US 8,714,084 B2Granted

Screen printing apparatus and screen printing method

AssigneePanasonic Corporation

InventorsSeiko Abe, Tetsuya Tanaka

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Abstract

The present invention provides a screen printing apparatus and screen printing method which, in screen printing that is to be performed on the upper surface of a circuit board, and the bottom surfaces of recess openings in the upper surface, can efficiently perform a printing work while ensuring an excellent printing quality. In a screen printing apparatus which prints a paste for bonding an electronic component on an upper surface and a bottom-surface of a recess, a printing apparatus 2(1) and a printing apparatus 2(2) which sequentially 10 print the paste in two steps on the circuit board are placed in series. The printing apparatus 2(1) on the upstream side includes a bottom-surface printing mask which is provided in correspondence with the bottom surface of the recess, and a closed squeegee mechanism 36A which butts against and slides over an upper surface of the bottom-surface printing mask to 15 pressurize and supply the paste. The printing apparatus 2(2) on the downstream side includes an upper-surface printing mask which is provided in correspondence with the upper surface and an opened squeegee mechanism 36B which butts against and slides over an upper surface of the upper-surface printing mask to fill the paste into pattern holes.

Claims6

Dependent claims

A screen printing apparatus which is to be connected to an upstream side of an electronic component mounting apparatus for mounting an electronic component onto a circuit board, to constitute an electronic component mounting line, and which prints a paste for bonding an electronic component on upper-surface printing areas which are set on an upper face of the circuit board, and in which upper-surface electrodes are formed, and bottom-surface printing areas which are set on bottom surfaces of recesses opening in the upper surface, and in which bottom-surface electrodes are formed,

the screen printing apparatus comprising:
an upstream screen printing portion and downstream screen printing portion which are placed in series along a circuit board transporting direction in the electronic component mounting line, and which sequentially print the paste in two steps on the circuit board;
and
a circuit board transferring portion which transfers the circuit board from the upstream screen printing portion to the downstream screen printing portion,
wherein the upstream screen printing portion includes:
a bottom-surface printing mask having fitting portions which are disposed in correspondence with the bottom-surface printing areas, and which are to be fitted into the recesses, and pattern holes which are formed in the fitting portions in correspondence with the bottom-surface electrodes;
and
a closed squeegee mechanism abutting against and sliding over an upper surface of the bottom-surface printing mask to pressurize the paste that is retained inside, to supply the paste into the fitting portions, and
wherein the downstream screen printing portion includes:
an upper-surface printing mask having pattern holes which are disposed in correspondence with the upper-surface printing areas, and which are formed in correspondence with the upper-surface electrodes;
and
a squeegee abutting against and sliding over an upper surface of the upper-surface printing mask to fill the paste into the pattern holes.

9 more elements

A screen printing method in which, on upper-surface printing areas which are set on an upper face of a circuit board, and in which upper-surface electrodes are formed, and bottom-surface printing areas which are set on bottom surfaces of recesses opening in the upper surface, and in which bottom-surface electrodes are formed, the screen printing method comprising:

sequentially printing a paste for bonding an electronic component in two steps by an upstream screen printing portion and downstream screen printing portion which are placed in series along a circuit board transporting direction in an electronic component mounting line, wherein,
in a bottom-surface printing step which is aimed to the bottom-surface printing areas, and which is performed by the upstream screen printing portion, positioning the circuit board to a bottom-surface printing mask having fitting portions which are disposed in correspondence with the bottom-surface printing areas, and which are to be fitted into the recesses, and pattern holes which are formed in the fitting portions in correspondence with the bottom-surface electrodes, and causing a closed squeegee mechanism to butt against and slide over an upper surface of the bottom-surface printing mask, whereby pressurizing and supplying the paste that is retained inside the closed squeegee into the fitting portions, and,
in an upper-surface printing step which is aimed to the upper-surface printing areas, and which is performed by the downstream screen printing portion, positioning the circuit board to an upper-surface printing mask haying pattern holes which are disposed in correspondence with the upper-surface printing areas, and which are formed in correspondence with the upper-surface electrodes, causing a squeegee to butt against and slide over an upper surface of the upper-surface printing mask, whereby filling the paste into the pattern holes.

Dependencies are inferred from the claim text.

Facts

Application: 13/141,817Filed 14 Apr 2010
Priority: JP 2009-10598024 Apr 2009
Published: US 2011/0259217 A127 Oct 2011
Granted: 6 May 2014
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

B05C 17/04
Rollers ; Hand tools comprising coating rollers or coating endless belts: stencil rollers
B41F 15/0818
With flat screens: with a stationary screen and a moving squeegee
H05K 3/1225
By screen printing or stencil printing: screens or stencils; Holders therefor
H05K 1/183
Associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]: associated with components mounted in…