# US 8,740,044 B2 · Method for bonding heat-conducting substrate and metal layer

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- Number: US 8,740,044 B2
- Document ID: US8740044B2
- Status: Granted
- Kind: B2
- Application number: 13/786,480
- Filed: 2013-03-06
- Published: 2014-04-10
- Granted: 2014-06-03
- Earliest claimed: 2012-10-05
- Assignees: Subtron Technology Co., Ltd.
- Applicants: Chien-Ming Chen
- Inventors: Chien-Ming Chen
- Web page: https://patentgrep.com/patent/US8740044B2

## CPC

- B23K 20/002: {specially adapted for particular articles or work (B23K20/129 takes precedence)}
- B23K 20/14: Preventing or minimising gas access, or using protective gases or vacuum during welding (formed by material interposed between workpieces B23K20/18)
- B23K 31/02: relating to soldering or welding
- B32B 37/04: characterised by the partial melting of at least one layer
- B32B 37/12: characterised by using adhesives
- B32B 2311/00: Metals, their alloys or their compounds
- Y10T 156/10: Methods of surface bonding and/or assembly therefor
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method for bonding a heat-conducting substrate and a metal layer is provided. A heat-conducting substrate, a first metal layer and a preformed layer are provided. The preformed layer is between the heat-conducting substrate and the first metal layer. The preformed layer is a second metal layer or a metal oxide layer. A heating process is performed to the preformed layer in an oxygen-free atmosphere to convert the preformed layer to a bonding layer for bonding the heat-conducting substrate and the first metal layer. The temperature of the heating process is less than or equal to 300° C.

## Claims

### Claim 1

A method for bonding a heat-conducting substrate and a metal layer, comprising:
providing a heat-conducting substrate, a metal layer and a preformed layer, wherein the preformed layer is located between the heat-conducting substrate and the metal layer, and the preformed layer is an adhesive layer containing a plurality of metal oxide particles; and
performing a heating process to the preformed layer in an oxygen-free atmosphere, to convert the preformed layer to a bonding layer to bond the heat-conducting substrate and the metal layer, wherein the temperature of the heating process is less than or equal to 300° C.

### Claim 2 (depends on 1)

The method for bonding a heat-conducting substrate and a metal layer of claim 1, wherein after the preformed layer is formed on the heat-conducting layer or the metal layer, the heat-conducting layer and the metal layer are stacked to dispose the preformed layer between the heat-conducting layer and the metal layer.

### Claim 3 (depends on 1)

The method for bonding a heat-conducting substrate and a metal layer of claim 1, wherein the materials of the metal oxide particles comprise silver oxide or copper oxide.

### Claim 4 (depends on 1)

The method for bonding a heat-conducting substrate and a metal layer of claim 1, wherein the formation of the preformed layer comprises coating.

### Claim 5 (depends on 1)

The method for bonding a heat-conducting substrate and a metal layer of claim 1, wherein materials of the heat-conducting substrate comprise a metal or an alloy.

### Claim 6 (depends on 1)

The method for bonding a heat-conducting substrate and a metal layer of claim 1, wherein the heat-conducting substrate comprises a ceramic substrate having a metal surface, and the metal layer is bonded to the metal surface via the bonding layer.

### Claim 7 (depends on 1)

The method for bonding a heat-conducting substrate and a metal layer of claim 1, wherein the oxygen-free atmosphere comprises an inert gas atmosphere or a reducing gas atmosphere.

### Claim 8 (depends on 7)

The method for bonding a heat-conducting substrate and a metal layer of claim 7, wherein the inert gas comprises nitrogen or argon.

### Claim 9 (depends on 7)

The method for bonding a heat-conducting substrate and a metal layer of claim 7, wherein the reducing gas comprises hydrogen or hydrogen-containing gas.