# US 8,751,710 B2 · Reconfigurable modular computing device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,751,710 B2 - Document ID: US8751710B2 - Status: Granted - Kind: B2 - Application number: 13/794,190 - Filed: 2013-03-11 - Published: 2013-11-14 - Granted: 2014-06-10 - Earliest claimed: 2012-05-08 - Assignees: Entegra Technologies, Inc. - Applicants: entegra technologies, inc. - Inventors: Douglas Lee Fowler - Web page: https://patentgrep.com/patent/US8751710B2 ## CPC - G06F 13/4027: {using bus bridges (G06F13/4022 takes precedence)} - G06F 1/1658: {related to the mounting of internal components, e.g. disc drive or any other functional module} - G06F 1/1684: {Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675} - G06F 13/10: Program control for peripheral devices (G06F13/14 - G06F13/42 take precedence) - G06F 13/4068: {Electrical coupling} - G06F 13/4081: {Live connection to bus, e.g. hot-plugging (current or voltage limitation during live insertion H02H9/004)} - G06F 13/4221: {being an input/output bus, e.g. ISA bus, EISA bus, PCI bus, SCSI bus} - H05K 3/32: electrically connecting electric components or wires to printed circuits - H05K 13/04: Mounting of components {, e.g. of leadless components} - Y10T 29/49128: Assembling formed circuit to base - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A configurable computing device comprising a housing, a printed circuit board disposed within the housing, a first microcontroller and a second microcontroller each coupled to the PCB, wherein the first microcontroller and the second microcontroller are in electrical signal communication with each other, a computer-on-module (COM) coupled to the PCB, wherein the COM is in electrical signal communication with the first microcontroller and the second microcontroller, and one or more peripheral modules coupled to the PCB, wherein, the peripheral modules are each in electrical signal communication with the first microcontroller and wherein, the peripheral modules are each in electrical signal communication with the COM via the second microcontroller. ## Claims ### Claim 1 A computing device configuring method comprising the steps of: providing a printed circuit board (PCB) comprising a first microcontroller and a second reconfigurable microcontroller, wherein the first microcontroller and the second reconfigurable microcontroller are in electrical signal communication with each other; installing a computer-on-module (COM) to the PCB, wherein the COM is electrically coupled to the PCB; interrogating the COM, thereby determining a COM profile, wherein the COM profile comprises at least one of a device configuration parameter or a device setting; installing one or more peripheral modules to the PCB, wherein the peripherals are each electrically coupled to the PCB; interrogating the peripheral modules, thereby determining a peripheral module profile, wherein the peripheral module profile comprises at least one of a device configuration parameter or a device setting; reconfiguring the second reconfigurable microcontroller, wherein, the second reconfigurable microcontroller is reconfigured dependent on the COM profile and the peripheral module profile and provides one or more electrical signal flow paths between the COM and the peripheral modules; and communicating an electrical signal between the COM and the peripheral modules via the second reconfigurable microcontroller. ### Claim 2 (depends on 1) The method of claim 1, wherein interrogating the COM is performed by the first microcontroller. ### Claim 3 (depends on 2) The method of claim 2, wherein interrogating the one or more peripheral modules is performed by the first microcontroller. ### Claim 4 (depends on 1) The method of claim 1, further comprising the steps of: removing the COM from the PCB; installing a second COM to the PCB; interrogating the second COM; reconfiguring the second reconfigurable microcontroller, wherein the second reconfigurable microcontroller provides one or more electrical signal flow path between the second COM and the one or more peripheral modules; and communicating an electrical signal between the second COM and the one or more peripheral modules via the second reconfigurable microcontroller. ### Claim 5 (depends on 1) The method of claim 1, further comprising the steps of: reconfiguring the peripheral modules coupled to the PCB; interrogating the reconfigured peripheral modules; installing the second reconfigurable microcontroller, wherein the second reconfigurable microcontroller provides one or more electrical signal flow path between the COM and the peripheral modules; and communicating an electrical signal between the COM and the peripheral modules via the second reconfigurable microcontroller. ### Claim 6 (depends on 1) The method of claim 1 further comprising the steps of: providing a docking station comprising one or more dock microcontrollers in electrical signal communication with one or more dock peripheral modules, wherein the peripheral modules are in electrical signal communication with the dock microcontrollers; interrogating the docking station; reconfiguring the second reconfigurable microcontroller, wherein the second reconfigurable microcontroller provides one or more electrical signal flow path between the COM and the dock peripheral modules; and communicating an electrical signal between the COM and the dock peripheral modules via the second reconfigurable microcontroller. ### Claim 7 (depends on 1) The method of claim 1 further comprising the steps of: providing a docking station comprising one or more dock microcontrollers in electrical signal communication with one or more dock peripheral modules, wherein the peripheral modules are in electrical signal communication with the dock microcontrollers; interrogating the docking station; reconfiguring the second reconfigurable microcontroller, wherein the second reconfigurable microcontroller provides one or more electrical signal flow path between the COM and the dock station COM; and communicating an electrical signal between the COM and the docking station COM via the second reconfigurable microcontroller. ### Claim 8 A mobile computing device comprising: a housing comprising a front case, a mid-frame, and a back case, wherein the front case and the back case are configured to combine and enclose the mid-frame; a printed circuit board (PCB) coupled to the mid-frame; a first microcontroller and a second reconfigurable microcontroller each coupled to the PCB, wherein the first microcontroller and the second reconfigurable microcontroller are in electrical signal communication with each other; a computer-on-module (COM) coupled to the PCB, wherein the COM is in electrical signal communication with the first microcontroller and the second reconfigurable microcontroller; and one or more peripheral modules coupled to the PCB, wherein the peripheral modules are each in electrical signal communication with the first microcontroller; wherein the peripheral modules are each in electrical signal communication with the COM via the second reconfigurable microcontroller; wherein the peripheral modules comprises a display, one or more input/output (I/O) ports, a dock module, and one or more user interfaces, wherein the second reconfigurable microcontroller is reconfigured based on a COM profile and a peripheral module profile and provides one or more electrical signal flow paths between the COM and the peripheral modules, wherein the COM profile comprises at least one of a device configuration parameter or a device setting, and wherein the peripheral module profile comprises at least one of a device configuration parameter or a device setting. ### Claim 9 (depends on 8) The mobile computing device of claim 8, further comprising one or more thermal provision.