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US 8,711,348 B2Granted
Method of inspecting wafer
AssigneeSamsung Electronics Co., Ltd.
InventorsHwan-seok Jang, Jang-man Ko, Jun-seog Seong, Ho-bong Shin, Kil-su Lee, Chang-hun Lee
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Abstract
Wafer inspection method to perform wafer inspection based on photo map information. The wafer inspection method may include: detecting a sample center location on a wafer; compensating the detected sample center location to a compensated center location based on photo map information; and detecting defective dies included in the wafer based on the compensated center location.
Claims11
A wafer inspection method comprising:
- detecting a sample center location on a wafer;
- compensating the detected sample center location to a compensated center location based on photo map information, the compensating of the detected sample center location including compensating the detected sample center location to correspond to a predetermined center location based on the photo map information, wherein the photomap information includes in die size DS and die pitch DP denoted in X and Y coordinates such that an offset from an original point on the wafer is determined;
- and
- detecting defective dies included on the wafer based on the compensated center location.
1 more element
A wafer inspection method comprising:
- compensating a sample center location of a wafer based on photo map information, the compensating of the detected sample center location including compensating the detected sample center location to correspond to a predetermined center location based on the photo map information, wherein the photo map information includes a die size DS and a die pitch DP denoted in X and Y coordinates such that an offset from an original point on the wafer is determined;
- and
- detecting defective dies included on the wafer based on the compensated center location.
Dependencies are inferred from the claim text.