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US 8,757,134 B2Granted
Wafer dicing blade and wafer dicing apparatus including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYoung-Ja Kim, Junyoung Ko
Life of this patent
Estimating the term…
Abstract
A wafer dicing blade includes a cutting part including a protrusion, the protrusion having a uniform region with a substantially uniform width, and a support covering at least one sidewall of the cutting part, the protrusion of the cutting part extending beyond an edge of the support.
Claims19
A wafer dicing blade, comprising:
- a cutting part including a main part and a protrusion extending from the main part, the protrusion having a same width as the main part and a uniform region with a substantially uniform width;
- and
- a support covering at least one sidewall of the main part of the cutting part, the protrusion of the cutting part extending beyond an edge of the support,
- wherein the support includes first and second portions covering two opposite sidewalls of the cutting part, the first and second portions of the support being symmetrical with respect to the cutting part and integral with each other.
1 more element
A wafer dicing blade, comprising:
- a cutting part having a substantially uniform width;
- and
- a support at least partially surrounding the cutting part, the support extending to a predetermined length along a longitudinal direction of the cutting part, and a portion of the cutting part extending beyond an edge of the support along the longitudinal direction of the cutting part and being configured to cut a wafer,
- wherein the support includes first and second portions covering two opposite sidewalls of the cutting part, the first and second portions of the support being symmetrical with respect to the cutting part and integral with each other.
1 more element
A wafer dicing apparatus, comprising:
- a base configured to support a wafer;
- a rotatable frame over the base;
- a wafer dicing blade on the rotatable frame, the wafer dicing blade including:
- a cutting part with a protrusion, the protrusion having a uniform region with a substantially uniform width, and
- a support covering at least one sidewall of the cutting part, the protrusion of the cutting part extending beyond an edge of the support;
- and
- a length maintaining device including a recess region, a width of the recess region being larger than that of the uniform region of the protrusion and smaller than an entire width of the wafer dicing blade, the entire width of the wafer dicing blade being a sum of a width of the support and a width of the cutting part.
4 more elements
Dependencies are inferred from the claim text.