# US 8,770,462 B2 · Solder paste transfer process

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- Number: US 8,770,462 B2
- Document ID: US8770462B2
- Status: Granted
- Kind: B2
- Application number: 13/420,355
- Filed: 2012-03-14
- Published: 2013-09-19
- Granted: 2014-07-08
- Earliest claimed: 2012-03-14
- Assignees: Raytheon Company
- Applicants: William D. Beair; Michael R. Williams; Eric Gilley
- Inventors: William D. Beair; Michael R. Williams; Eric Gilley
- Web page: https://patentgrep.com/patent/US8770462B2

## CPC

- B23K 1/0016: {Soldering of electronic components}
- B23K 3/0638: {for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence)}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM

## Abstract

A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.

## Claims

### Claim 1

A system, comprising:
a device layer surface on which multiple electrical components are disposed and multiple solder pad locations are defined remotely from the multiple electrical components; and
a solder paste transfer tool fixture including a fixture body and multiple transfer tools extending from the fixture body in an arrangement that is reflective of a formation of the multiple solder pad locations,
each of the multiple transfer tools comprising a surface onto which solder paste is applicable the surfaces being non-wettable with respect to the solder paste during an elevated temperature condition at which the solder paste is reflowable from the surfaces, and
the fixture body being disposable proximate to the device layer surface with the multiple transfer tools interleaved between the multiple electrical components and each of the respective surfaces of each of the multiple transfer tools facing corresponding ones of the multiple solder pad locations.

### Claim 2 (depends on 1)

The system according to claim 1, wherein the device layer surface is non-planar.

### Claim 3 (depends on 1)

The system according to claim 1, wherein the fixture body is affixed to at least one of the multiple electrical components.

### Claim 4 (depends on 1)

The system according to claim 1, wherein the multiple electrical components have the same shape.

### Claim 5 (depends on 4)

The system according to claim 4, wherein the multiple transfer tools have the same shape.

### Claim 6 (depends on 1)

The system according to claim 1, wherein at least one or more of the multiple electrical components has a different shape from at least another one or more of the multiple electrical components.

### Claim 7 (depends on 6)

The system according to claim 6, wherein at least one or more of the multiple transfer tools has a shape that complements the unique shape of the at least one or more of the multiple electrical components.