Electronic component mounting method

An electronic component mounting method including causing paste in a paste retaining section that bonds an electronic component to a substrate to adhere to a stamping pin provided on a stamping head and stamping the paste to the substrate, and mounting the electronic component held by a mounting head to the substrate on which the paste has been stamped;

• wherein the paste retaining section has at least two concentrically-arranged annular reservoirs that are integrally formed with each other, a reservoir rotation section for rotating the reservoirs, a squeegee shielding cross sections of at least one of the reservoirs, and a clearance regulation section adjusting clearance between the squeegee and a bottom wall of the at least one of reservoirs;
• wherein the at least two reservoirs include at least one vacant reservoir where no paste is present;
• wherein the method comprises:
• removing and stamping the paste remaining on the stamping pin to the bottom wall of the at least one vacant reservoir;
• forming the paste retained in the at least one of the reservoirs to a predetermined film thickness by the clearance regulation section;
• causing the paste formed into a film to adhere to the stamping pin;
• stamping the paste to the substrate;
• and
• mounting the electronic components held by the mounting head to the substrate on which the paste has been stamped.