# US 8,752,210 B2 · Implementing data theft prevention > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,752,210 B2 - Document ID: US8752210B2 - Status: Granted - Kind: B2 - Application number: 13/347,227 - Filed: 2012-01-10 - Published: 2013-07-11 - Granted: 2014-06-10 - Earliest claimed: 2012-01-10 - Assignees: International Business Machines Corporation - Applicants: Dylan J. Boday; Joseph Kuczynski, II; Jason T. Wertz; Jing Zhang - Inventors: Dylan J. Boday; Joseph Kuczynski, II; Jason T. Wertz; Jing Zhang - Web page: https://patentgrep.com/patent/US8752210B2 ## CPC - G06F 21/88: Detecting or preventing theft or loss - G06F 2221/2143: Clearing memory, e.g. to prevent the data from being stolen - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) ## Abstract A method and circuit for implementing data theft prevention, and a design structure on which the subject circuit resides are provided. A polymeric resin containing microcapsules surrounds a security card. Each microcapsule contains a conductive material. The conductive material of the microcapsule provides shorting on the security card responsive to the polymer resin and the microcapsule being breached, and a data theft prevention function using the shorting by the conductive material to prevent data theft. ## Claims ### Claim 1 A circuit for implementing data theft prevention comprising: a security card; a polymeric resin containing a plurality of microcapsules surrounding said security card; each said microcapsule contains a conductive material; said conductive material of said microcapsule shorting on the security card responsive to said polymer resin and at least one said microcapsule being breached, and a data theft prevention function to prevent data theft responsive to shorting by said conductive material. ### Claim 2 (depends on 1) The circuit as recited in claim 1 wherein said plurality of microcapsules are coated on the security card, and the security card is encapsulated with said polymeric resin over the microcapsules. ### Claim 3 (depends on 1) The circuit as recited in claim 1 wherein said plurality of microcapsules are dispersed through out the polymeric resin and the security card is encapsulated in the polymeric resin. ### Claim 4 (depends on 1) The circuit as recited in claim 1 wherein said polymer resin and at least one said microcapsule being breached includes said polymer resin and at least one said microcapsule being punctured, gouged, scratched, or scraped for releasing said conductive material of said microcapsule. ### Claim 5 (depends on 1) The circuit as recited in claim 1 wherein said data theft prevention function detects shorting and shuts down the power to said security card. ### Claim 6 (depends on 1) The circuit as recited in claim 1 wherein said data theft prevention function detects shorting and erases data of said security card. ### Claim 7 (depends on 1) The circuit as recited in claim 1 wherein said security card is a security daughter card, and said data theft prevention function detects shorting on said security daughter card and renders said security daughter card unusable. ### Claim 8 (depends on 7) The circuit as recited in claim 7 wherein said security card includes a primary card and wherein said data theft prevention function detects shorting on said security daughter card and renders said primary card unusable. ### Claim 9 A design structure embodied in a non-transitory machine readable medium used in a design process, the design structure comprising: a circuit tangibly embodied in the non-transitory machine readable medium used in the design process, said circuit for implementing data theft prevention, a sequence of computer-executable steps recorded on the non-transitory machine-readable medium and capable of said design structure implementing said circuit comprising: providing a security card; surrounding said security card with a polymeric resin containing a plurality of microcapsules; providing each said microcapsule contains a conductive material; said conductive material of said microcapsule shorting on the security card responsive to said polymer resin and at least one said microcapsule being breached, and providing a data theft prevention function used to prevent data theft responsive to shorting by said conductive material, wherein the design structure, when read and used in the manufacture of a semiconductor chip produces a chip comprising said circuit. ### Claim 10 (depends on 9) The design structure of claim 9, wherein the design structure comprises a netlist, which describes said circuit. ### Claim 11 (depends on 9) The design structure of claim 9, wherein the design structure resides on storage medium as a data format used for the exchange of layout data of integrated circuits. ### Claim 12 (depends on 9) The design structure of claim 9, wherein the design structure includes at least one of test data files, characterization data, verification data, or design specifications. ### Claim 13 A method for implementing data theft prevention comprising: providing a security card; surrounding said security card with a polymeric resin containing a plurality of microcapsules; providing each said microcapsule containing a conductive material; shorting on the security card with said conductive material of said microcapsule responsive to the polymer resin and said microcapsule being breached, and using the shorting by said conductive material to prevent data theft. ### Claim 14 (depends on 13) The method as recited in claim 13 includes manufacturing said plurality of microcapsules with each said microcapsule with a conductive material. ### Claim 15 (depends on 14) The method as recited in claim 14 wherein manufacturing said plurality of microcapsules includes using an emulsion process to create a polymeric shell around a conductive material core to form each said microcapsule. ### Claim 16 (depends on 14) The method as recited in claim 14 wherein manufacturing said plurality of microcapsules includes dispersing said plurality of microcapsules in said polymer resin. ### Claim 17 (depends on 16) The method as recited in claim 16 includes using said plurality of microcapsules as functional fillers to strengthen said polymer resin. ### Claim 18 (depends on 13) The method as recited in claim 13 wherein providing each said microcapsule containing said conductive material includes providing said conductive material with a selected one of carbon blacks and carbon nanotubes. ### Claim 19 (depends on 13) The method as recited in claim 13 wherein surrounding said security card with said polymeric resin containing said plurality of microcapsules includes coating said security card with said plurality of microcapsules and encapsulating said security card with said polymeric resin deposited over the microcapsules. ### Claim 20 (depends on 13) The method as recited in claim 13 wherein surrounding said security card with said polymeric resin containing said plurality of microcapsules includes dispersing said plurality of microcapsules in said polymeric resin and encapsulating said security card with said polymeric resin.