# US 8,769,810 B2 · Part mounting method

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- Number: US 8,769,810 B2
- Document ID: US8769810B2
- Status: Granted
- Kind: B2
- Application number: 12/699,958
- Filed: 2010-02-04
- Published: 2010-06-03
- Granted: 2014-07-08
- Earliest claimed: 2007-08-17
- Assignees: Fujitsu Limited
- Applicants: Toru Nishino; Kazuyuki Ikura
- Inventors: Toru Nishino; Kazuyuki Ikura
- Web page: https://patentgrep.com/patent/US8769810B2

## CPC

- H05K 13/0015: {Orientation; Alignment; Positioning}
- H10F 71/00: Manufacture or treatment of devices covered by this subclass (patterning processes to connect thin photovoltaic cells in integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/33; manufacture or treatment of encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/80; manufacture or treatment of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F39/00)
- H10F 39/804: {Containers or encapsulations}
- H10D 84/01: Manufacture or treatment
- H10F 39/80: {Constructional details of image sensors}
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 72/013: {of die-attach connectors}
- H10W 72/015: {of bond wires}
- H10W 72/0711: {Apparatus therefor}
- H10W 72/07178: {Means for aligning}
- H10W 72/07223: {Active alignment, e.g. using optical alignment using marks or sensors}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07251: {characterised by changes in properties of the bump connectors during connecting}
- H10W 72/075: {of bond wires}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 90/00: Package configurations
- Y10T 29/49117: Conductor or circuit manufacturing
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T 29/49133: with component orienting
- Y10T 29/49137: Different components
- Y10T 29/49147: Assembling terminal to base
- Y10T 29/49169: Assembling electrical component directly to terminal or elongated conductor
- Y10T 29/53174: Means to fasten electrical component to wiring board, base, or substrate
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A part mounting method of mounting first mounting parts and a second mounting part to a board includes taking an image of a configuration of the second mounting part and performing an image-recognition, mounting the first mounting parts to the board based on a result of the image-recognition of the configuration of the second mounting part, and mounting the second mounting part to the board based on a result of an image-recognition of the first mounting parts mounted to the board.

## Claims

### Claim 1

A part mounting method of mounting first mounting parts and a second mounting part to a board, comprising:
taking an image of a configuration of the second mounting part and performing an image-recognition;
mounting said first mounting parts to said board based on a result of the image-recognition of the configuration of said second mounting part; and
mounting said second mounting part to said board based on a result of an image-recognition of said first mounting parts mounted to said board,
wherein when mounting a plurality of said first mounting parts and one piece of said second mounting part to corresponding positions, the mounting is performed while determining each other's positions of said plurality of said first mounting parts on said board based on the configuration of said second mounting part detected by the image-recognition.

### Claim 2 (depends on 1)

The part mounting method as claimed in claim 1, including:
detecting a configuration by supporting said second mounting part and taking an image of a back surface thereof by a second camera;
supporting one of said first mounting parts and taking an image of a top surface thereof by a first camera and performing an image-recognition;
image-recognizing a mounting surface of said board by said first camera;
mounting said one of said first mounting parts, which has been image-recognized, to said board;
supporting another one of said first mounting parts and taking an image of a top surface thereof by said first camera and performing an image-recognition;
mounting said another one of said first mounting parts to said board based on the configuration of said second mounting part detected by said second camera; and
mounting said second mounting part to said board based on a result of an image-recognition of positions of said first mounting parts on said board.

### Claim 3 (depends on 2)

The part mounting method as claimed in claim 2, including:
after mounting said one of said first mounting parts to said board, detecting a mounting position by said first camera;
after mounting said another one of said first mounting parts to said board, detecting a mounting position by said first camera; and
reflecting results of detections of the mounting positions in mounting said second mounting part.

### Claim 4 (depends on 2)

The part mounting method as claimed in claim 2, wherein results of image-recognitions are corrected so that the positions of said first mounting parts in the image taken by said first camera and a position of said second mounting part in an image taken by said second camera are aligned with each other.

### Claim 5 (depends on 4)

The part mounting method as claimed in claim 4, wherein said first camera and said second camera are opposed to each other and an alignment mark is arranged therebetween to perform said correction by image-recognizing the alignment mark by said first camera and said second camera.

### Claim 6 (depends on 2)

The part mounting method as claimed in claim 2, wherein said second mounting part is supported and an image of a back surface thereof is taken by said second camera to detect a configuration thereof and a result of detection is saved as data, and, thereafter, the data is used when mounting another second mounting part.

### Claim 7 (depends on 1)

The part mounting method as claimed in claim 1, wherein, when picking up said first mounting part or said second mounting part from a part tray, image data is acquired by taking an image of each part by dividing an area of the part tray and combining the image data in order to create an entire image of said part tray, and a position of said first mounting part or said second mounting part is detected from the entire image.