# US 8,739,805 B2 · Confinement of foam delivered by a proximity head

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- Number: US 8,739,805 B2
- Document ID: US8739805B2
- Status: Granted
- Kind: B2
- Application number: 12/324,316
- Filed: 2008-11-26
- Published: 2010-05-27
- Granted: 2014-06-03
- Earliest claimed: 2008-11-26
- Assignees: Lam Research Corporation
- Applicants: Arnold Kholodenko; Cheng-Yu (Sean) Lin; Leon Ginzburg; Mark Mandelboym; Gregory A. Tomasch; Anwar Husain
- Inventors: Arnold Kholodenko; Cheng-Yu (Sean) Lin; Leon Ginzburg; Mark Mandelboym; Gregory A. Tomasch; Anwar Husain
- Web page: https://patentgrep.com/patent/US8739805B2

## CPC

- H10P 72/0411: {for wet cleaning or washing}
- B08B 3/003: {Cleaning involving contact with foam}
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 72/0416: {with the semiconductor substrates being dipped in baths or vessels}
- H10P 72/0462: {characterised by the construction of the processing chambers, e.g. modular processing chambers}
- H10P 72/3314: {Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers}
- C11D 2111/22: Electronic devices, e.g. PCBs or semiconductors
- C11D 2111/42: Application of foam or a temporary coating on the surface to be cleaned
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- C11D: DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL

## Abstract

In an example embodiment, a linear wet system includes a carrier and a proximity head in a chamber. The proximity head includes three sections in a linear arrangement. The first section suctions liquid from the upper surface of a semiconductor wafer as the wafer is transported by the carrier under the proximity head. The second section is configured to cause a film (or meniscus) of cleaning foam which is a non-Newtonian fluid to flow onto the upper surface of the wafer. The third section is configured to cause a film of rinsing fluid to flow onto the upper surface of the wafer as the wafer is carried under the proximity head. The third section is defined partially around the second section and up to the first section, so that the third section and the first section create a confinement of the cleaning foam with respect to the chamber.

## Claims

### Claim 1

An apparatus for processing a substrate, comprising:
a carrier for the substrate that transports the substrate through a chamber; and
a head, further including
a first section that suctions liquid from the upper surface of the substrate as the substrate moves under the head,
a second section, contiguous to the first section, that is configured to flow a film of cleaning foam onto the upper surface of the substrate as the substrate proceeds under the head, wherein the second section includes one or more input channels for delivering the film of cleaning foam and one or more output channels for removing the film of cleaning foam and wherein a group of the input channels are located below a horizontal triangular reservoir fed by a main passage above an intersection of the other two sides of the triangular reservoir; and
a third section, contiguous to the second section, that is configured to flow a film of rinsing fluid onto the upper surface of the substrate as the substrate is carried under the head, wherein the third section is defined partially around the second section and up to the first section and wherein the third section and the first section create a confinement of the cleaning foam with respect to the chamber.

### Claim 2 (depends on 1)

An apparatus as in claim 1, wherein the input and output channels are configured to cause the film of cleaning foam to flow in a radial pattern across the upper surface of the substrate.

### Claim 3 (depends on 1)

An apparatus as in claim 1, wherein the cleaning foam is a non-Newtonian fluid with a viscosity in a range of about 200-2000 centipoise (cP).

### Claim 4 (depends on 1)

An apparatus as in claim 1, wherein the foam comprises a liquid, a gas, and a surfactant.

### Claim 5 (depends on 1)

An apparatus as in claim 1, wherein the substrate is a semiconductor wafer.

### Claim 6 (depends on 1)

An apparatus as in claim 1, further comprising an additional section, contiguous to the second section included in the head, that is configured to cause a film of cleaning foam to flow onto the upper surface of the substrate as the substrate proceeds under the head, wherein the cleaning foam has a composition which differs from the cleaning foam delivered by the second section.

### Claim 7 (depends on 6)

An apparatus as in claim 6, wherein the input and output channels of both the second section and the additional section are configured to cause the film of cleaning foam to flow in a sequence of radial patterns across the upper surface of the substrate.

### Claim 8 (depends on 1)

An apparatus as in claim 1, wherein at least one of the sections includes a plurality of down-feeds that are sized, numbered, and located to provide uniform flow with respect to a bore in the section.