# US 8,740,353 B2 · Liquid ejection head and flexible wiring substrate used in liquid ejection head

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- Number: US 8,740,353 B2
- Document ID: US8740353B2
- Status: Granted
- Kind: B2
- Application number: 13/284,626
- Filed: 2011-10-28
- Published: 2012-05-10
- Granted: 2014-06-03
- Earliest claimed: 2010-11-09
- Assignees: Canon Kabushiki Kaisha
- Applicants: Satoshi Kimura; Satoshi Oikawa; Kenji Kitabatake; Yukuo Yamaguchi
- Inventors: Satoshi Kimura; Satoshi Oikawa; Kenji Kitabatake; Yukuo Yamaguchi
- Web page: https://patentgrep.com/patent/US8740353B2

## CPC

- H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}
- B41J 2/1753: {Details of contacts on the cartridge, e.g. protection of contacts}
- B41J 2/17553: {Outer structure}
- H05K 2201/057: Shape retainable
- H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS

## Abstract

A flexible wiring substrate that is used in a liquid ejection head having an element substrate provided with energy generating elements for generating energy for ejecting liquid includes: a bending portion; a base member including resin; electrical wiring lines formed on the base member and electrically connected to the element substrate, the electrical wiring lines extending over a ridge of the bending portion; and a metal layer that is arranged on an area of the base member in which no electrical wiring lines are provided and that is not electrically connected to the element substrate, the metal layer extending over the ridge.

## Claims

### Claim 1

A flexible wiring substrate that is used in a liquid ejection head having an element substrate provided with energy generating elements for generating energy for ejecting liquid, the flexible wiring substrate comprising:
a bending portion;
a base member including resin and having a bonding portion adjacent the bending portion and bonded to a surface on which the element substrate is provided;
electrical wiring lines formed on the base member and electrically connected to the element substrate, the electrical wiring lines extending over a ridge of the bending portion; and
a metal layer that is provided on the base member and that is not electrically connected to the element substrate, the metal layer extending over the ridge; and
another metal layer that is provided on a reverse side of the bonding portion and that is not electrically connected to the element substrate, the other metal layer being not three-dimensionally bent.

### Claim 2 (depends on 1)

The flexible wiring substrate according to claim 1, wherein a plurality of the metal layers are provided along the ridge.

### Claim 3 (depends on 2)

The flexible wiring substrate according to claim 2, wherein the density of the metal layers on the area in which the metal layers are provided is equal to or greater than the density of the electrical wiring lines on the area, where the density thereof is least in value on the area in which the electrical wiring lines extending over the ridge are provided.

### Claim 4

A liquid ejection head comprising:
an element substrate provided with energy generating elements for generating energy for ejecting liquid;
a first surface on which the element substrate is provided;
a second surface; and
a flexible wiring substrate provided on the first surface and the second surface, the flexible wiring substrate including a bending portion bent between the first surface and the second surface,
wherein the flexible wiring substrate includes a base member including resin and having a bonding portion adjacent the bending portion and bonded to the first surface, electrical wiring lines formed on the base member and electrically connected to the element substrate, the electrical wiring lines extending over a ridge of the bending portion, a metal layer that is provided on the base member and that is not electrically connected to the element substrate, the metal layer extending over the ridge, and another metal layer that is provided on a reverse side of the bonding portion and that is not electrically connected to the element substrate, the other metal layer being not three-dimensionally bent.

### Claim 5 (depends on 4)

The liquid ejection head according to claim 4, wherein a plurality of the metal layers are provided along the ridge.

### Claim 6 (depends on 5)

The liquid ejection head according to claim 5, wherein the density of the metal layers on the area in which the metal layers are provided is equal to or greater than the density of the electrical wiring lines on the area where the density thereof is least in magnitude on the area in which the electrical wiring lines extending over the ridge are provided.

### Claim 7 (depends on 4)

The liquid ejection head according to claim 4, wherein the metal layer extends over the bonding portion.

### Claim 8 (depends on 7)

The liquid ejection head according to claim 7, wherein a portion of the metal layer extending over the bonding portion is terminated near the bending portion.

### Claim 9 (depends on 4)

The liquid ejection head according to claim 4, wherein the other metal layer provided near the element substrate extends along the ridge.