherein a phosphor coats the one or more LEDs. ### Claim 3 (depends on 1) The lighting assembly as set forth in claim 1, further comprising: a light-transmissive cover disposed over one or more of the one or more LEDs and wherein the light-transmissive cover includes a phosphor. ### Claim 4 (depends on 1) The lighting assembly as set forth in claim 1, wherein the housing material does not encapsulate the one or more LEDs disposed on the printed circuit board. ### Claim 5 (depends on 1) The lighting assembly as set forth in claim 1, wherein the housing material does not cover light-emitting apertures of the one or more LEDs. ### Claim 6 (depends on 1) The lighting assembly as set forth in claim 1, wherein the lighting assembly does not include a container or housing other than the overmolded housing. ### Claim 7 (depends on 1) The lighting assembly as set forth in claim 1, further comprising: a light-transmissive cover disposed over one or more of the one or more LEDs, the housing material encapsulating the printed circuit board but not covering at least a portion of the light-transmissive cover. ### Claim 8 (depends on 7) The lighting assembly as set forth in claim 7, wherein the light-transmissive cover includes a base region disposed on the printed circuit board and wherein the housing material contacts the base region without fully covering the one or more light-transmissive covers. ### Claim 9 (depends on 1) The lighting assembly as set forth in claim 1, wherein the housing material has a melting temperature between about 310° C. and about 500° C. ### Claim 10 (depends on 1) The lighting assembly as set forth in claim 1, wherein the housing material has a melting temperature between about 310° C. and about 350° C. ### Claim 11 (depends on 1) The lighting assembly as set forth in claim 1, wherein the housing material has a thermal conductivity greater than 1 W/m·K. ### Claim 12 (depends on 1) The lighting assembly of claim 1, further comprising a plurality of flexible electrical conductors including insulation surrounding the conductors, the conductors being electrically and mechanically connected to the printed circuit board. ### Claim 13 (depends on 1) The lighting assembly of claim 1 wherein said overmolded housing material abuts the base of the LEDs.