# US 8,740,040 B2 · Solder injection head

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- Number: US 8,740,040 B2
- Document ID: US8740040B2
- Status: Granted
- Kind: B2
- Application number: 13/664,035
- Filed: 2012-10-30
- Published: 2014-02-06
- Granted: 2014-06-03
- Earliest claimed: 2012-07-31
- Assignees: Samsung Electro-Mechanics Co., Ltd.
- Applicants: Samsung Electro-Mechanics Co., Ltd.
- Inventors: Jin Won Choi; Yon Ho You; Ki Ju Lee
- Web page: https://patentgrep.com/patent/US8740040B2

## CPC

- B23K 3/0623: {for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM

## Abstract

Disclosed herein a solder injection head including: a bump material storing part having a bump material stored therein; a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside; a heating part formed at at least one side of the discharging part and heating the bump material passing through the discharging part; and a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.

## Claims

### Claim 1

A solder injection head comprising:
a bump material storing part having a bump material stored therein;
a discharging part having one side connected to the bump material storing part and discharging the bump material to an outside of the solder injection head;
a heating part formed at at least one lateral side of the discharging part and being separate from the bump material storing part to heat and melt only the bump material which is to be discharged to the outside excluding the bump material stored in the bump material storing part; and
a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate.

### Claim 2 (depends on 1)

The solder injection head as set forth in claim 1, wherein the press-fitting part moves vertically to inject the discharged bump material onto the substrate.

### Claim 3 (depends on 1)

The solder injection head as set forth in claim 1, wherein the press-fitting part is made of porous silicon rubber or ceramic.

### Claim 4 (depends on 1)

The solder injection head as set forth in claim 1, further comprising a pressure bar inserted into the bump material storing part and pushing the bump material to the discharging part.

### Claim 5 (depends on 1)

The solder injection head as set forth in claim 1, further comprising a flux storing part having a flux stored therein.

### Claim 6 (depends on 5)

The solder injection head as set forth in claim 5, wherein the press-fitting part is formed to be partially inserted into the flux storing part.

### Claim 7 (depends on 6)

The solder injection head as set forth in claim 6, wherein the press-fitting part discharges the flux to the outside.

### Claim 8 (depends on 1)

The solder injection head as set forth in claim 1, wherein the bump material storing part stores both of the bump material and a flux.

### Claim 9 (depends on 1)

The solder injection head as set forth in claim 1, further comprising a controlling part formed between the bump material storing part and the discharging part and controlling an amount of bump material introduced into the discharging part.

### Claim 10 (depends on 1)

The solder injection head as set forth in claim 1, wherein the bump material is a solder ball or a solder paste.

### Claim 11

A solder injection head comprising:
a bump material storing part having a bump material stored therein;
a discharging part having one side connected to the bump material storing part and discharging the bump material to the outside;
a heating part formed at least one side of the discharging part and heating the bump material passing through the discharging part;
a press-fitting part press-fitting the bump material discharged to the outside and injecting the bump material onto a substrate; and
a flux storing part having a flux stored therein;
wherein the press-fitting part is formed to be partially inserted into the flux storing part.

### Claim 12 (depends on 11)

The solder injection head as set forth in claim 11, wherein the press-fitting part discharges the flux to the outside.