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US 8,717,108 B2Granted
Resonator device
AssigneeThe Boeing Company
InventorsPaul G. Rosadiuk, Walid M. Al-Bondak, Bruce A. Igawa, Bryce Smith
Life of this patent
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Abstract
A coaxial resonator device includes a substrate including a chip-and-wire circuit. A resonator is coupled to the substrate using a conductive epoxy. A system includes a resonator device. The resonator device includes a housing having one or more connectors, a resonator coupled to the housing a conductive epoxy, and a chip-and-wire circuit connecting the resonator to the one or more connectors.
Claims20
A device comprising:
- a substrate including a chip-and-wire circuit;
- and
- a coaxial resonator coupled to the substrate using a conductive epoxy,
- wherein a cavity formed by the substrate is partially filled with potting material,
- wherein the chip-and-wire circuit is covered by the potting material,
- wherein at least a portion of the coaxial resonator is not covered by the potting material,
- wherein the coaxial resonator has been tuned to a particular operating frequency by removing a portion of the coaxial resonator to reduce a length of the coaxial resonator, and
- wherein the coaxial resonator and the chip-and-wire circuit are hermetically sealed within the cavity formed by the substrate after the cavity formed by the substrate is partially filled with the potting material.
5 more elements
A method comprising:
- coupling a coaxial resonator to an integrated circuit assembly of a chip-and-wire circuit;
- tuning the coaxial resonator to a particular operating frequency by removing a first portion of the coaxial resonator to reduce a length of the coaxial resonator;
- coupling the coaxial resonator to a housing;
- partially filling the housing with potting material, wherein the chip-and-wire circuit is covered by the potting material and wherein at least a portion of the coaxial resonator is not covered by the potting material;
- and
- hermetically sealing the integrated circuit assembly and the coaxial resonator within the housing after the housing is partially filled with the potting material.
3 more elements
A system comprising:
- a resonator device including:
- a housing having one or more connectors;
- a coaxial resonator coupled to the housing a conductive epoxy;
- and
- a chip-and-wire circuit connecting the coaxial resonator to the one or more connectors,
- wherein the housing is partially filled with potting material,
- wherein the chip-and-wire circuit is covered by the potting material,
- wherein at least a portion of the coaxial resonator is not covered by the potting material,
- wherein the coaxial resonator has been tuned to a particular operating frequency by removing a portion of the coaxial resonator to reduce a length of the coaxial resonator, and
- wherein the coaxial resonator and the chip-and-wire circuit are hermetically sealed within the housing after the housing is partially filled with potting material;
- and
- at least one subsystem coupled to the one or more connectors.
9 more elements
Dependencies are inferred from the claim text.