Method and apparatus for removing photoresist

An apparatus for removing photoresist from a wafer, the apparatus comprising:

• a first chamber for generating a plasma from a process gas, the first chamber having a gas inlet;
• a gas source in fluid connection with the gas inlet, for providing the process gas containing sulfur (S), oxygen (O), and hydrogen (H) into the first chamber;
• a second chamber for placing the wafer having a patterned photoresist layer thereon;
• a solvation zone provided in a passage of a reaction medium in the second chamber flowing down from the plasma toward the wafer;
• a water vapor source connected to a water vapor inlet provided to the second chamber, the water vapor inlet introducing water vapor in the solvation zone and causing the water vapor to enter a flow of the reaction medium in the solvation zone, the water vapor inlet having a condensation orifice to ensure mild condensation;
• and
• a water vapor inlet controller configured to control a pressure differential between a gas feed line of the water vapor and the solvation zone where the water vapor is injected such that the water vapor condenses as clusters around species of the reaction medium to form solvated clusters of the species in the solvation zone before the reaction medium reaches the wafer.