# US 8,769,805 B2 · Method of making conductive pattern

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- Number: US 8,769,805 B2
- Document ID: US8769805B2
- Status: Granted
- Kind: B2
- Application number: 12/842,103
- Filed: 2010-07-23
- Published: 2010-11-11
- Granted: 2014-07-08
- Earliest claimed: 2003-04-11
- Assignees: Avery Dennison Corporation
- Applicants: James P. Coleman; David N. Edwards; Ian J. Forster; Pradeep S. Iyer; Mark A. Licon
- Inventors: James P. Coleman; David N. Edwards; Ian J. Forster; Pradeep S. Iyer; Mark A. Licon
- Web page: https://patentgrep.com/patent/US8769805B2

## CPC

- G06K 19/0776: {the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker}
- G06K 19/07718: {the record carrier being manufactured in a continuous process, e.g. using endless rolls}
- G06K 19/07749: {the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card}
- G06K 19/07752: {using an interposer}
- G06K 19/07779: {the inductive antenna being a coil}
- G06K 19/07783: {the coil being planar}
- H05K 3/00: Apparatus or processes for manufacturing printed circuits
- H05K 3/205: {using a pattern electroplated or electroformed on a metallic carrier}
- H05K 3/245: {Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques}
- H05K 3/386: {by the use of an organic polymeric bonding layer, e.g. adhesive}
- H05K 2203/0117: Pattern shaped electrode used for patterning, e.g. plating or etching
- Y10T 29/49016: Antenna or wave energy "plumbing" making
- Y10T 29/49018: with other electrical component
- Y10T 29/4902: Electromagnet, transformer or inductor
- Y10T 29/49117: Conductor or circuit manufacturing
- Y10T 29/49155: Manufacturing circuit on or in base
- Y10T 29/49224: with coating
- G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

## Claims

### Claim 1

A method of making an RFID device, the method comprising:
printing graphics on a front surface of a dielectric substrate;
forming a conductive pattern on a conductive substrate, the forming includes depositing a conductive ink layer onto the conductive substrate and placing a conductive material onto the conductive ink layer; and
after the printing, adhesively transferring the conductive pattern to a back surface of the dielectric substrate.

### Claim 2 (depends on 1)

The method of claim 1, wherein the adhesively transferring includes adhering the conductive pattern to an adhesive layer on the back surface of the dielectric substrate.

### Claim 3 (depends on 2)

The method of claim 2, further comprising, after the adhesively transferring, covering the adhesive layer with a release layer.

### Claim 4 (depends on 1)

The method of claim 1, further comprising operatively coupling a chip to the conductive pattern, wherein the conductive pattern functions as an antenna when coupled to the chip.

### Claim 5 (depends on 4)

The method of claim 4, wherein the chip is part of an interposer that also includes conductive leads attached to contacts of the chip.

### Claim 6 (depends on 4)

The method of claim 4, wherein the chip is coupled to the conductive pattern before the adhesively transferring.

### Claim 7 (depends on 4)

The method of claim 4, wherein the chip is coupled to the conductive pattern after the adhesively transferring.

### Claim 8 (depends on 1)

The method of claim 1, wherein the method is part of a roll-to-roll process for making a roll of RFID devices.

### Claim 9 (depends on 1)

The method of claim 1, wherein the conductive substrate is stainless steel or titanium.

### Claim 10 (depends on 1)

The method of claim 1, wherein the ink includes carbon or metal particles.

### Claim 11 (depends on 1)

The method of claim 1, wherein the graphics include words, symbol, and/or pictures.

### Claim 12 (depends on 1)

The method of claim 1, wherein, the conductive pattern is removed from the conductive substrate prior to adhesively transferring the conductive pattern to the dielectric substrate.

### Claim 13 (depends on 12)

The method of claim 12, wherein the conductive substrate and the dielectric substrate are removed from one another by a magnetic force.

### Claim 14 (depends on 1)

The method of claim 1, wherein the conductive pattern has a greater adherence to the dielectric substrate than to the conductive substrate, causing the conductive pattern to peel away from the conductive substrate.

### Claim 15 (depends on 1)

The method of claim 1, wherein the conductive substrate is flexible.

### Claim 16 (depends on 1)

The method of claim 1, wherein the conductive pattern includes all of the conductive ink layer.