Method of adjustment during manufacture of a circuit having a capacitor

A method, comprising:

• forming a BAW resonator on a substrate;
• and
• forming a capacitor on the substrate, wherein forming the capacitor includes:
• forming a first electrode substantially parallel to a surface of the substrate and covering the first electrode with a dielectric layer having first and second portions over the first electrode;
• forming, on the first portion of the dielectric layer, a second electrode that does not cover the second portion;
• measuring an electrical signal between the first electrode and the second electrode and deducing from the measured electrical signal a deduced capacitance to obtain a desired capacitance;
• in response to deducing the deduced capacitance from the measured electrical signal, thinning down the second portion of the dielectric layer to a thickness configured to form the deduced capacitance;
• and
• forming a third electrode on the second portion and connecting the third electrode to the second electrode.

A method, comprising:

• forming an encapsulated chip structure that includes a first capacitor having first and second electrodes;
• and
• forming a second capacitor on an outer surface of the encapsulated chip structure, wherein forming the second capacitor includes:
• forming a first electrode substantially parallel to the outer surface of the encapsulated chip structure and coupled to the first electrode of the first capacitor;
• covering the first electrode with a dielectric layer having first and second portions over the first electrode;
• forming, on the first portion of the dielectric layer, a second electrode that does not cover the second portion of the dielectric layer and is coupled to the second electrode of the first capacitor;
• measuring an electrical signal between the first electrode and the second electrode of the second capacitor, and deducing from the electrical signal a deduced capacitance to obtain a desired capacitance;
• in response to deducing the deduced capacitance from the measured electrical signal, thinning down the second portion of the dielectric layer to a thickness configured to form the deduced capacitance;
• and
• forming a third electrode on the second portion and connecting the third electrode to the second electrode of the second capacitor.