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US 8,711,573 B2Granted
Using interrupted through-silicon-vias in integrated circuits adapted for stacking
AssigneeMosaid Technologies Incorporated
InventorPeter Gillingham
Life of this patent
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Abstract
In an integrated circuit (IC) adapted for use in a stack of interconnected ICs, interrupted through-silicon-vias (TSVs) are provided in addition to uninterrupted TSVs. The interrupted TSVs provide signal paths other than common parallel paths between the ICs of the stack. This permits IC identification schemes and other functionalities to be implemented using TSVs, without requiring angular rotation of alternate ICs of the stack.
Claims12
A method of selecting a semiconductor device in a stack of semiconductor devices, comprising:
- providing logic levels to a first plurality of serial through silicon via (TSV) inputs on a first device in a stack;
- within the first device, receiving the logic levels on the first plurality of TSV inputs, scrambling the received logic levels, and providing the scrambled received logic levels to a first plurality of TSV outputs connected to a first plurality of serial TSV inputs on a second device in the stack;
- within the second device, receiving the logic levels on the first plurality of TSV inputs, scrambling the received logic levels, and providing the scrambled received logic levels to a first plurality of TSV outputs connected to a first plurality of serial TSV inputs on a third device in the stack;
- within the third device, receiving the logic levels on the first plurality of TSV inputs;
- and
- using the received logic levels in each of the first, second, and third devices to select one of the first, second, or third devices.
3 more elements
Dependencies are inferred from the claim text.