Method and apparatus for wireless transmission of diagnostic information
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsu-Shui Liu, Jiun-Rong Pai, Yeh-Chieh Wang
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Abstract
The present disclosure provides a system for fabricating a semiconductor device. The system includes a semiconductor fabrication tool. The semiconductor fabrication tool has an integrated inter interface that measures a first process parameter of the fabrication tool. The system also includes a wireless sensor. The wireless sensor is detachably coupled to the fabrication tool. The wireless sensor measures a second process parameter of the fabrication tool. The second process parameter is different from the first process parameter.
Claims15
A system for fabricating a semiconductor device, comprising:
- a semiconductor fabrication tool having an integrated interface that measures a first process parameter of the fabrication tool, wherein the integrated interface is a wired I/O interface;
- a wireless sensor detachably coupled to the fabrication tool, wherein the sensor measures a second process parameter of the fabrication tool, the second process parameter being different from the first process parameter;
- and
- a diagnostic tool that is wirelessly coupled to the wireless sensor,
- wherein the diagnostic tool receives measured values of the first and second process parameters,
- wherein the diagnostic tool includes a centralized server that performs an analysis on the measured values of the first and second process parameters and generates a control signal in response to the analysis, the control signal instructing the semiconductor fabrication tool to adjust a fabrication operation,
- wherein the semiconductor fabrication tool includes a chemical mechanical polishing tool, and
- wherein the second process parameter includes a water resistance parameter.
The system of 1, wherein the wireless sensor wirelessly transmits the measured values of the first and second process parameters, and wherein the diagnostic tool further includes:
- a further wireless sensor that receives the measured values of the first and second process parameters, wherein the centralized server retrieves the measured values of the first and second process parameters from the further wireless sensor.
A system for fabricating a semiconductor device, comprising:
- a semiconductor fabrication tool having an integrated interface and a sensor,
- wherein the semiconductor fabrication tool includes a chemical mechanical polishing tool,
- wherein the integrated interface gathers a first subset of fabrication data from the fabrication tool,
- wherein the sensor receives the first subset of the fabrication data from the integrated interface and gathers a second subset of the fabrication data from the fabrication tool, and
- wherein the second subset of fabrication data includes water resistance data;
- a first wireless transceiver that is coupled to the sensor, the first wireless transceiver transmitting wireless signals that include the first and second subsets of the fabrication data;
- a second wireless transceiver that wirelessly communicates with the first wireless transceiver and that receives the first and second subsets of fabrication data from the first transceiver;
- and
- a diagnostic device that is coupled to the second transceiver and that:
- receives the first and second subsets of fabrication data;
- performs analysis in response to the first and second subsets of fabrication data;
- and
- generates a control signal instructing the semiconductor fabrication tool to adjust a fabrication operation in response to the analysis.
A method of fabricating a semiconductor device, comprising:
- measuring a first semiconductor fabrication process parameter of a semiconductor fabrication tool using a wired integrated interface of the fabrication tool;
- measuring a second semiconductor fabrication process parameter of the fabrication tool using a wireless sensor that is detachably coupled to the fabrication tool, the second semiconductor fabrication process parameter being different from the first semiconductor fabrication process parameter,
- wherein the semiconductor fabrication tool includes a chemical mechanical polishing tool, and
- wherein one of the first semiconductor fabrication process parameter and the second process parameter includes a water resistance parameter;
- receiving the first semiconductor fabrication process parameter at the wireless sensor via the integrated interface;
- and
- adjusting an operation of the fabrication tool.
Dependencies are inferred from the claim text.