# US 8,739,406 B2 · Vapor condenser with three-dimensional folded structure

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- Number: US 8,739,406 B2
- Document ID: US8739406B2
- Status: Granted
- Kind: B2
- Application number: 13/788,722
- Filed: 2013-03-07
- Published: 2014-03-13
- Granted: 2014-06-03
- Earliest claimed: 2012-09-13
- Assignees: International Business Machines Corporation
- Applicants: International Business Machines Corporation
- Inventors: Levi A. Campbell; Richard C. Chu; Milnes P. David; Michael J. Ellsworth, Jr.; Madhusudan K. Iyengar; Roger R. Schmidt; Robert E. Simons
- Web page: https://patentgrep.com/patent/US8739406B2

## CPC

- H05K 7/20309: {Evaporators}
- B23P 15/26: heat exchangers {or the like (making heat exchangers by methods covered by other subclasses B21D53/02)}
- F28F 3/046: {the deformations being linear, e.g. corrugations}
- F28F 3/12: Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)}
- F28F 9/02: Header boxes; End plates
- H05K 7/203: {by immersion}
- H05K 7/20809: {within server blades for removing heat from heat source}
- F28D 9/0025: {the conduits being formed by zig-zag bend plates}
- F28D 15/02: in which the medium condenses and evaporates, e.g. heat pipes {(heat pipes used in solar heat collectors F24S10/95; in radiators F28D1/0226; in nuclear reactors G21C15/257)}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/4935: Heat exchanger or boiler making
- Y10T 29/49359: Cooling apparatus making, e.g., air conditioner, refrigerator
- Y10T 29/49396: Condenser, evaporator or vaporizer making
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B23P: METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS (arrangements for copying or controlling B23Q)
- F28F: DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION (water and air traps, air venting F16)
- F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method of fabricating a vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.

## Claims

### Claim 1

A method of fabricating a cooling apparatus comprising:
fabricating a vapor condenser, wherein fabricating the vapor condenser comprises:
obtaining a three-dimensional folded structure defining, at least in part, a first set of coolant-carrying channels and a second set of vapor condensing channels of the vapor condenser, the first set of coolant-carrying channels being interleaved with and extending parallel to the second set of vapor condensing channels, wherein the three-dimensional folded structure comprises a thermally conductive sheet with multiple folds therein, wherein one side of the thermally conductive sheet comprises a vapor condensing surface, and an opposite side of the thermally conductive sheet comprises a coolant-cooled surface, at least a portion of the coolant-cooled surface at least partially defining the first set of coolant-carrying channels;
disposing a first end manifold at a first end of the three-dimensional folded structure, and a second end manifold at a second, opposite end of the three-dimensional manifold structure, the first end manifold and the second end manifold comprising openings in fluid communication with the first set of coolant-carrying channels of the three-dimensional folded structure to facilitate flow of coolant through the first set of coolant-carrying channels; and
coupling a plate to the coolant-cooled surface side of the thermally conductive sheet with the multiple folds, wherein the plate and the thermally conductive sheet with the multiple folds therein define the first set of coolant-carrying channels of the three-dimensional folded structure.

### Claim 2 (depends on 1)

The method of claim 1, wherein the second set of vapor condensing channels of the three-dimensional folded structure of the vapor condenser are open channels which allow fluid vapor to rise into the second set of vapor condensing channels and condensed fluid to drop from the second set of vapor condensing channels.

### Claim 3 (depends on 1)

The method of claim 1, further comprising providing a housing configured to facilitate forming a compartment, and a fluid disposed within the compartment, and disposing the vapor condenser such that the vapor condensing surface thereof is disposed within the compartment in an upper portion of the compartment, the second set of vapor condensing channels increasing a condensation surface area of the vapor condensing surface, and thereby facilitating cooling of fluid vapor rising to the upper portion of the compartment.

### Claim 4 (depends on 3)

The method of claim 3, wherein providing the housing comprises providing the housing to at least partially surround and form a compartment about at least one electronic component to be cooled, and wherein the fluid comprises a dielectric fluid.