# US 8,739,399 B2 · Making electronic storage system having code circuit

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,739,399 B2
- Document ID: US8739399B2
- Status: Granted
- Kind: B2
- Application number: 13/455,377
- Filed: 2012-04-25
- Published: 2013-10-31
- Granted: 2014-06-03
- Earliest claimed: 2012-04-25
- Assignees: Eastman Kodak Company
- Applicants: Ronald Steven Cok; Christopher Lyons
- Inventors: Ronald Steven Cok; Christopher Lyons
- Web page: https://patentgrep.com/patent/US8739399B2

## CPC

- H05K 1/029: {having a programmable lay-out, i.e. adapted for choosing between a few possibilities}
- H05K 3/125: {by ink-jet printing}
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/641: {Adaptable interconnections, e.g. fuses or antifuses}
- H05K 2201/10159: Memory
- H05K 2203/173: Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
- H05K 2203/175: Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
- H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 70/654: Top-view layouts
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/49004: including measuring or testing of device or component part
- Y10T 29/49117: Conductor or circuit manufacturing
- Y10T 29/49126: Assembling bases
- Y10T 29/49128: Assembling formed circuit to base
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T 29/49155: Manufacturing circuit on or in base
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method of making an electronic storage system includes receiving a substrate and a circuit template. A transceiver including a transceiver substrate separate from the substrate is disposed over the substrate. The transceiver includes an output electrical-connection pad, and a plurality of input electrical-connection pads. A circuit template is disposed over the substrate so that at least one of the conductors of the circuit template is electrically connected to the output pad and at least one of the conductors of the circuit template is electrically connected to each of the input pads. At least one electrically-conductive strap is printed over the substrate so that each strap electrically connects the output pad to the at least one of the input pads through at least two of the conductors of the circuit template.

## Claims

### Claim 1

Method of making an electronic storage system, the method comprising:
receiving a substrate;
receiving a transceiver including a transceiver substrate separate from the substrate, an output electrical-connection pad, and a plurality of input electrical-connection pads;
receiving a circuit template separate from the substrate and from the transceiver, the circuit template including patterned conductive material forming a plurality of conductors;
a transceiver-disposing step of disposing the transceiver over the substrate;
a template-disposing step of disposing the circuit template over the substrate so that at least one of the plurality of conductors of the circuit template is electrically connected to the output electrical-connection pad and at least one of the plurality of conductors of the circuit template is electrically connected to each of the plurality of input electrical-connection pads; and
printing at least one electrically-conductive strap on the substrate or circuit template so that each strap electrically connects the output electrical-connection pad to the at least one of the plurality of input electrical-connection pads through at least two of the plurality of conductors of the circuit template and leaving at least one open site between conductors; and
wherein at least one of the plurality of conductors has an environmentally modifiable electrical state.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the transceiver further includes a plurality of output electrical-connection pads, at least one of the plurality of conductors of the circuit template is electrically connected to each of the plurality of output electrical-connection pads, and the at least one electrically-conductive strap is printed so that each strap electrically connects at least one of the plurality of output electrical-connection pads to at least one of the plurality of input electrical-connection pads.

### Claim 3 (depends on 1)

The method according to claim 1, wherein:
the transceiver further includes an interface, an excitation circuit connected to the output electrical-connection pad, and a detection circuit connected to at least one of the plurality of input electrical-connection pads;
and the method further includes:
receiving a downlink signal using the interface;
in response to the downlink signal, providing an excitation signal to the output electrical-connection pad using the excitation circuit;
detecting respective electrical state(s) of the at least one of the plurality of input electrical-connection pad(s) in response to the excitation signal using the detection circuit; and
transmitting an uplink signal representing the respective electrical state(s) of at least some of the plurality of input electrical-connection pads using the interface.

### Claim 4 (depends on 3)

The method according to claim 3, wherein:
the excitation signal is a query signal provided on the output electrical-connection pad, the query signal having a first voltage or current at a first point in time and a second, different voltage or current at a second, later point in time; and
the detection circuit is adapted to measure a voltage or current of at least one of the plurality of input electrical-connection pads electrically connected through a code circuit to the output pad to provide the respective electrical state(s) of the at least one of the plurality of input electrical-connection pads.

### Claim 5 (depends on 3)

The method according to claim 3, wherein the detection circuit includes an A/D converter to measure a voltage of the at least one of the plurality of input electrical-connection pads.

### Claim 6 (depends on 3)

The method according to claim 3, wherein the transceiver includes read circuitry having a plurality of voltage thresholds so that a voltage of the at least one of the plurality of input electrical-connection pads corresponds to more than one bit of information.

### Claim 7 (depends on 3)

The method according to claim 3, wherein the respective electrical state(s) of the at least one of the plurality of input electrical-connection pads correspond to a plurality of bits of information in the uplink signal.

### Claim 8 (depends on 1)

The method according to claim 1, wherein the template-disposing step is performed before the transceiver-disposing step, and the transceiver-disposing step includes disposing the transceiver pad-down over the template disposed over the substrate.

### Claim 9 (depends on 1)

The method according to claim 1, wherein the template-disposing step includes adhering the circuit template to the substrate.

### Claim 10 (depends on 1)

The method according to claim 1, wherein the circuit template is formed from conductive foil.

### Claim 11 (depends on 1)

The method according to claim 1, wherein the plurality of conductors are composed of conductive inks.

### Claim 12 (depends on 1)

The method according to claim 1, wherein the plurality of conductors include conductive particles and non-conductive binder particles.

### Claim 13 (depends on 1)

The method according to claim 1, wherein the transceiver is an RFID transceiver, further including disposing an antenna disposed over the substrate connected to the transceiver.