Method for manufacturing printed wiring board
AssigneeIbiden Co., Ltd.
InventorsToru Nakai, Tetsuo Amano, Yoshinori Takasaki
Life of this patent
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Abstract
A method for manufacturing a printed wiring board including forming an insulative resin layer containing a resin and an inorganic filler, forming a conductor layer including a conductive material and having a conductor on the insulative resin layer, irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed, and forming a conductive pattern on the insulative resin layer. The inorganic filler is in an amount of 30 wt. % or more of the insulative resin layer.
Claims22
A method for manufacturing a printed wiring board, comprising:
- forming an insulative resin layer comprising a resin and an inorganic filler, the inorganic filler being in an amount of 30 wt. % or more of the insulative resin layer;
- forming a conductor layer comprising a conductive material and having a conductor on the insulative resin layer;
- irradiating a laser beam upon the conductor of the conductor layer such that the conductor is sectioned or a width of the conductor is narrowed;
- and
- forming a conductive pattern on the insulative resin layer.
Dependencies are inferred from the claim text.