# US 8,769,811 B2 · Method of shielding an electronic component from electromagnetic interference (EMI) > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,769,811 B2 - Document ID: US8769811B2 - Status: Granted - Kind: B2 - Application number: 12/611,376 - Filed: 2009-11-03 - Published: 2010-02-25 - Granted: 2014-07-08 - Earliest claimed: 2008-03-31 - Assignees: Apple Inc. - Applicants: Josh Wurzel; Shawn Robert Gettemy; Ahmad Al-Dahle; Carlin James Vieri; Wei Yao - Inventors: Josh Wurzel; Shawn Robert Gettemy; Ahmad Al-Dahle; Carlin James Vieri; Wei Yao - Web page: https://patentgrep.com/patent/US8769811B2 ## CPC - H05K 9/0024: {Shield cases mounted on a PCB, e.g. cans or caps or conformal shields} - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H05K 9/0084: {comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 42/276: {the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} - H05K 1/181: associated with surface mounted components - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 2201/09872: Insulating conformal coating - H05K 2201/10689: Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL] - Y10T 29/49117: Conductor or circuit manufacturing - Y10T 29/49128: Assembling formed circuit to base - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - Y10T 29/49144: by metal fusion - Y10T 29/49146: with encapsulating, e.g., potting, etc. - Y10T 156/1052: with cutting, punching, tearing or severing - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An electronic circuit component is provided with shielding for electromagnetic interference (“EMI”) by covering at least part of the component with a layer of electrical insulation that conforms to the shape of the surface to which the insulation is applied. At least part of the surface of the insulation is then covered by a layer of EMI shielding that conforms to the shape of the surface of the insulation to which the shielding is applied. ## Claims ### Claim 1 A method of shielding an electronic circuit component from an electromagnetic interference, the method comprising: applying a layer of electrical insulation to at least part of a surface of the electronic circuit component, the layer of electrical insulation conforming to the surface to which it is applied; applying a layer of electromagnetic shielding to at least part of a surface of the layer of electrical insulation, the layer of electromagnetic shielding conforming to the surface to which it is applied, wherein the applying the layer of electrical insulation comprises: placing the component in a mold, the mold having an area that fits an end portion of a contact lead of the electronic circuit component so that the end portion of the contact lead is not overlapped by the layer of electrical insulation; and injecting the layer of electrical insulation into the mold. ### Claim 2 (depends on 1) The method defined in claim 1, wherein the applying the layer of electrical insulation comprises: applying the electrical insulation in a fluid form to the at least part of the surface of the electronic circuit component; and converting the electrical insulation to non-fluid form after it has conformed to the surface to which it is applied. ### Claim 3 (depends on 1) The method defined in claim 1, wherein the applying the layer of electromagnetic shielding comprises: applying the layer of electromagnetic shielding in a fluid form to the at least part of the surface of the insulation; and converting the layer of electromagnetic shielding to non-fluid form after it has conformed to the surface to which it is applied. ### Claim 4 (depends on 1) The method defined in claim 1, wherein the applying the layer of electromagnetic shielding comprises: removing the electronic circuit component with the layer of electrical insulation as a subassembly from the mold; placing the subassembly in a second mold; and injecting the layer of electromagnetic shielding into the second mold. ### Claim 5 (depends on 1) The method defined in claim 1, wherein the applying the layer of electromagnetic shielding comprises: placing the electronic circuit component, to which the electrical insulation has been applied, in a mold; and injecting the layer of electromagnetic shielding into the mold. ### Claim 6 (depends on 1) The method defined in claim 1, further comprising: prior to the applying the layer of electrical insulation, mounting the elctronic cirucit component on a supporting structure. ### Claim 7 (depends on 6) The method defined in claim 6, wherein the supporting structure comprises a printed circuit board. ### Claim 8 A method of shielding an electronic circuit component from electromagnetic interference, the method comprising: applying a layer of electrical insulation to at least part of a surface of the electronic circuit component, the layer of electrical insulation conforming to the surface to which it is applied; applying a layer of electromagnetic shielding to at least part of a surface of the layer of electrical insulation, the layer of electromagnetic shielding conforming to the surface to which it is applied; and mounting the electronic circuit component with the layer of electrical insulation and the layer of electromagnetic shielding on a supporting structure, wherein the applying the layer of electrical insulation further comprises: placing the electronic circuit component in a mold, the mold having an area that fits an end portion of a contact lead of the electronic circuit component so that the end portion of the contact lead is not overlapped by the layer of electrical insulation; and injecting the layer of electrical insulation into the mold. ### Claim 9 (depends on 8) The method defined in claim 8, wherein the supporting structure comprises a printed circuit board. ### Claim 10 (depends on 8) The method defined in claim 8, wherein the applying the layer of electromagnetic shielding comprises: removing the electronic circuit component and a printed subassembly from the mold; placing the printed subassembly in a second mold; and injecting the layer of electromagnetic shielding into the second mold. ### Claim 11 (depends on 8) The method defined in claim 8, wherein the applying the layer of electromagnetic shielding comprises: placing the component and the printed circuit board, to which the electrical insulation has been applied, in a mold; and injecting the layer of electromagnetic shielding into the mold. ### Claim 12 (depends on 6) The method defined in claim 6, wherein the supporting structure includes a ground contact, wherein the applying the layer of electrical insulation leaves the ground contact uncovered by the electrical insulation, and wherein the applying the layer of electromagnetic shielding causes the electromagnetic shielding to reach the ground contact. ### Claim 13 (depends on 8) The method defined in claim 8, wherein the supporting structure includes a ground contact, and wherein the mounting comprises: electrically connecting the electromagnetic shielding to the ground contact. ### Claim 14 (depends on 13) The method defined in claim 13, wherein the applying the layer of electromagnetic shielding comprises: giving the electromagnetic shielding a projection that can be used to reach the ground contact. ### Claim 15 (depends on 6) The method defined in claim 6, wherein the applying the layer of electrical insulation further comprises filling a spacing between the electronic circuit component and an adjacent electronic circuit component on the support structure with the layer of electrical insulation. ### Claim 16 (depends on 1) The method defined in claim 1, wherein the applying the layer of electrical insulation comprises contacting a solder area with the layer of electrical insulation, the solder area coupling the electronic circuit component to a supporting structure. ### Claim 17 (depends on 1) The method defined in claim 1, wherein the applying the layer of electromagnetic shielding comprises forming a layer of electromagnetic shielding extension overlapping a solder area, the solder area coupling the electronic circuit component to a supporting structure. ### Claim 18 (depends on 1) The method defined in claim 1, wherein the applying the layer of electrical insulation comprises forming an insulation portion overlapping an inner portion of an electrical lead coupled to the electronic circuit component. ### Claim 19 (depends on 8) The method defined in claim 8, further comprising: mounting a second electronic circuit component on the supporting structure adjacent to the electronic circuit component, wherein the applying the layer of electrical insulation further comprises filling a spacing between the electronic circuit component and the second electronic circuit component.