Bonding structure manufacturing method, heating and melting treatment method, and system therefor
AssigneeAyumi Industry Co., Ltd.
InventorsHideyuki Abe, Kazuaki Mawatari
Life of this patent
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Abstract
A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided. A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.
Claims20
A bonding structure manufacturing method for manufacturing a bonding structure by bonding a plurality of bonded members with a heat-melting material interposed therebetween,
- the bonding structure manufacturing method comprising:
- a step of preparing the bonded members with the heat-melting material being formed on at least one of the plurality of bonded members;
- a temporary bonding step for applying a temporary bonding agent onto surfaces of the plurality of bonded members facing each other, thereby temporarily bonding the plurality of bonded members with the temporary bonding agent interposed therebetween;
- a bonding step for melting the heat-melting material without flux by performing heat treatment in an atmosphere including carboxylic acid vapor in a chamber, thereby bonding the plurality of bonded members with the heat-melting material interposed therebetween;
- and
- an evaporation step for evaporating the temporary bonding agent by heat application, which is performed before or after the bonding step or over the bonding step,
- wherein in the evaporation step, a vacuum degree in the chamber is temporarily enhanced so that the temporary bonding agent is easily evaporated.
A bonding structure manufacturing method for manufacturing a bonding structure by bonding a plurality of bonded members with a heat-melting material interposed therebetween,
- the bonding structure manufacturing method comprising:
- a step of preparing the bonded members with the heat-melting material being formed on at least one of the plurality of bonded members;
- a temporary bonding step for applying a temporary bonding agent onto surfaces of the plurality of bonded members facing each other, thereby temporarily bonding the plurality of bonded members with the temporary bonding agent interposed therebetween;
- a bonding step for melting the heat-melting material without flux by performing heat treatment in an atmosphere including carboxylic acid vapor in a chamber, thereby bonding the plurality of bonded members with the heat-melting material interposed therebetween;
- and
- an evaporation step for evaporating the temporary bonding agent by heat application, which is performed before or after the bonding step or over the bonding step,
- wherein in the evaporation step, a vacuum degree in the chamber is temporarily enhanced so that the temporary bonding agent is easily evaporated, and
- wherein the temporary bonding agent is at least one non-reducing organic agent selected from isobornyl cyclohexanol, terpineol, and propylene glycol phenyl ether.
A bonding structure manufacturing method for manufacturing a bonding structure by bonding a plurality of bonded members with a heat-melting material interposed therebetween,
- the bonding structure manufacturing method comprising:
- a step of preparing the bonded members with the heat-melting material being formed on at least one of the plurality of bonded members;
- a temporary bonding step for applying a temporary bonding agent onto surfaces of the plurality of bonded members facing each other, thereby temporarily bonding the plurality of bonded members with the temporary bonding agent interposed therebetween;
- a bonding step for melting the heat-melting material without flux by performing heat treatment in an atmosphere including carboxylic acid vapor in a chamber, thereby bonding the plurality of bonded members with the heat-melting material interposed therebetween;
- and
- an evaporation step for evaporating the temporary bonding agent by heat application, which is performed before or after the bonding step or over the bonding step,
- wherein in the evaporation step, a vacuum degree in the chamber is temporarily enhanced so that the temporary bonding agent is easily evaporated, and
- wherein the temporary bonding agent is diluted with a viscosity modifier so that a viscosity thereof becomes 1×102 to 1×105 mPa·s.
Dependencies are inferred from the claim text.