Solventless addition-curable pressure sensitive silicone adhesive composition and adhesive article
AssigneeShin-Etsu Chemical Co., Ltd.
InventorShunji Aoki
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AssigneeShin-Etsu Chemical Co., Ltd.
InventorShunji Aoki
Estimating the term…
A solventless addition-curable pressure sensitive silicone adhesive composition is provided. The composition comprises (A) an alkenyl group-containing polydiorganosiloxane; (B) a condensation product of (a) a polydiorganosiloxane having hydroxyl group or an alkoxy group on opposite ends of the molecular chain and (b) a polyorganosiloxane containing R13SiO1/2 unit and SiO2 unit as critical components and also a HOSiO3/2 unit in the molecule; (C1) a polyorganohydrosiloxane having at least three SiH groups per molecule; (C2) a polydiorganohydrosiloxane having SiH group on opposite ends; and (D) a platinum group metal catalyst. Use of the present composition enables production of a pressure sensitive adhesive agent having flexibility, pressure sensitive adhesiveness, and heat resistance, and the present composition is particularly effective for use as a buffer member having pressure sensitive adhesiveness.
A solventless addition-curable pressure sensitive silicone adhesive composition, consisting of:
A solventless addition-curable pressure sensitive silicone adhesive composition, consisting of:
A solventless addition-curable pressure sensitive silicone adhesive composition, comprising:
Dependencies are inferred from the claim text.